Moongon Jung

780 total citations
23 papers, 466 citations indexed

About

Moongon Jung is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Computer Networks and Communications. According to data from OpenAlex, Moongon Jung has authored 23 papers receiving a total of 466 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 4 papers in Computer Networks and Communications. Recurrent topics in Moongon Jung's work include 3D IC and TSV technologies (21 papers), Advancements in Photolithography Techniques (9 papers) and Electronic Packaging and Soldering Technologies (6 papers). Moongon Jung is often cited by papers focused on 3D IC and TSV technologies (21 papers), Advancements in Photolithography Techniques (9 papers) and Electronic Packaging and Soldering Technologies (6 papers). Moongon Jung collaborates with scholars based in United States, Cambodia and Thailand. Moongon Jung's co-authors include Sung Kyu Lim, David Z. Pan, Joydeep Mitra, Taigon Song, Shreepad Panth, Yarui Peng, Suresh K. Sitaraman, Liu Xi, Azad Naeemi and Yang Wan and has published in prestigious journals such as Communications of the ACM, IEEE Transactions on Electron Devices and IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

In The Last Decade

Moongon Jung

23 papers receiving 447 citations

Peers

Countries citing papers authored by Moongon Jung

Since Specialization

Citations

This map shows the geographic impact of Moongon Jung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Moongon Jung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Moongon Jung more than expected).

Fields of papers citing papers by Moongon Jung

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Moongon Jung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Moongon Jung. The network helps show where Moongon Jung may publish in the future.

Co-authorship network of co-authors of Moongon Jung

This figure shows the co-authorship network connecting the top 25 collaborators of Moongon Jung. A scholar is included among the top collaborators of Moongon Jung based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Moongon Jung. Moongon Jung is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Design Methodologies for Low-Power 3-D ICs With Advanced Tier Partitioning 2017 ·IEEE Transactions on Very Large Scale Integration (VLSI) Systems ·Moongon Jung, Taigon Song, Yarui Peng, Sung Kyu Lim	9
2	3D IC power benefit study under practical design considerations 2015 ·Taigon Song, Moongon Jung, Yang Wan, Yarui Peng, Sung Kyu Lim	2
3	Thermal impact study of block folding and face-to-face bonding in 3D IC 2015 ·Yarui Peng, Moongon Jung, Taigon Song, Yang Wan, Sung Kyu Lim	4
4	Evaluating Chip-Level Impact of Cu/Low-<inline-formula> <tex-math notation="LaTeX">$\kappa $ </tex-math></inline-formula> Performance Degradation on Circuit Performance at Future Technology Nodes 2015 ·IEEE Transactions on Electron Devices ·(unknown), Moongon Jung, Shreepad Panth, Sung Kyu Lim, Azad Naeemi	16
5	Fine-Grained 3-D IC Partitioning Study With a Multicore Processor 2015 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·Moongon Jung, Taigon Song, Yarui Peng, Sung Kyu Lim	4
6	TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC 2014 ·Communications of the ACM ·Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim	48
7	On Enhancing Power Benefits in 3D ICs 2014 ·Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim	25
8	Impact of size effects in local interconnects for future technology nodes: A study based on full-chip layouts 2014 ·(unknown), Moongon Jung, Shreepad Panth, Sung Kyu Lim, Azad Naeemi	20
9	Through-silicon-via material property variation impact on full-chip reliability and timing 2014 ·Moongon Jung, David Z. Pan, Sung Kyu Lim	4
10	Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs 2013 ·Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, Sung Kyu Lim	5
11	Novel crack sensor for TSV-based 3D integrated circuits: Design and deployment perspectives 2013 ·Chun Zhang, Moongon Jung, Sung Kyu Lim, Yiyu Shi	2
12	How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core 2013 ·Moongon Jung, Taigon Song, Yang Wan, Young‐Joon Lee, Debabrata Mohapatra, Hong Wang, G. Taylor, (unknown), V. Pitchumani, (unknown), Clair Webb, P. Fischer, Sung Kyu Lim	14
13	Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations 2013 ·IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems ·Moongon Jung, David Z. Pan, Sung Kyu Lim	13
14	Design for manufacturability and reliability for TSV-based 3D ICs 2012 ·David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang	24
15	Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs 2012 ·Moongon Jung, David Z. Pan, Sung Kyu Lim	18
16	Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC 2011 ·International Conference on Computer Aided Design ·Moongon Jung, Liu Xi, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim	24
17	A fast simulation framework for full-chip thermo-mechanical stress and reliability analysis of through-silicon-via based 3D ICs 2011 ·Joydeep Mitra, Moongon Jung, Suk-Kyu Ryu, Rui Huang, Sung Kyu Lim, David Z. Pan	12
18	A study of TSV variation impact on power supply noise 2011 ·Moongon Jung, Shreepad Panth, Sung Kyu Lim	10
19	Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC 2011 ·Moongon Jung, Liu Xi, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim	23
20	A study of IR-drop noise issues in 3D ICs with through-silicon-vias 2010 ·Moongon Jung, Sung Kyu Lim	29

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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