Ali Roshanghias

1.1k total citations
68 papers, 827 citations indexed

About

Ali Roshanghias is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Ali Roshanghias has authored 68 papers receiving a total of 827 indexed citations (citations by other indexed papers that have themselves been cited), including 55 papers in Electrical and Electronic Engineering, 20 papers in Biomedical Engineering and 15 papers in Mechanical Engineering. Recurrent topics in Ali Roshanghias's work include Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (22 papers) and Nanomaterials and Printing Technologies (19 papers). Ali Roshanghias is often cited by papers focused on Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (22 papers) and Nanomaterials and Printing Technologies (19 papers). Ali Roshanghias collaborates with scholars based in Austria, Iran and Germany. Ali Roshanghias's co-authors include Matic Krivec, Alfred Binder, Herbert Ipser, A. Yakymovych, Hubert Zangl, A.H. Kokabi, Christina Hirschl, Hamid Reza Madaah Hosseini, P. Švec and Johannes Bernardi and has published in prestigious journals such as SHILAP Revista de lepidopterología, ACS Applied Materials & Interfaces and The Journal of Physical Chemistry C.

In The Last Decade

Ali Roshanghias

65 papers receiving 804 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ali Roshanghias Austria 19 543 275 255 137 110 68 827
Michael Cullinan United States 20 335 0.6× 461 1.7× 332 1.3× 284 2.1× 269 2.4× 99 1.1k
Wengan Wang China 15 430 0.8× 315 1.1× 238 0.9× 137 1.0× 41 0.4× 25 845
Gi‐Dong Sim South Korea 20 267 0.5× 298 1.1× 401 1.6× 467 3.4× 62 0.6× 53 1.1k
Ying-Song Yu China 18 431 0.8× 310 1.1× 117 0.5× 120 0.9× 29 0.3× 40 1.1k
Pekka Ruuskanen Finland 16 519 1.0× 414 1.5× 226 0.9× 124 0.9× 81 0.7× 55 1.0k
Dae‐Gon Kim South Korea 21 993 1.8× 388 1.4× 527 2.1× 131 1.0× 37 0.3× 60 1.3k
Sanha Kim South Korea 19 314 0.6× 564 2.1× 360 1.4× 235 1.7× 87 0.8× 70 1.1k
Helge Kristiansen Norway 14 429 0.8× 217 0.8× 118 0.5× 155 1.1× 25 0.2× 80 807
Thomas C. Baum Australia 17 377 0.7× 374 1.4× 79 0.3× 78 0.6× 52 0.5× 66 1.1k
Anil Kunwar China 17 582 1.1× 115 0.4× 511 2.0× 208 1.5× 70 0.6× 77 927

Countries citing papers authored by Ali Roshanghias

Since Specialization
Citations

This map shows the geographic impact of Ali Roshanghias's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ali Roshanghias with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ali Roshanghias more than expected).

Fields of papers citing papers by Ali Roshanghias

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ali Roshanghias. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ali Roshanghias. The network helps show where Ali Roshanghias may publish in the future.

Co-authorship network of co-authors of Ali Roshanghias

This figure shows the co-authorship network connecting the top 25 collaborators of Ali Roshanghias. A scholar is included among the top collaborators of Ali Roshanghias based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ali Roshanghias. Ali Roshanghias is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Bedük, Tutku, et al.. (2024). The enhanced lifetime of printed GaS-based photodetectors with polymer encapsulation. FlatChem. 49. 100795–100795. 1 indexed citations
2.
3.
Brunner, Roland, et al.. (2024). Cu Sintering for Cu Pillar Bonding: A Comparative Study Among Pressure-Less, Pressure-Assisted, and Transient Liquid Phase Sinter Pastes. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(1). 224–231. 3 indexed citations
4.
Ortner, Michael, et al.. (2024). Magnetic Field Sensors for Non-Invasive Current Monitoring in Wire-Bond-Less Power Modules. SHILAP Revista de lepidopterología. 100–100.
5.
Roshanghias, Ali, et al.. (2023). 3D Integration via D2D Bump-Less Cu Bonding with Protruded and Recessed Topographies. ECS Journal of Solid State Science and Technology. 12(8). 84001–84001. 7 indexed citations
6.
Bito, Jo, et al.. (2023). Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems. SHILAP Revista de lepidopterología. 2(7). 31 indexed citations
7.
8.
Zangl, Hubert, et al.. (2023). Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation. Flexible and Printed Electronics. 8(1). 15004–15004. 2 indexed citations
9.
Zangl, Hubert, et al.. (2022). Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers. 1–4. 2 indexed citations
10.
Weissbach, Thomas, et al.. (2022). Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders. Journal of Materials Science Materials in Electronics. 33(24). 19252–19262. 1 indexed citations
11.
Roshanghias, Ali, et al.. (2022). High-Resolution Printing of Redistribution Layers for Fan-Out Wafer-Level Packaging by using Ultra-Precise Micro-deposition Technology. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 12. 254–258. 3 indexed citations
12.
Tsiamis, Andreas, et al.. (2022). Die-Level Thinning for Flip-Chip Integration on Flexible Substrates. Electronics. 11(6). 849–849. 8 indexed citations
13.
Paik, Kyung‐Wook, et al.. (2021). ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics. Journal of Materials Science Materials in Electronics. 32(2). 2283–2292. 10 indexed citations
14.
Roshanghias, Ali, Matic Krivec, Jochen Bardong, & Alfred Binder. (2019). Additive-Manufactured Organic Interposers. Journal of Electronic Packaging. 142(1). 4 indexed citations
15.
Faller, Lisa-Marie, et al.. (2019). Hybrid Printing for the Fabrication of Smart Sensors. Journal of Visualized Experiments. 3 indexed citations
16.
Roshanghias, Ali, et al.. (2018). A comparative study on direct Cu–Cu bonding methodologies for copper pillar bumped flip-chips. Journal of Materials Science Materials in Electronics. 29(11). 9347–9353. 18 indexed citations
17.
Sam-Daliri, Omid, Lisa-Marie Faller, Mohammadreza Farahani, et al.. (2018). Impedance analysis for condition monitoring of single lap CNT-epoxy adhesive joint. International Journal of Adhesion and Adhesives. 88. 59–65. 49 indexed citations
18.
Roshanghias, Ali, et al.. (2018). The Realization of Redistribution Layers for FOWLP by Inkjet Printing. SHILAP Revista de lepidopterología. 703–703. 8 indexed citations
19.
Roshanghias, Ali, et al.. (2014). Cross-sectional nanoindentation (CSN) studies on the effect of thickness on adhesion strength of thin films. Journal of Physics D Applied Physics. 48(3). 35301–35301. 8 indexed citations
20.
Roshanghias, Ali, A.H. Kokabi, Yukio MIYASHITA, Yoshiharu MUTOH, & Hamid Reza Madaah Hosseini. (2012). Formation of intermetallic reaction layer and joining strength in nano-composite solder joint. Journal of Materials Science Materials in Electronics. 24(3). 839–847. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Michael Cullinan Breakdown of academic impact, for papers by Wengan Wang Breakdown of academic impact, for papers by Gi‐Dong Sim Breakdown of academic impact, for papers by Ying-Song Yu Breakdown of academic impact, for papers by Pekka Ruuskanen Breakdown of academic impact, for papers by Dae‐Gon Kim Breakdown of academic impact, for papers by Sanha Kim Breakdown of academic impact, for papers by Helge Kristiansen Breakdown of academic impact, for papers by Thomas C. Baum Breakdown of academic impact, for papers by Anil Kunwar
Rankless by CCL
2026