Zhixian Min
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 5%
- Materials Chemistry
- Aerospace Engineering top 10%
- General Materials Science top 5%
- Topics
- Electronic Packaging and Soldering Technologies (18 papers)3D IC and TSV technologies (11 papers)Solidification and crystal growth phenomena (9 papers)
In The Last Decade
Zhixian Min
29 papers receiving 540 citations
Peers
Comparison fields: 5 of 24
- Electrical and Electronic Engineering 440
- Mechanical Engineering 439
- Materials Chemistry 113
- Aerospace Engineering 102
- General Materials Science 36
Countries citing papers authored by Zhixian Min
This map shows the geographic impact of Zhixian Min's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zhixian Min with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zhixian Min more than expected).
Fields of papers citing papers by Zhixian Min
This network shows the impact of papers produced by Zhixian Min. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zhixian Min. The network helps show where Zhixian Min may publish in the future.
Co-authorship network of co-authors of Zhixian Min
This figure shows the co-authorship network connecting the top 25 collaborators of Zhixian Min. A scholar is included among the top collaborators of Zhixian Min based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zhixian Min. Zhixian Min is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 4 | |
| 2 | 1 | |
| 3 | 3 | |
| 4 | 10 | |
| 5 | 2 | |
| 6 | 9 | |
| 7 | 37 | |
| 8 | 1 | |
| 9 | 14 | |
| 10 | 57 | |
| 11 | 79 | |
| 12 | 35 | |
| 13 | 25 | |
| 14 | 19 | |
| 15 | 1 | |
| 16 | 4 | |
| 17 | 9 | |
| 18 | 9 | |
| 19 | 2 | |
| 20 | 14 |
About Zhixian Min
Zhixian Min is a scholar working on Mechanical Engineering, General Materials Science and Electrical and Electronic Engineering, having authored 29 papers that have together received 554 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (11 papers) and Solidification and crystal growth phenomena (9 papers). The work is most often cited by research in Mechanical Engineering (439 citations), General Materials Science (36 citations) and Electrical and Electronic Engineering (440 citations). Zhixian Min has collaborated with scholars based in China and Australia. Frequent co-authors include Xiaowu Hu, Yulong Li, Ke Li, Yi Liu, Hengzhi Fu, Jun Shen, Yi Liu, Xiao Yu, Yong Liu and Yi Liu. Their work appears in journals such as Journal of Alloys and Compounds, Journal of Crystal Growth and Applied Physics A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.