Yi-Wun Wang

881 total citations
35 papers, 750 citations indexed

About

Yi-Wun Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Yi-Wun Wang has authored 35 papers receiving a total of 750 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 20 papers in Mechanical Engineering and 5 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Yi-Wun Wang's work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (25 papers) and Advanced Welding Techniques Analysis (14 papers). Yi-Wun Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (25 papers) and Advanced Welding Techniques Analysis (14 papers). Yi-Wun Wang collaborates with scholars based in Taiwan, Malaysia and Japan. Yi-Wun Wang's co-authors include C. R. Kao, Yan‐Cheng Lin, Chia-Wei Chang, Yi‐Shao Lai, Jiunn Chen, Shenghao Yang, Haiyang Yu, Min‐Yeh Tsai, Shun‐Chung Yang and Tsung‐Lin Yang and has published in prestigious journals such as Journal of The Electrochemical Society, Materials Science and Engineering A and Molecules.

In The Last Decade

Yi-Wun Wang

33 papers receiving 731 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yi-Wun Wang Taiwan 14 684 535 84 82 58 35 750
Omid Mokhtari Japan 14 739 1.1× 610 1.1× 30 0.4× 116 1.4× 52 0.9× 38 796
J. K. Lin United States 6 606 0.9× 428 0.8× 54 0.6× 115 1.4× 30 0.5× 8 616
K. Sakamoto Japan 10 428 0.6× 475 0.9× 31 0.4× 150 1.8× 68 1.2× 12 606
A. M. El-Taher Egypt 13 664 1.0× 556 1.0× 59 0.7× 146 1.8× 86 1.5× 26 723
G.T. Galyon United States 9 424 0.6× 243 0.5× 101 1.2× 72 0.9× 77 1.3× 15 488
Tetsuro Nishimura Australia 10 474 0.7× 352 0.7× 28 0.3× 93 1.1× 52 0.9× 28 522
Jerome A. Rejent United States 15 783 1.1× 593 1.1× 55 0.7× 193 2.4× 88 1.5× 41 839
P. Elenius United States 13 718 1.0× 272 0.5× 231 2.8× 43 0.5× 20 0.3× 27 733
Ying-Ta Chiu Taiwan 13 457 0.7× 248 0.5× 143 1.7× 37 0.5× 35 0.6× 37 493
Siliang He China 14 387 0.6× 312 0.6× 38 0.5× 31 0.4× 59 1.0× 52 474

Countries citing papers authored by Yi-Wun Wang

Since Specialization
Citations

This map shows the geographic impact of Yi-Wun Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yi-Wun Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yi-Wun Wang more than expected).

Fields of papers citing papers by Yi-Wun Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yi-Wun Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yi-Wun Wang. The network helps show where Yi-Wun Wang may publish in the future.

Co-authorship network of co-authors of Yi-Wun Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Yi-Wun Wang. A scholar is included among the top collaborators of Yi-Wun Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yi-Wun Wang. Yi-Wun Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wang, Yi-Wun, et al.. (2024). Microstructural evaluation of interfacial intermetallic compounds between Sn58Bi and ENEPIG. Journal of the Taiwan Institute of Chemical Engineers. 159. 105508–105508.
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Wang, Yi-Wun, et al.. (2023). Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid–Solid Reactions. Journal of Electronic Materials. 52(6). 4000–4010. 8 indexed citations
5.
Wang, Yi-Wun, et al.. (2023). Study on the growth mechanisms of Cu-In compounds at the Sn52In/Cu interface. Journal of Materials Science Materials in Electronics. 34(29). 1 indexed citations
6.
Wang, Yi-Wun, et al.. (2023). Microstructural observation of Bi67In reacting with Cu for microelectronic interconnects. Journal of the Taiwan Institute of Chemical Engineers. 151. 105099–105099. 4 indexed citations
7.
Wang, Yi-Wun, et al.. (2022). Tuning Electrospray Ionization with Low-Frequency Sound. Journal of the American Society for Mass Spectrometry. 33(10). 1883–1890. 8 indexed citations
8.
Wang, Yi-Wun. (2021). Effects of surface diffusion and solder volume on porous-type Cu3Sn in Cu/Sn/Cu microjoints. Materials Chemistry and Physics. 275. 125307–125307. 8 indexed citations
9.
Yu, Haiyang, et al.. (2020). Phase stabilities and interfacial reactions of the Cu–In binary systems. Journal of Materials Science Materials in Electronics. 31(13). 10161–10169. 14 indexed citations
10.
Wang, Yi-Wun & C. R. Kao. (2019). Interfacial Reactions of Cu and In for Low-Temperature Processes. 435–439. 1 indexed citations
11.
Wang, Yi-Wun, et al.. (2019). Mechanical characterizations of single-crystalline (Cu, Ni)6Sn5 through uniaxial micro-compression. Materials Science and Engineering A. 753. 22–30. 14 indexed citations
12.
Wang, Yi-Wun, et al.. (2018). Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications. Journal of Alloys and Compounds. 750. 570–576. 16 indexed citations
13.
Yang, Shi‐Yi, et al.. (2018). Materials Merging Mechanism of Microfluidic Electroless Interconnection Process. Journal of The Electrochemical Society. 165(7). D273–D281. 20 indexed citations
14.
Wang, Yi-Wun, et al.. (2010). Effects of Ni Additions on the Growth of Cu3Sn in High-Lead Solders. Journal of Electronic Materials. 39(12). 2636–2642. 7 indexed citations
15.
Wang, Yi-Wun, et al.. (2010). Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints. Journal of Electronic Materials. 39(8). 1289–1294. 7 indexed citations
16.
Tsai, Min‐Yeh, Shenghao Yang, Yi-Wun Wang, & C. R. Kao. (2010). Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn–Zn systems. Journal of Alloys and Compounds. 494(1-2). 123–127. 25 indexed citations
17.
Lin, Yan‐Cheng, et al.. (2009). The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering. Journal of Alloys and Compounds. 492(1-2). 99–104. 88 indexed citations
18.
Wang, Yi-Wun & C. R. Kao. (2008). Minor Fe, Co, and Ni additions to SnAgCu solders for retarding Cu<inf>3</inf>Sn growth. 76–79. 5 indexed citations
19.
Wang, Yi-Wun, et al.. (2008). Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu. Journal of Alloys and Compounds. 478(1-2). 121–127. 165 indexed citations
20.
Yang, Shun‐Chung, Wei‐Ling Chang, Yi-Wun Wang, & C. R. Kao. (2008). Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder. Journal of Electronic Materials. 38(1). 25–32. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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Breakdown of academic impact, for papers by Omid Mokhtari Breakdown of academic impact, for papers by J. K. Lin Breakdown of academic impact, for papers by K. Sakamoto Breakdown of academic impact, for papers by A. M. El-Taher Breakdown of academic impact, for papers by G.T. Galyon Breakdown of academic impact, for papers by Tetsuro Nishimura Breakdown of academic impact, for papers by Jerome A. Rejent Breakdown of academic impact, for papers by P. Elenius Breakdown of academic impact, for papers by Ying-Ta Chiu Breakdown of academic impact, for papers by Siliang He
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2026