Nitesh Kumbhat
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering
- Mechanical Engineering
- Automotive Engineering top 10%
- Computational Mechanics
- Co-authors
- Rao TummalaVenky SundaramFuhan LiuQiao ChenVijay SukumaranTapobrata BandyopadhyayP. Markondeya RajLage Jonsson
- Topics
- 3D IC and TSV technologies (22 papers)Electronic Packaging and Soldering Technologies (20 papers)Electromagnetic Compatibility and Noise Suppression (6 papers)
- Journals
- IEEE Transactions on Advanced PackagingIEEE Transactions on Components Packaging and Manufacturing Technologysteel research international
- Partner nations
- United StatesGermanyFrance
In The Last Decade
Nitesh Kumbhat
29 papers receiving 447 citations
Peers
Comparison fields: 5 of 33
- Electrical and Electronic Engineering 398
- Biomedical Engineering 109
- Mechanical Engineering 58
- Automotive Engineering 55
- Computational Mechanics 41
Countries citing papers authored by Nitesh Kumbhat
This map shows the geographic impact of Nitesh Kumbhat's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nitesh Kumbhat with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nitesh Kumbhat more than expected).
Fields of papers citing papers by Nitesh Kumbhat
This network shows the impact of papers produced by Nitesh Kumbhat. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nitesh Kumbhat. The network helps show where Nitesh Kumbhat may publish in the future.
Co-authorship network of co-authors of Nitesh Kumbhat
This figure shows the co-authorship network connecting the top 25 collaborators of Nitesh Kumbhat. A scholar is included among the top collaborators of Nitesh Kumbhat based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Nitesh Kumbhat. Nitesh Kumbhat is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 5 | |
| 3 | 9 | |
| 4 | 5 | |
| 5 | 3 | |
| 6 | 3 | |
| 7 | 7 | |
| 8 | 9 | |
| 9 | 6 | |
| 10 | 6 | |
| 11 | 71 | |
| 12 | 101 | |
| 13 | 2 | |
| 14 | 16 | |
| 15 | 24 | |
| 16 | 46 | |
| 17 | 5 | |
| 18 | 1 | |
| 19 | 2 | |
| 20 | 10 |
About Nitesh Kumbhat
Nitesh Kumbhat is a scholar working on Electrical and Electronic Engineering, Ceramics and Composites and Biomedical Engineering, having authored 31 papers that have together received 475 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (20 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (398 citations), Ecological Modeling (20 citations) and Automotive Engineering (55 citations). Nitesh Kumbhat has collaborated with scholars based in United States, Germany and France. Frequent co-authors include Rao Tummala, Venky Sundaram, Fuhan Liu, Qiao Chen, Vijay Sukumaran, Tapobrata Bandyopadhyay, P. Markondeya Raj, Lage Jonsson, Sung-Hwan Min and Pär G. Jönsson. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology and steel research international.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.