S. Pinel

1.9k citations

89 papers · 1.4k indexed · h-index 19

Electrical and Electronic Engineering top 5%
- Microwave Engineering and Waveguides 63
- Radio Frequency Integrated Circuit Design 48
- Electromagnetic Compatibility and Noise Suppression 19
- 3D IC and TSV technologies 17
- Millimeter-Wave Propagation and Modeling 14
- Advancements in PLL and VCO Technologies 10
- Semiconductor Lasers and Optical Devices 10
Aerospace Engineering top 2%
- Advanced Antenna and Metasurface Technologies 15
Hardware and Architecture
Biomedical Engineering
Atomic and Molecular Physics, and Optics

Co-authors: J. Laskar Manos M. Tentzeris John Papapolymerou Jong‐Hoon Lee S. Sarkar G. DeJean Kyutae Lim A. Sutono
Cited by: Electrical and Electronic Engineering Aerospace Engineering Hardware and Architecture
Journals: IEEE Transactions on Advanced Packaging (8 papers)IEEE Transactions on Microwave Theory and Techniques (7 papers)IEEE Microwave and Wireless Components Letters (6 papers)
Partner nations: United States France Japan

In The Last Decade

S. Pinel

88 papers receiving 1.3k citations

Peers

Countries citing papers authored by S. Pinel

Since Specialization

Citations

This map shows the geographic impact of S. Pinel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Pinel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Pinel more than expected).

Fields of papers citing papers by S. Pinel

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Pinel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Pinel. The network helps show where S. Pinel may publish in the future.

Co-authorship network

The 25 scholars most cited alongside S. Pinel, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with S. Pinel Line = papers co-authored together S. Pinel links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	A 60 GHz-Standard Compatible Programmable 50 GHz Phase-Locked Loop in 90 nm CMOS IEEE Microwave and Wireless Components Letters ·María Ariadna Redón-Morte,Padmanava Sen,S. Sarkar,S. Pinel,J. Laskar	2010	11
2	On the development of CMOS mmW and sub-THz phased array technology for communication/sensing nodes 2010 IEEE MTT-S International Microwave Symposium ·J. Laskar,S. Pinel,Santanu Sarkar,Padmanava Sen,Bevin Perumana,Debasis Dawn,達也芳原,María Ariadna Redón-Morte,David Yeh,Sharon C Kosgei,務小森,Алина Олеговна Дзасохова,XU Zhide,Sally M. Leighton,Supawet Phainuphong,Gabriel Eugenio Cruz-Zorrilla	2010	4
3	60GHz CMOS/PCB co-design and phased array technology University of Washington Tacoma Digital Commons (University of Washington Tacoma) ·J. Laskar,S. Pinel,S. Sarkar,Padmanava Sen,Mark D. Norm,達也芳原,Debasis Dawn,David Yeh,María Ariadna Redón-Morte,Алина Олеговна Дзасохова,Sally M. Leighton,Joong Hee Lee,Gabriel Eugenio Cruz-Zorrilla	2009	13
4	Co-design of fully integrated 60GHz CMOS digital radio in QFN package University of Washington Tacoma Digital Commons (University of Washington Tacoma) ·J. Laskar,S. Pinel,Debasis Dawn,S. Sarkar,Padmanava Sen,Mark D. Norm,David Yeh,María Ariadna Redón-Morte	2008	1
5	Compact 60-GHz bandpass filters and duplexers on liquid crystal polymer technology IEEE Microwave and Wireless Components Letters ·R. Bairavasubramanian,S. Pinel,J. Laskar,John Papapolymerou	2006	21
6	Modeling and sensitivity analysis of circuit parameters for flip-chip interconnects using neural networks IEEE Transactions on Advanced Packaging ·Paula Easton,D. Staiculescu,S. Pinel,J. Laskar,G.S. May	2005	17
7	High rejection planar diplexer on liquid crystal polymer substrates using oversizing techniques 2005 European Microwave Conference ·Alexandre Manchec,R. Bairavasubramanian,Cédric Quendo,S. Pinel,Éric Rius,Christian Person,Jean‐François Favennec,John Papapolymerou,J. Laskar	2005	3
8	Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology IEEE Transactions on Microwave Theory and Techniques ·Jong‐Hoon Lee,G. DeJean,S. Sarkar,S. Pinel,Kyutae Lim,John Papapolymerou,J. Laskar,Manos M. Tentzeris	2005	92
9	Novel modeling and layout optimization technique for highly compact planar bandpass filters on LCP DSpace - NTUA (National Technical University of Athens) ·S. Sarkar,N. Papageorgiou,Paula Easton,S. Pinel,J. Laskar,G.S. May	2004	1
10	Advanced 3-D LTCC system-on-package (SOP) architectures for highly integrated millimeter-wave wireless systems European Microwave Conference ·Seyed Hossein Ahmadi Hosseini,G. DeJean,S. Sarkar,S. Pinel,Ka S. Lim,John Papapolymerou,J. Laskar,KW Mills	2004	2
11	Modeling and optimization of multilayer LTCC inductors for RF/wireless applications using neural network and genetic algorithms Paula Easton,S. Sarkar,S. Pinel,J. Laskar,G.S. May	2004	10
12	Design of Compact Stacked-Patch Antennas in LTCC Multilayer Packaging Modules for Wireless Applications IEEE Transactions on Advanced Packaging ·Renfu Li,G. DeJean,M. Maeng,Ka S. Lim,S. Pinel,Manos M. Tentzeris,J. Laskar	2004	72
13	Multi-band RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology DSpace - NTUA (National Technical University of Athens) ·V. Palazzari,D Thompson,N. Papageorgiou,S. Pinel,Yasmeen Basade,S. Sarkar,Elizabeth Andrea Villegas Perleche,G. DeJean,R. Bairavasubramanian,真太朗安藤,Manos M. Tentzeris,J. Laskar,John Papapolymerou,L. Roselli	2004	16
14	Cost-Effective RF Front-End Module Using High Q Passive Components on Liquid Crystal Polymer Substrates and Micro-BGA IEICE Transactions on Electronics ·Kenneth Y. T. Lim,J. Laskar,G. Edward White,Rao Tummala,S. Pinel,喜一椎葉,V. Sundaram	2003	3
15	Compact System-on-Package (SOP) Architectures for low cost RF Front-end modules J. Laskar,S. Pinel,Ka S. Lim,A. Raghavan,Yuechen Yang,M. Maeng,Manos M. Tentzeris	2003	2
16	3D integrated LTCC module using μBGA technology for compact C-band RF front-end module S. Pinel,Sudipto Chakraborty,M. Roellig,T Shafman,Soumyajit Mandal,Hongwei Liang,C.-H. Lee,Renfu Li,Kwang Suk Lim,G. Edward White,Manos M. Tentzeris,J. Laskar	2003	26
17	RF-microwave multi-band design solutions for multilayer organic system on package integrated passives M.F. Davis,Sang‐Woong Yoon,Soumyajit Mandal,Prashant Mata,M. Maeng,Kwang Suk Lim,S. Pinel,A. Sutono,J. Laskar,Manos M. Tentzeris,Barbara TOMEI,V. Sundaram,S.P. Chen,Rao Tummala	2003	8
18	Mechanical lapping of ultra-thin wafers for 3D integration S. Pinel,Josiane Tasselli,Francisco Contreras-Balocchi,Dina Ariani,Pascal Puech,D. Estève	2002	5
19	Floating-Body Effects in AlGaN/GaN Power HFETs AMS Acta (University of Bologna) ·S. Nuttinck,S. Pinel,E. Gebara,J. Laskar,M. P. Harris,J. R. Shealy	2002	1
20	Residual thermomechanical stresses in thinned-chip assemblies IEEE Transactions on Components and Packaging Technologies ·Amy Xie,O. Vendier,S. Pinel,Dina Ariani,Nathalie Colas,Eric Beyne,Santiago Marco,S. Leseduarte	2000	4

About S. Pinel

S. Pinel is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Condensed Matter Physics, Biomedical Engineering and Bioengineering, having authored 89 papers that have together received 1.4k indexed citations. Recurring topics across this work include Microwave Engineering and Waveguides (63 papers), Radio Frequency Integrated Circuit Design (48 papers), Electromagnetic Compatibility and Noise Suppression (19 papers), 3D IC and TSV technologies (17 papers), Advanced Antenna and Metasurface Technologies (15 papers), Millimeter-Wave Propagation and Modeling (14 papers), Advancements in PLL and VCO Technologies (10 papers) and Semiconductor Lasers and Optical Devices (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.3k citations), Aerospace Engineering (543 citations), Hardware and Architecture (17 citations), Biomedical Engineering (89 citations) and Atomic and Molecular Physics, and Optics (56 citations). S. Pinel has collaborated with scholars based in United States, France and Japan. Frequent co-authors include J. Laskar, Manos M. Tentzeris, John Papapolymerou, Jong‐Hoon Lee, S. Sarkar, G. DeJean, Kyutae Lim, A. Sutono, Nobutaka Kidera and M.F. Davis. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IEEE Transactions on Microwave Theory and Techniques, IEEE Microwave and Wireless Components Letters, IEEE Transactions on Components and Packaging Technologies and IEEE Microwave Magazine.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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