Rainer Minixhofer
Impact in
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- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Silicon Carbide Semiconductor Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electrostatic Discharge in Electronics
- Ferroelectric and Negative Capacitance Devices
- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
Papers in
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- Semiconductor materials and devices 25
- Advancements in Semiconductor Devices and Circuit Design 24
- Silicon Carbide Semiconductor Technologies 14
- Integrated Circuits and Semiconductor Failure Analysis 9
- 3D IC and TSV technologies 5
- Low-power high-performance VLSI design 4
- Electrostatic Discharge in Electronics 3
- CCD and CMOS Imaging Sensors 3
- Co-authors
- H. EnichlmairTibor GrasserStanislav TyaginovH. CericM. KarnerIvan A. StarkovChristoph JungemannV. Vescoli
- Journals
- Microelectronics Reliability (5 papers)IEEE Transactions on Electron Devices (3 papers)Microelectronic Engineering (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)Information Display (1 paper)
- Partner nations
- AustriaGermanyUnited States
In The Last Decade
Rainer Minixhofer
41 papers receiving 310 citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 302
- Hardware and Architecture 26
- Instrumentation 3
- Statistics, Probability and Uncertainty 5
- Industrial and Manufacturing Engineering 6
Countries citing papers authored by Rainer Minixhofer
This map shows the geographic impact of Rainer Minixhofer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Rainer Minixhofer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Rainer Minixhofer more than expected).
Fields of papers citing papers by Rainer Minixhofer
This network shows the impact of papers produced by Rainer Minixhofer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Rainer Minixhofer. The network helps show where Rainer Minixhofer may publish in the future.
Co-authors
The 25 scholars most cited alongside Rainer Minixhofer, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2023 | 1 | |
| 2 | 2023 | 1 | |
| 3 | 2021 | 3 | |
| 4 | 2014 | 1 | |
| 5 | 2014 | 8 | |
| 6 | 2013 | 2 | |
| 7 | 2013 | 2 | |
| 8 | 2012 | 11 | |
| 9 | Process variation aware ESD design window considerations on a 0.18μm analog, mixed-signal high voltage technology | 2011 | 8 |
| 10 | A 120V 180nm High Voltage CMOS smart power technology for system-on-chip integration | 2010 | 23 |
| 11 | Interface states charges as a vital component for hc degradation modeling. | 2010 | 2 |
| 12 | 2010 | 21 | |
| 13 | 2007 | 3 | |
| 14 | 2006 | 9 | |
| 15 | 2006 | 0 | |
| 16 | 2005 | 4 | |
| 17 | 2004 | 6 | |
| 18 | 2004 | 1 | |
| 19 | 2004 | 3 | |
| 20 | IMPLEMENTATION OF AN AUTOMATED INTERFACE FOR INTEGRATION OF TCAD WITH SEMICONDUCTOR FABRICATION | 2002 | 2 |
About Rainer Minixhofer
Rainer Minixhofer is a scholar working on Instrumentation, Electrical and Electronic Engineering, Hardware and Architecture, Industrial and Manufacturing Engineering and Surfaces, Coatings and Films, having authored 44 papers that have together received 319 indexed citations. Recurring topics across this work include Semiconductor materials and devices (25 papers), Advancements in Semiconductor Devices and Circuit Design (24 papers), Silicon Carbide Semiconductor Technologies (14 papers), Integrated Circuits and Semiconductor Failure Analysis (9 papers), 3D IC and TSV technologies (5 papers), Low-power high-performance VLSI design (4 papers), Electrostatic Discharge in Electronics (3 papers) and CCD and CMOS Imaging Sensors (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (302 citations), Hardware and Architecture (26 citations), Instrumentation (3 citations), Statistics, Probability and Uncertainty (5 citations) and Industrial and Manufacturing Engineering (6 citations). Rainer Minixhofer has collaborated with scholars based in Austria, Germany and United States. Frequent co-authors include H. Enichlmair, Tibor Grasser, Stanislav Tyaginov, H. Ceric, M. Karner, Ivan A. Starkov, Christoph Jungemann, V. Vescoli, N. Feilchenfeld and Jiří Červenka. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Electron Devices, Microelectronic Engineering, IEEE Transactions on Device and Materials Reliability and Information Display.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.