Zhong Sheng

648 total citations
15 papers, 575 citations indexed

About

Zhong Sheng is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Aerospace Engineering. According to data from OpenAlex, Zhong Sheng has authored 15 papers receiving a total of 575 indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Mechanical Engineering, 14 papers in Electrical and Electronic Engineering and 2 papers in Aerospace Engineering. Recurrent topics in Zhong Sheng's work include Electronic Packaging and Soldering Technologies (14 papers), Intermetallics and Advanced Alloy Properties (8 papers) and 3D IC and TSV technologies (6 papers). Zhong Sheng is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), Intermetallics and Advanced Alloy Properties (8 papers) and 3D IC and TSV technologies (6 papers). Zhong Sheng collaborates with scholars based in China. Zhong Sheng's co-authors include Lili Gao, Songbai Xue, YU Sheng-lin, Guang Zeng, Liang Zhang, Yan Chen, Liang Zhang, Feng Ji, Wei Dai and Guang Zeng and has published in prestigious journals such as Microelectronics Reliability, Engineering Failure Analysis and Microelectronic Engineering.

In The Last Decade

Zhong Sheng

15 papers receiving 563 citations

Peers

Zhong Sheng

EEE

GMS

G.Y. Li China

G.S. Al-Ganainy Egypt

Omid Mokhtari Japan

Polina Snugovsky Canada

A. Fawzy Egypt

J. K. Lin United States

J. W. Jang United States

Zijie Cai United States

Alice C. Kilgo United States

Zhixian Min China

G.Y. Li China

Zhong Sheng

531 ×1.0

EEE

470 ×1.0

58 ×0.6

42 ×1.1

GMS

24 ×0.9

Citations per year, relative to Zhong Sheng Zhong Sheng (= 1×) peers G.Y. Li

Countries citing papers authored by Zhong Sheng

Since Specialization

Citations

This map shows the geographic impact of Zhong Sheng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zhong Sheng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zhong Sheng more than expected).

Fields of papers citing papers by Zhong Sheng

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Zhong Sheng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zhong Sheng. The network helps show where Zhong Sheng may publish in the future.

Co-authorship network of co-authors of Zhong Sheng

This figure shows the co-authorship network connecting the top 25 collaborators of Zhong Sheng. A scholar is included among the top collaborators of Zhong Sheng based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zhong Sheng. Zhong Sheng is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

15 of 15 papers shown

Xu, Lianyong, et al.. (2013). Failure analysis of Incoloy 800HT pipe at high temperature. Engineering Failure Analysis. 31. 375–386. 14 indexed citations

Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2011). Effects of bulk Cu₆Sn₅ intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints. Soldering and Surface Mount Technology. 23(1). 4–9. 7 indexed citations

Zeng, Guang, Songbai Xue, Liang Zhang, Zhong Sheng, & Lili Gao. (2010). Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments. Soldering and Surface Mount Technology. 22(4). 57–64. 6 indexed citations

Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2010). Thermal Fatigue Behavior of SnAgCu Soldered Joints in Fine Pitch Devices. Rare Metal Materials and Engineering. 39(3). 382–387. 7 indexed citations

Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2010). Creep behavior of SnAgCu solders with rare earth Ce doping. Transactions of Nonferrous Metals Society of China. 20(3). 412–417. 33 indexed citations

Gao, Lili, Songbai Xue, Liang Zhang, et al.. (2010). Effect of alloying elements on properties and microstructures of SnAgCu solders. Microelectronic Engineering. 87(11). 2025–2034. 141 indexed citations

Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2010). Reliability study of Sn–Ag–Cu–Ce soldered joints in quad flat packages. Microelectronics Reliability. 50(12). 2071–2077. 11 indexed citations

Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2010). Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium. Soldering and Surface Mount Technology. 22(2). 30–36. 18 indexed citations

Gao, Lili, Songbai Xue, Liang Zhang, et al.. (2009). Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder. Journal of Materials Science Materials in Electronics. 21(7). 643–648. 59 indexed citations

10.

Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2009). Determination of Anand parameters for SnAgCuCe solder. Modelling and Simulation in Materials Science and Engineering. 17(7). 75014–75014. 28 indexed citations

11.

Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2009). Effects of rare earths on properties and microstructures of lead-free solder alloys. Journal of Materials Science Materials in Electronics. 20(8). 685–694. 76 indexed citations

12.

Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2009). Development of Sn–Zn lead-free solders bearing alloying elements. Journal of Materials Science Materials in Electronics. 21(1). 1–15. 115 indexed citations

13.

Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2009). Effects of trace amount addition of rare earth on properties and microstructure of Sn–Ag–Cu alloys. Journal of Materials Science Materials in Electronics. 20(12). 1193–1199. 37 indexed citations

14.

Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2009). Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging. Journal of Materials Science Materials in Electronics. 21(6). 635–642. 15 indexed citations

15.

Sheng, Zhong. (2008). MECHANICAL PROPERTIES OF FINE PITCH DEVICES SOLDERED JOINTS BASED ON CREEP MODEL. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact