M.P. Clode

965 total citations
34 papers, 777 citations indexed

About

M.P. Clode is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, M.P. Clode has authored 34 papers receiving a total of 777 indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Mechanical Engineering, 20 papers in Electrical and Electronic Engineering and 13 papers in Mechanics of Materials. Recurrent topics in M.P. Clode's work include Electronic Packaging and Soldering Technologies (20 papers), Metallurgy and Material Forming (13 papers) and 3D IC and TSV technologies (13 papers). M.P. Clode is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), Metallurgy and Material Forming (13 papers) and 3D IC and TSV technologies (13 papers). M.P. Clode collaborates with scholars based in United Kingdom, United States and Iran. M.P. Clode's co-authors include S.H. Mannan, Min Zhou, Jianfeng Li, David A. Hutt, D.C. Whalley, Omid Mokhtari, Hiren R. Kotadia, Mark Green, T. Sheppard and Elizabeth A. Holm and has published in prestigious journals such as Applied Physics Letters, Acta Materialia and Journal of Alloys and Compounds.

In The Last Decade

M.P. Clode

33 papers receiving 747 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
M.P. Clode United Kingdom	14	583	520	201	174	151	34	777
Z. Mei United States	14	830 1.4×	859 1.7×	152 0.8×	212 1.2×	180 1.2×	25	1.1k
Y. Takaku Japan	14	498 0.9×	494 0.9×	180 0.9×	33 0.2×	129 0.9×	21	724
Jingwei Xian United Kingdom	18	686 1.2×	668 1.3×	198 1.0×	77 0.4×	333 2.2×	39	942
S. Sommadossi Argentina	12	306 0.5×	221 0.4×	119 0.6×	76 0.4×	93 0.6×	32	455
Jerome A. Rejent United States	15	593 1.0×	783 1.5×	88 0.4×	120 0.7×	193 1.3×	41	839
K.S. Kumar United States	18	766 1.3×	154 0.3×	441 2.2×	123 0.7×	129 0.9×	31	899
Joachim Konrad Germany	8	325 0.6×	83 0.2×	187 0.9×	83 0.5×	88 0.6×	16	437
B. P. Richards United Kingdom	11	222 0.4×	194 0.4×	146 0.7×	77 0.4×	85 0.6×	34	460
K. Sree Kumar India	8	668 1.1×	107 0.2×	684 3.4×	286 1.6×	184 1.2×	17	906
K. Sakamoto Japan	10	475 0.8×	428 0.8×	68 0.3×	29 0.2×	150 1.0×	12	606

Countries citing papers authored by M.P. Clode

Since Specialization

Citations

This map shows the geographic impact of M.P. Clode's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M.P. Clode with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M.P. Clode more than expected).

Fields of papers citing papers by M.P. Clode

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M.P. Clode. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M.P. Clode. The network helps show where M.P. Clode may publish in the future.

Co-authorship network of co-authors of M.P. Clode

This figure shows the co-authorship network connecting the top 25 collaborators of M.P. Clode. A scholar is included among the top collaborators of M.P. Clode based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M.P. Clode. M.P. Clode is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Kotadia, Hiren R., et al.. (2012). Reliability of electronics assembled using SAC + Zn solder pastes. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2012(HITEC). 51–57. 1 indexed citations

Mokhtari, Omid, Ali Roshanghias, Hiren R. Kotadia, et al.. (2012). Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders. Journal of Electronic Materials. 41(7). 1907–1914. 19 indexed citations

Mokhtari, Omid, Ali Roshanghias, Hiren R. Kotadia, et al.. (2012). Nanoparticle Enhanced Solders for Increased Solder Reliability. MRS Proceedings. 1424. 1 indexed citations

Kotadia, Hiren R., Omid Mokhtari, M.P. Clode, Mark Green, & S.H. Mannan. (2011). Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates. Journal of Alloys and Compounds. 511(1). 176–188. 106 indexed citations

Li, Jianfeng, S.H. Mannan, M.P. Clode, et al.. (2008). Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects. IEEE Transactions on Components and Packaging Technologies. 31(3). 574–585. 5 indexed citations

Li, Jianfeng, S.H. Mannan, M.P. Clode, C. Johnston, & Alison Crossley. (2007). Dissolution and interfacial reaction of Nb in contact with the molten 52In–48Sn solder. Acta Materialia. 55(15). 5057–5071. 16 indexed citations

Holm, Elizabeth A., et al.. (2006). On computer simulation methods to model Zener pinning. Acta Materialia. 54(12). 3261–3273. 55 indexed citations

Li, Jianfeng, et al.. (2006). Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders. Acta Materialia. 55(2). 737–752. 53 indexed citations

Li, Jianfeng, S.H. Mannan, & M.P. Clode. (2006). Edge effects in intermetallic compound crystal growth between Nb and molten 52In–48Sn solder. Applied Physics Letters. 88(10). 1 indexed citations

10.

Li, Jianfeng, S.H. Mannan, & M.P. Clode. (2006). Lifetime of solid metals in contact with liquid solders for high-temperature liquid solder assemblies. Scripta Materialia. 54(10). 1773–1778. 7 indexed citations

11.

Seneviratne, Lakmal, et al.. (2005). Benefits of Wheel-Tool Gap Sensing in Conform™ Extrusion Machinery. IEEE/ASME Transactions on Mechatronics. 10(4). 428–436. 2 indexed citations

12.

Mannan, S.H. & M.P. Clode. (2004). Molten solder interconnects: Long term reaction studies and applications. Research Portal (King's College London). 1 indexed citations

13.

Mannan, S.H. & M.P. Clode. (2004). Dissolution of solids in contact with liquid solder. Soldering and Surface Mount Technology. 16(3). 31–33. 17 indexed citations

14.

Mannan, S.H. & M.P. Clode. (2004). Materials and Processes for Implementing High-Temperature Liquid Interconnects. IEEE Transactions on Advanced Packaging. 27(3). 508–514. 52 indexed citations

15.

Zhou, Min & M.P. Clode. (1998). Constitutive equations for modelling flow softening due to dynamic recovery and heat generation during plastic deformation. Mechanics of Materials. 27(2). 63–76. 91 indexed citations

16.

Zhou, Min, et al.. (1998). THERMAL EFFECTS ON FLOW PROPERTIES OF ALUMINUM ALLOYS. Journal of Thermal Stresses. 21(5). 509–518. 1 indexed citations

17.

Zhou, Min & M.P. Clode. (1997). A Constitutive Model and Its Identification for the Deformation Characterized by Dynamic Recovery. Journal of Engineering Materials and Technology. 119(2). 138–142. 13 indexed citations

18.

Zhou, Min & M.P. Clode. (1997). Modelling of high temperature viscoplastic flow of aluminium alloys by hot torsion testing. Materials Science and Technology. 13(10). 818–824. 14 indexed citations

19.

Zhou, Min & M.P. Clode. (1997). Modelling of high temperature viscoplastic flow of aluminium alloys by hot torsion testing. Materials Science and Technology. 13(10). 818–824. 1 indexed citations

20.

Sheppard, T. & M.P. Clode. (1988). The origin of surface defects during extrusion of AA6063 alloy.. 329–341. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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