Maximilian Schmid

417 total citations
45 papers, 312 citations indexed

About

Maximilian Schmid is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics and Mechanical Engineering. According to data from OpenAlex, Maximilian Schmid has authored 45 papers receiving a total of 312 indexed citations (citations by other indexed papers that have themselves been cited), including 41 papers in Electrical and Electronic Engineering, 15 papers in Condensed Matter Physics and 7 papers in Mechanical Engineering. Recurrent topics in Maximilian Schmid's work include Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (16 papers) and GaN-based semiconductor devices and materials (15 papers). Maximilian Schmid is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (16 papers) and GaN-based semiconductor devices and materials (15 papers). Maximilian Schmid collaborates with scholars based in Germany, Italy and United Kingdom. Maximilian Schmid's co-authors include Gordon Elger, Fosca Conti, Erjia Liu, Dominik N. Müller, H. Spliethoff, Sebastian Fendt, Judith Pérez-Velázquez, Omid Mokhtari, Hiren R. Kotadia and T. Wipiejewski and has published in prestigious journals such as Scientific Reports, Applied Thermal Engineering and IEEE Transactions on Instrumentation and Measurement.

In The Last Decade

Maximilian Schmid

41 papers receiving 306 citations

Peers

Maximilian Schmid
Shuo Li China
Zhiqing Yang China
Martin Pfost Germany
Ho‐Yun Lee South Korea
Michael D. Glover United States
Dan Kinzer United States
Jiahao Niu United States
K. Matsunaga Japan
Guanzhou Ren China
Michael de Rooij United States
Shuo Li China
Maximilian Schmid
Citations per year, relative to Maximilian Schmid Maximilian Schmid (= 1×) peers Shuo Li

Countries citing papers authored by Maximilian Schmid

Since Specialization
Citations

This map shows the geographic impact of Maximilian Schmid's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Maximilian Schmid with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Maximilian Schmid more than expected).

Fields of papers citing papers by Maximilian Schmid

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Maximilian Schmid. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Maximilian Schmid. The network helps show where Maximilian Schmid may publish in the future.

Co-authorship network of co-authors of Maximilian Schmid

This figure shows the co-authorship network connecting the top 25 collaborators of Maximilian Schmid. A scholar is included among the top collaborators of Maximilian Schmid based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Maximilian Schmid. Maximilian Schmid is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Schmid, Maximilian, et al.. (2025). AI-driven point cloud framework for predicting solder joint reliability using 3D FEA data. Scientific Reports. 15(1). 24340–24340. 1 indexed citations
2.
Schmid, Maximilian, et al.. (2024). Solder joint lifetime model using AI framework operating on FEA data. Engineering Failure Analysis. 167. 109032–109032. 3 indexed citations
3.
Schmid, Maximilian, et al.. (2024). Technical evaluation and life-cycle assessment of solid oxide co-electrolysis integration in biomass-to-liquid processes for sustainable aviation fuel production. Applied Thermal Engineering. 260. 124882–124882. 6 indexed citations
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Schmid, Maximilian, et al.. (2024). LEDs Lifetime Prediction Modeling: Thermomechanical Simulation for SAC305 and SAC105. 1–10. 4 indexed citations
6.
Schmid, Maximilian, et al.. (2023). Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability. IEEE Transactions on Device and Materials Reliability. 23(3). 419–429. 10 indexed citations
7.
Schmid, Maximilian, et al.. (2023). Transient thermal analysis for VCSEL Diodes. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6. 1 indexed citations
8.
Schmid, Maximilian, et al.. (2023). Process Simulation of Fuel Production Through Integration of High-Temperature Co-Electrolysis in a Biomass-To-Liquid Process. mediaTUM (Technical University of Munich). 1170–1181. 7 indexed citations
9.
Schmid, Maximilian, et al.. (2022). Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization. IEEE Transactions on Device and Materials Reliability. 22(2). 175–186. 14 indexed citations
10.
Schmid, Maximilian, et al.. (2022). Low cost copper based sintered interconnect material for optoelectronics packaging. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1720–1725. 1 indexed citations
11.
Schmid, Maximilian, et al.. (2022). Reliability of SAC Solders under Low and High Stress Conditions. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 24. 553–559.
12.
Schmid, Maximilian, et al.. (2020). Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics. Applied Sciences. 10(23). 8516–8516. 14 indexed citations
13.
Schmid, Maximilian, et al.. (2020). A New Noise-Suppression Algorithm for Transient Thermal Analysis in Semiconductors Over Pulse Superposition. IEEE Transactions on Instrumentation and Measurement. 70. 1–9. 11 indexed citations
14.
Mokhtari, Omid, et al.. (2019). Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 4 indexed citations
15.
Schmid, Maximilian & Gordon Elger. (2018). Measurement of the Transient Thermal Impedance of MOSFETs Over the Sensitivity of the Threshold Voltage. European Conference on Power Electronics and Applications. 3 indexed citations
16.
Schmid, Maximilian, et al.. (2016). Self alignment of flip chip LEDs on PCB for high position accuracy. 1–6. 1 indexed citations
17.
Elger, Gordon, et al.. (2016). Transient thermal analysis for accelerated reliability testing of LEDs. Microelectronics Reliability. 64. 605–609. 24 indexed citations
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Elger, Gordon, et al.. (2014). Application of thermal analysis for the development of reliable high power LED modules. 158–164. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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