Tetsuro Nishimura
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 5%
- Aerospace Engineering top 10%
- Materials Chemistry
- General Materials Science top 5%
- Co-authors
- Kazuhiro NogitaStuart D. McDonaldHideaki TsukamotoJ. ReadA. K. DahleKeith SweatmanM. RappazSyo Matsumura
- Topics
- Electronic Packaging and Soldering Technologies (21 papers)3D IC and TSV technologies (11 papers)Advanced Welding Techniques Analysis (7 papers)
In The Last Decade
Tetsuro Nishimura
21 papers receiving 509 citations
Peers
Comparison fields: 5 of 44
- Electrical and Electronic Engineering 474
- Mechanical Engineering 352
- Aerospace Engineering 93
- Materials Chemistry 52
- General Materials Science 35
Countries citing papers authored by Tetsuro Nishimura
This map shows the geographic impact of Tetsuro Nishimura's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tetsuro Nishimura with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tetsuro Nishimura more than expected).
Fields of papers citing papers by Tetsuro Nishimura
This network shows the impact of papers produced by Tetsuro Nishimura. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tetsuro Nishimura. The network helps show where Tetsuro Nishimura may publish in the future.
Co-authorship network of co-authors of Tetsuro Nishimura
This figure shows the co-authorship network connecting the top 25 collaborators of Tetsuro Nishimura. A scholar is included among the top collaborators of Tetsuro Nishimura based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tetsuro Nishimura. Tetsuro Nishimura is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 5 | |
| 3 | 3 | |
| 4 | 1 | |
| 5 | 37 | |
| 6 | 41 | |
| 7 | Effect of cooling rate on the intermetallic layer in solder joints | 0 |
| 8 | 29 | |
| 9 | 4 | |
| 10 | 4 | |
| 11 | 36 | |
| 12 | 0 | |
| 13 | 42 | |
| 14 | 167 | |
| 15 | 59 | |
| 16 | 39 | |
| 17 | 9 | |
| 18 | 0 | |
| 19 | 1 | |
| 20 | 10 |
About Tetsuro Nishimura
Tetsuro Nishimura is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Aerospace Engineering, having authored 28 papers that have together received 522 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (11 papers) and Advanced Welding Techniques Analysis (7 papers). The work is most often cited by research in General Materials Science (35 citations), Mechanical Engineering (352 citations) and Electrical and Electronic Engineering (474 citations). Tetsuro Nishimura has collaborated with scholars based in Australia, Japan and Malaysia. Frequent co-authors include Kazuhiro Nogita, Stuart D. McDonald, Hideaki Tsukamoto, J. Read, A. K. Dahle, Keith Sweatman, M. Rappaz, Syo Matsumura, Qinfen Gu and C.M. Gourlay. Their work appears in journals such as Journal of Power Sources, Scripta Materialia and Japanese Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.