Zhixian Min

633 total citations
29 papers, 554 citations indexed

About

Zhixian Min is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Zhixian Min has authored 29 papers receiving a total of 554 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Mechanical Engineering, 19 papers in Electrical and Electronic Engineering and 10 papers in Materials Chemistry. Recurrent topics in Zhixian Min's work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (11 papers) and Solidification and crystal growth phenomena (9 papers). Zhixian Min is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (11 papers) and Solidification and crystal growth phenomena (9 papers). Zhixian Min collaborates with scholars based in China and Australia. Zhixian Min's co-authors include Xiaowu Hu, Yulong Li, Ke Li, Yi Liu, Hengzhi Fu, Jun Shen, Yi Liu, Xiao Yu, Yong Liu and Yi Liu and has published in prestigious journals such as Journal of Alloys and Compounds, Journal of Crystal Growth and Applied Physics A.

In The Last Decade

Zhixian Min

29 papers receiving 540 citations

Peers

Zhixian Min

EEE

GMS

Omid Mokhtari Japan

Moon Gi Cho South Korea

B. Kempf Germany

Zhong Sheng China

H. K. Kim United States

Flora Somidin Malaysia

A. Fawzy Egypt

D.C. Lin United States

Alice C. Kilgo United States

A. M. El-Taher Egypt

Omid Mokhtari Japan

Zhixian Min

739 ×1.7

EEE

610 ×1.4

52 ×0.5

116 ×1.1

44 ×1.2

GMS

Citations per year, relative to Zhixian Min Zhixian Min (= 1×) peers Omid Mokhtari

Countries citing papers authored by Zhixian Min

Since Specialization

Citations

This map shows the geographic impact of Zhixian Min's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zhixian Min with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zhixian Min more than expected).

Fields of papers citing papers by Zhixian Min

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Zhixian Min. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zhixian Min. The network helps show where Zhixian Min may publish in the future.

Co-authorship network of co-authors of Zhixian Min

This figure shows the co-authorship network connecting the top 25 collaborators of Zhixian Min. A scholar is included among the top collaborators of Zhixian Min based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zhixian Min. Zhixian Min is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Liu, Shaoyi, Hui Jin, Rui Zeng, et al.. (2023). Effects of interface cracks on reliability of surface mount technology interconnection in service environment. Microelectronics International. 40(2). 140–151. 4 indexed citations

Liu, Ming, Xiaozheng Liu, Zhixian Min, Bowen Wu, & Zongming Duan. (2020). Design and Implementation of a Compact Dual-band RF System-in-Package Module. 1–3. 1 indexed citations

Tian, Jun, Congsi Wang, Zhixian Min, et al.. (2020). A key parameters interval estimation method of the gold ribbon interconnect structure for the electrical performance of microwave modules. 1–5. 3 indexed citations

Min, Zhixian, Yu Qiu, Xiaowu Hu, & Haozhong Wang. (2019). Effect of Cu6Sn5 nanoparticles size on the properties of Sn0.3Ag0.7Cu nano-composite solders and joints. Journal of Materials Science Materials in Electronics. 30(15). 14726–14735. 10 indexed citations

Hu, Xiaowu, et al.. (2018). Synergetic effect of strain rate and electroplated Cu film for shear strength of solder/Kovar joints. Journal of Materials Science Materials in Electronics. 30(2). 1434–1449. 2 indexed citations

Liu, Xiaoli, et al.. (2018). Effect of electroplating parameters on electroplated Cu film and microvoid formation of solder joints. Journal of Materials Science Materials in Electronics. 29(21). 18404–18416. 9 indexed citations

Hu, Xiaowu, Tao Xu, Xiongxin Jiang, et al.. (2016). Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate. Applied Physics A. 122(4). 37 indexed citations

Min, Zhixian, et al.. (2015). Interfacial reaction and IMCs formation between Sn-0.7Cu solder and Cu substrate during reflow soldering. 541. 1367–1370. 1 indexed citations

Hu, Xiaowu, Qiang Huang, Yulong Li, Yi Liu, & Zhixian Min. (2015). A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions. Journal of Materials Science Materials in Electronics. 26(7). 5140–5151. 14 indexed citations

10.

Hu, Xiaowu, Yulong Li, Yong Liu, Yi Liu, & Zhixian Min. (2014). Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging. Microelectronics Reliability. 54(8). 1575–1582. 57 indexed citations

11.

Hu, Xiaowu, Yulong Li, & Zhixian Min. (2013). Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging. Journal of Alloys and Compounds. 582. 341–347. 79 indexed citations

12.

Hu, Xiaowu, Yulong Li, & Zhixian Min. (2013). Interfacial reaction and growth behavior of IMCs layer between Sn–58Bi solders and a Cu substrate. Journal of Materials Science Materials in Electronics. 24(6). 2027–2034. 35 indexed citations

13.

Hu, Xiaowu, Xiao Yu, Yulong Li, et al.. (2013). Effect of strain rate on interfacial fracture behaviors of Sn-58Bi/Cu solder joints. Journal of Materials Science Materials in Electronics. 25(1). 57–64. 25 indexed citations

14.

Hu, Xiaowu, Yulong Li, Ke Li, & Zhixian Min. (2013). Effect of Bi Segregation on the Asymmetrical Growth of Cu-Sn Intermetallic Compounds in Cu/Sn-58Bi/Cu Sandwich Solder Joints During Isothermal Aging. Journal of Electronic Materials. 42(12). 3567–3572. 19 indexed citations

15.

Min, Zhixian, et al.. (2011). MICROSTRUCTURAL EVOLUTION OF DIRECTIONALLY SOLIDIFIED Ni-BASED SUPERALLOY DZ125 UNDER HIGH TEMPERATURE GRADIENT. Acta Metallurgica Sinica. 47(4). 397–402. 1 indexed citations

16.

Min, Zhixian, et al.. (2011). Effect of traveling magnetic field on dendrite growth of Pb-Sn alloy during directional solidification. Transactions of Nonferrous Metals Society of China. 21(9). 1976–1980. 4 indexed citations

17.

Min, Zhixian, et al.. (2010). STUDY ON PARTITION RATIO AND SEGREGATION BEHAVIOR OF DZ125 ALLOY DURING DIRECTIONAL SOLIDIFICATION. Acta Metallurgica Sinica. 46(12). 1543–1548. 9 indexed citations

18.

Shen, Jun, et al.. (2010). Two phases separate growth in directionally solidified Fe–4.2Ni alloy. Materials Letters. 64(16). 1813–1815. 9 indexed citations

19.

Shen, Jun, et al.. (2010). EFFECTS OF PULLING RATE ON MICROSTRUCTURE EVOLUTION OF DIRECTIONALLY SOLIDIFIED Fe--4.2Ni ALLOY IN DIFFUSION REGIME. ACTA METALLURGICA SINICA. 46(3). 311–317. 2 indexed citations

20.

Shen, Jun, et al.. (2009). A band microstructure in directionally solidified hypo-peritectic Ti–45Al alloy. Materials Letters. 63(16). 1419–1421. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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