Yi-Wun Wang

881 total citations
35 papers, 750 citations indexed

About

Yi-Wun Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Yi-Wun Wang has authored 35 papers receiving a total of 750 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 20 papers in Mechanical Engineering and 5 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Yi-Wun Wang's work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (25 papers) and Advanced Welding Techniques Analysis (14 papers). Yi-Wun Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (25 papers) and Advanced Welding Techniques Analysis (14 papers). Yi-Wun Wang collaborates with scholars based in Taiwan, Malaysia and Japan. Yi-Wun Wang's co-authors include C. R. Kao, Yan‐Cheng Lin, Chia-Wei Chang, Yi‐Shao Lai, Jiunn Chen, Shenghao Yang, Haiyang Yu, Min‐Yeh Tsai, Shun‐Chung Yang and Tsung‐Lin Yang and has published in prestigious journals such as Journal of The Electrochemical Society, Materials Science and Engineering A and Molecules.

In The Last Decade

Yi-Wun Wang

33 papers receiving 731 citations

Peers

Countries citing papers authored by Yi-Wun Wang

Since Specialization

Citations

This map shows the geographic impact of Yi-Wun Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yi-Wun Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yi-Wun Wang more than expected).

Fields of papers citing papers by Yi-Wun Wang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yi-Wun Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yi-Wun Wang. The network helps show where Yi-Wun Wang may publish in the future.

Co-authorship network of co-authors of Yi-Wun Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Yi-Wun Wang. A scholar is included among the top collaborators of Yi-Wun Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yi-Wun Wang. Yi-Wun Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Title	Journal	Authors	Indexed citations
1	Microstructural evaluation of interfacial intermetallic compounds between Sn58Bi and ENEPIG	Journal of the Taiwan Institute of Chemical Engineers	Yi-Wun Wang et al.	0
2	Enhancing the Permeate Flux Improvement of Direct Contact Membrane Distillation Modules with Inserted S-Ribs Carbon-Fiber Filaments	Membranes	Chii‐Dong Ho, Yi-Wun Wang et al.	2
3	Moderate Signal Enhancement in Electrospray Ionization Mass Spectrometry by Focusing Electrospray Plume with a Dielectric Layer around the Mass Spectrometer’s Orifice	Molecules	Gurpur Rakesh D. Prabhu, Yi-Wun Wang et al.	1
4	Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid–Solid Reactions	Journal of Electronic Materials	Yi-Wun Wang, Yi Chen et al.	8
5	Study on the growth mechanisms of Cu-In compounds at the Sn52In/Cu interface	Journal of Materials Science Materials in Electronics	Yi-Wun Wang et al.	1
6	Microstructural observation of Bi67In reacting with Cu for microelectronic interconnects	Journal of the Taiwan Institute of Chemical Engineers	Yi-Wun Wang et al.	4
7	Tuning Electrospray Ionization with Low-Frequency Sound	Journal of the American Society for Mass Spectrometry	Yi-Wun Wang, Gurpur Rakesh D. Prabhu et al.	8
8	Effects of surface diffusion and solder volume on porous-type Cu3Sn in Cu/Sn/Cu microjoints	Materials Chemistry and Physics	Yi-Wun Wang	8
9	Phase stabilities and interfacial reactions of the Cu–In binary systems	Journal of Materials Science Materials in Electronics	Haiyang Yu, C. R. Kao et al.	14
10	Interfacial Reactions of Cu and In for Low-Temperature Processes		Yi-Wun Wang, C. R. Kao	1
11	Mechanical characterizations of single-crystalline (Cu, Ni)6Sn5 through uniaxial micro-compression	Materials Science and Engineering A	Yi-Wun Wang, C. R. Kao et al.	14
12	Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications	Journal of Alloys and Compounds	Yi-Wun Wang, Tsung‐Lin Yang et al.	16
13	Materials Merging Mechanism of Microfluidic Electroless Interconnection Process	Journal of The Electrochemical Society	Shi‐Yi Yang, Yi-Wun Wang et al.	20
14	Effects of Ni Additions on the Growth of Cu3Sn in High-Lead Solders	Journal of Electronic Materials	Yi-Wun Wang, Chia-Wei Chang et al.	7
15	Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints	Journal of Electronic Materials	Yi-Wun Wang, Y. S. Lai et al.	7
16	Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn–Zn systems	Journal of Alloys and Compounds	Min‐Yeh Tsai, Shenghao Yang et al.	25
17	The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering	Journal of Alloys and Compounds	Yan‐Cheng Lin, Yi-Wun Wang et al.	88
18	Minor Fe, Co, and Ni additions to SnAgCu solders for retarding Cu<inf>3</inf>Sn growth		Yi-Wun Wang, C. R. Kao	5
19	Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu	Journal of Alloys and Compounds	Yi-Wun Wang, Yan‐Cheng Lin et al.	165
20	Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder	Journal of Electronic Materials	Shun‐Chung Yang, Wei‐Ling Chang et al.	14

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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