O. Vendier

1.1k total citations
80 papers, 772 citations indexed

About

O. Vendier is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Biomedical Engineering. According to data from OpenAlex, O. Vendier has authored 80 papers receiving a total of 772 indexed citations (citations by other indexed papers that have themselves been cited), including 69 papers in Electrical and Electronic Engineering, 16 papers in Atomic and Molecular Physics, and Optics and 14 papers in Biomedical Engineering. Recurrent topics in O. Vendier's work include Photonic and Optical Devices (23 papers), Semiconductor Lasers and Optical Devices (20 papers) and Advanced MEMS and NEMS Technologies (19 papers). O. Vendier is often cited by papers focused on Photonic and Optical Devices (23 papers), Semiconductor Lasers and Optical Devices (20 papers) and Advanced MEMS and NEMS Technologies (19 papers). O. Vendier collaborates with scholars based in France, United States and Germany. O. Vendier's co-authors include Jean-Louis Cazaux, N.M. Jokerst, Richard P. Leavitt, R. Plana, David Dubuc, Katia Grenier, Pierre Blondy, Aurélian Crunteanu, M.A. Brooke and L. Marchand and has published in prestigious journals such as Langmuir, IEEE Transactions on Microwave Theory and Techniques and Scripta Materialia.

In The Last Decade

O. Vendier

72 papers receiving 738 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
O. Vendier France 15 676 253 211 64 62 80 772
Ling Zhao China 14 440 0.7× 185 0.7× 167 0.8× 97 1.5× 78 1.3× 68 622
Thomas Wong United States 15 895 1.3× 93 0.4× 202 1.0× 145 2.3× 59 1.0× 85 1.0k
J. Ebel United States 13 535 0.8× 213 0.8× 226 1.1× 111 1.7× 31 0.5× 41 614
K. Ohwada Japan 15 785 1.2× 288 1.1× 333 1.6× 43 0.7× 34 0.5× 66 893
Wenxiao Fang China 17 812 1.2× 189 0.7× 64 0.3× 143 2.2× 74 1.2× 79 925
D.W. Berning United States 23 1.5k 2.2× 176 0.7× 155 0.7× 15 0.2× 53 0.9× 73 1.6k
M. Miller United States 13 528 0.8× 97 0.4× 105 0.5× 39 0.6× 69 1.1× 42 656
Brandon Pillans United States 13 898 1.3× 541 2.1× 270 1.3× 104 1.6× 21 0.3× 32 941
Marise Bafleur France 17 761 1.1× 157 0.6× 103 0.5× 14 0.2× 29 0.5× 92 855
P. Ancey France 20 928 1.4× 569 2.2× 385 1.8× 21 0.3× 98 1.6× 81 1.2k

Countries citing papers authored by O. Vendier

Since Specialization
Citations

This map shows the geographic impact of O. Vendier's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by O. Vendier with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites O. Vendier more than expected).

Fields of papers citing papers by O. Vendier

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by O. Vendier. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by O. Vendier. The network helps show where O. Vendier may publish in the future.

Co-authorship network of co-authors of O. Vendier

This figure shows the co-authorship network connecting the top 25 collaborators of O. Vendier. A scholar is included among the top collaborators of O. Vendier based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with O. Vendier. O. Vendier is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chevalier, Alexis, et al.. (2022). Three-Dimensional Printing of a Waveguide Termination for Millimeter Wave Applications. HAL (Le Centre pour la Communication Scientifique Directe). 555–558. 2 indexed citations
2.
Baco-Carles, Valérie, et al.. (2021). Selective laser powder bed fusion for manufacturing of 3D metal-ceramic multi-materials assemblies. Additive manufacturing. 50. 102550–102550. 14 indexed citations
3.
Tailhades, Philippe, et al.. (2013). Solder paste for highly dissipative power electronic assemblies. 1–5. 1 indexed citations
4.
Faqir, Mustapha, James W. Pomeroy, Tim Batten, et al.. (2013). Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite. Journal of Microelectronics and Electronic Packaging. 10(2). 54–58. 1 indexed citations
5.
Angelis, Giorgio De, Andrea Lucibello, Emanuela Proietti, et al.. (2012). RF MEMS ohmic switches for matrix configurations. International Journal of Microwave and Wireless Technologies. 4(4). 421–433. 10 indexed citations
6.
Faqir, Mustapha, Tim Batten, T. Mrotzek, et al.. (2011). Silver diamond composite as a new packaging solution: A thermo-mechanical stability study. 314–316. 2 indexed citations
7.
Cazaux, Jean-Louis, et al.. (2006). Prospective and issues for GaN microwave electronics into space satellites. 1. 1023–1026. 8 indexed citations
8.
Carchon, G., Anne Jourdain, O. Vendier, Joerg Schoebel, & H.A.C. Tilmans. (2005). Integration of 0/1-level packaged RF-MEMS devices on MCM-D at millimeter-wave frequencies. 2. 1664–1669. 2 indexed citations
9.
Mazenq, Laurent, David Dubuc, Katia Grenier, et al.. (2005). Modeling of the dielectric charging kinetic for capacitive RF-MEMS. IEEE MTT-S International Microwave Symposium Digest, 2005.. 757–760. 25 indexed citations
10.
Vendier, O., et al.. (2005). Optimised thermal and microwave packaging for wide-band gap transistors : diamond & flip chip. 2005 European Microwave Conference. 4 pp.–1486. 2 indexed citations
11.
Mercier, Denis, et al.. (2004). A DC to 100 GHz high performance ohmic shunt switch. 1931–1934. 35 indexed citations
12.
Chatras, Matthieu, Pierre Blondy, D. Cros, O. Vendier, & Jean-Louis Cazaux. (2003). A surface-mountable membrane supported filter. IEEE Microwave and Wireless Components Letters. 13(12). 535–537. 9 indexed citations
13.
Vendier, O., et al.. (2002). Microwave 3D concept for beam forming networks. ESASP. 507. 221. 2 indexed citations
14.
15.
Jung, Sungyong, et al.. (2002). 3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections. IV/27–IV/28. 2 indexed citations
16.
Vendier, O., Minah Lee, Sungyong Jung, et al.. (1999). A three-layer 3D silicon system using through-Si vertical optical interconnections and Si CMOS hybrid building blocks. IEEE Journal of Selected Topics in Quantum Electronics. 5(2). 276–286. 6 indexed citations
17.
Vendier, O., Minah Lee, N.M. Jokerst, M.A. Brooke, & Richard P. Leavitt. (1996). Integrated 200 Mbit/s receiver: silicon CMOS transimpedance amplifier with a thin film InGaAs photodetector. Conference on Lasers and Electro-Optics. 402–403. 1 indexed citations
18.
Vendier, O., et al.. (1996). Thin film pseudomorphic AlAs/In/sub 0.53/Ga/sub 0.47/As/InAs resonant tunnelling diodes integrated onto Si substrates. IEEE Electron Device Letters. 17(9). 443–445. 16 indexed citations
19.
Vendier, O., N.M. Jokerst, & Richard P. Leavitt. (1995). High-efficiency inverted MSM photodetectors. Conference on Lasers and Electro-Optics. 6 indexed citations
20.
Jokerst, N.M., et al.. (1995). <title>Smart detectors: devices, integration, circuits, and systems</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 2550. 212–223. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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