T. Mrotzek

667 total citations
21 papers, 494 citations indexed

About

T. Mrotzek is a scholar working on Mechanical Engineering, Materials Chemistry and Mechanics of Materials. According to data from OpenAlex, T. Mrotzek has authored 21 papers receiving a total of 494 indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Mechanical Engineering, 13 papers in Materials Chemistry and 5 papers in Mechanics of Materials. Recurrent topics in T. Mrotzek's work include Advanced materials and composites (8 papers), Thermal properties of materials (4 papers) and Fusion materials and technologies (4 papers). T. Mrotzek is often cited by papers focused on Advanced materials and composites (8 papers), Thermal properties of materials (4 papers) and Fusion materials and technologies (4 papers). T. Mrotzek collaborates with scholars based in Austria, Germany and United Kingdom. T. Mrotzek's co-authors include A. Hoffmann, Ulrich Martin, J. Reiser, M. Klimenkov, U. Jäntsch, M. Rieth, J. Hoffmann, Carsten Bonnekoh, Simon Bonk and A. Möslang and has published in prestigious journals such as Journal of Alloys and Compounds, Journal of Nuclear Materials and Advanced Engineering Materials.

In The Last Decade

T. Mrotzek

20 papers receiving 476 citations

Peers

Countries citing papers authored by T. Mrotzek

Since Specialization

Citations

This map shows the geographic impact of T. Mrotzek's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Mrotzek with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Mrotzek more than expected).

Fields of papers citing papers by T. Mrotzek

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Mrotzek. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Mrotzek. The network helps show where T. Mrotzek may publish in the future.

Co-authorship network of co-authors of T. Mrotzek

This figure shows the co-authorship network connecting the top 25 collaborators of T. Mrotzek. A scholar is included among the top collaborators of T. Mrotzek based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Mrotzek. T. Mrotzek is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Thermal management materials based on molybdenum (Mo) and copper (Cu): Elucidation of the rolling-induced evolution of thermo-physical properties (e.g. CTE) 2018 ·Journal of Alloys and Compounds ·J. Reiser, A. Hoffmann, (unknown), U. Jäntsch, M. Klimenkov, Jörg Hohe, T. Mrotzek	29
2	Einfluß der Warmumformung auf die Gefügebildung und Festigkeit der Molybdänlegierung TZM 2018 ·Repository KITopen (Karlsruhe Institute of Technology) ·T. Mrotzek	1
3	Reliable Residual Stress Analysis for Thin Metal Sheets by Incremental Hole Drilling 2018 ·Materials Performance and Characterization ·(unknown), T. Mrotzek, Jens Gibmeier	4
4	The interface in molybdenum-copper-composites used for thermal management applications 2017 ·(unknown), T. Mrotzek, U. Jäntsch, M. Klimenkov, J. Reiser, W. Knabl	10
5	Ductilisation of tungsten (W): On the increase of strength AND room-temperature tensile ductility through cold-rolling 2016 ·International Journal of Refractory Metals and Hard Materials ·J. Reiser, J. Hoffmann, U. Jäntsch, M. Klimenkov, Simon Bonk, Carsten Bonnekoh, A. Hoffmann, T. Mrotzek, M. Rieth	62
6	Properties and reliability of molybdenum-copper-composites for thermal management applications 2016 ·Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·(unknown), T. Mrotzek, (unknown), W. Knabl	4
7	Thermophysical Properties of Molybdenum Copper Multilayer Composites for Thermal Management Applications 2015 ·Materials science forum ·(unknown), T. Mrotzek, (unknown), W. Knabl	5
8	Ductilisation of tungsten (W): On the shift of the brittle-to-ductile transition (BDT) to lower temperatures through cold rolling 2015 ·International Journal of Refractory Metals and Hard Materials ·J. Reiser, J. Hoffmann, U. Jäntsch, M. Klimenkov, Simon Bonk, Carsten Bonnekoh, M. Rieth, A. Hoffmann, T. Mrotzek	127
9	Influence of packaging materials on GaN RF power devices 2015 ·(unknown), (unknown), H. Blanck, K. Beilenhoff, D. Floriot, Martin Kuball, T. Mrotzek, (unknown), (unknown), (unknown)	0
10	Tungsten (W) Laminate Pipes for Innovative High Temperature Energy Conversion Systems 2014 ·Advanced Engineering Materials ·J. Reiser, M. Rieth, A. Möslang, H. Greuner, David E.J. Armstrong, Thorsten Denk, (unknown), W. Hering, A. Hoffmann, J. Hoffmann, H. Leiste, T. Mrotzek, Reinhard Pıppan, W. Schulmeyer, Tobias Weingärtner, (unknown)	34
11	Tungsten foil laminate for structural divertor applications – Joining of tungsten foils 2013 ·Journal of Nuclear Materials ·J. Reiser, M. Rieth, A. Möslang, B. Dafferner, J. Hoffmann, T. Mrotzek, A. Hoffmann, David E.J. Armstrong, Xiaoou Yi	29
12	Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite 2013 ·Journal of Microelectronics and Electronic Packaging ·Mustapha Faqir, James W. Pomeroy, Tim Batten, T. Mrotzek, (unknown), O. Vendier, (unknown), (unknown), (unknown), Jean-Michel Desmarres, (unknown), Martin Kuball	1
13	Improved thermal management for GaN power electronics: Silver diamond composite packages 2012 ·Microelectronics Reliability ·Mustapha Faqir, Tim Batten, T. Mrotzek, (unknown), (unknown), (unknown), (unknown), (unknown), O. Vendier, (unknown)	20
14	Silver diamond composite as a new packaging solution: A thermo-mechanical stability study 2011 ·Mustapha Faqir, Tim Batten, T. Mrotzek, (unknown), (unknown), (unknown), (unknown), O. Vendier, Jean-Michel Desmarres, (unknown), Martin Kuball	2
15	Novel packaging solutions for GaN power electronics: Silver-diamond composite packages 2010 ·Mustapha Faqir, Tim Batten, T. Mrotzek, (unknown), (unknown), (unknown), (unknown), (unknown), H. Blanck, (unknown), O. Vendier, Martin Kuball	9
16	Thermally activated flow stress component of the Mo alloy TZM determined by constitutive models 2010 ·International Journal of Refractory Metals and Hard Materials ·Christian Schimpf, T. Mrotzek, Martin Urík	9
17	Investigation of solid solution hardening in molybdenum alloys 2010 ·International Journal of Refractory Metals and Hard Materials ·(unknown), A. Hoffmann, T. Mrotzek, Ulrich Martin	53
18	New GaN Power-Electronics Packaging Solutions: A Thermal Analysis using Raman Thermography 2010 ·IMAPSource Proceedings ·Mustapha Faqir, (unknown), T. Mrotzek, (unknown), (unknown), (unknown), H. Blanck, (unknown), O. Vendier, Martin Kuball	1
19	Evolution of Microstructure during Hot Deformation of the PM Molybdenum Alloy TZM 2007 ·Materials science forum ·T. Mrotzek, A. Hoffmann, Ulrich Martin, H. Oettel	5
20	Hardening mechanisms and recrystallization behaviour of several molybdenum alloys 2005 ·International Journal of Refractory Metals and Hard Materials ·T. Mrotzek, A. Hoffmann, Ulrich Martin	78

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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