Nitesh Kumbhat

585 total citations
31 papers, 475 citations indexed

About

Nitesh Kumbhat is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Nitesh Kumbhat has authored 31 papers receiving a total of 475 indexed citations (citations by other indexed papers that have themselves been cited), including 28 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 5 papers in Mechanical Engineering. Recurrent topics in Nitesh Kumbhat's work include 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (20 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). Nitesh Kumbhat is often cited by papers focused on 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (20 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). Nitesh Kumbhat collaborates with scholars based in United States, Germany and France. Nitesh Kumbhat's co-authors include Rao Tummala, Venky Sundaram, Fuhan Liu, Qiao Chen, P. Markondeya Raj, Tapobrata Bandyopadhyay, Vijay Sukumaran, Lage Jonsson, Pär G. Jönsson and Sung-Hwan Min and has published in prestigious journals such as IEEE Transactions on Advanced Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology and steel research international.

In The Last Decade

Nitesh Kumbhat

29 papers receiving 447 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Nitesh Kumbhat United States 11 398 109 58 55 41 31 475
Jan Felba Poland 11 314 0.8× 127 1.2× 94 1.6× 75 1.4× 12 0.3× 81 416
Woon‐Seong Kwon South Korea 15 450 1.1× 88 0.8× 72 1.2× 40 0.7× 7 0.2× 30 487
Klaus-Juergen Wolter Germany 12 318 0.8× 62 0.6× 164 2.8× 17 0.3× 8 0.2× 48 393
Jana D. Abou Ziki Canada 8 345 0.9× 322 3.0× 267 4.6× 16 0.3× 53 1.3× 18 411
Tiwei Wei United States 15 190 0.5× 58 0.5× 332 5.7× 25 0.5× 108 2.6× 50 502
Akash Subhash Awale India 12 153 0.4× 133 1.2× 312 5.4× 8 0.1× 12 0.3× 24 337
Myung-Jin Yim South Korea 10 524 1.3× 124 1.1× 114 2.0× 23 0.4× 9 0.2× 25 557
Héctor Plascencia‐Mora Mexico 10 72 0.2× 58 0.5× 157 2.7× 10 0.2× 23 0.6× 28 289
Charles Arvin United States 8 136 0.3× 99 0.9× 292 5.0× 11 0.2× 30 0.7× 22 330

Countries citing papers authored by Nitesh Kumbhat

Since Specialization
Citations

This map shows the geographic impact of Nitesh Kumbhat's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nitesh Kumbhat with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nitesh Kumbhat more than expected).

Fields of papers citing papers by Nitesh Kumbhat

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Nitesh Kumbhat. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nitesh Kumbhat. The network helps show where Nitesh Kumbhat may publish in the future.

Co-authorship network of co-authors of Nitesh Kumbhat

This figure shows the co-authorship network connecting the top 25 collaborators of Nitesh Kumbhat. A scholar is included among the top collaborators of Nitesh Kumbhat based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Nitesh Kumbhat. Nitesh Kumbhat is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Parker, Reed, et al.. (2014). Effects of FBAR resonator dissipated power on discrete oscillator phase noise. 93–96. 2 indexed citations
2.
3.
Suzuki, Yuya, Srikrishna Sitaraman, Fuhan Liu, et al.. (2012). Low cost system-in-package module using next generation low loss organic material. 1412–1417. 5 indexed citations
4.
Kumar, Gokul, Srikrishna Sitaraman, Fuhan Liu, et al.. (2012). Modeling and design of an ultra-miniaturized WLAN sub-system with chip-last embedded PA and digital dies. 1015–1022. 3 indexed citations
5.
Kumbhat, Nitesh, et al.. (2012). Chip-last fan-out package with embedded power ICs in ultra-thin laminates. 14. 1372–1377. 3 indexed citations
6.
Kumbhat, Nitesh, et al.. (2012). Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(9). 1434–1441. 7 indexed citations
7.
Kumbhat, Nitesh, et al.. (2011). Low cost, chip-last embedded ICs in thin organic cores. 43–47. 9 indexed citations
8.
Sitaraman, Srikrishna, Nitesh Kumbhat, Fuhan Liu, et al.. (2011). Ultra-miniaturized WLAN RF receiver with chip-last GaAs embedded active. University of Washington Tacoma Digital Commons (University of Washington Tacoma). 33. 1371–1376. 6 indexed citations
9.
Raj, P. Markondeya, Nitesh Kumbhat, Yushu Wang, et al.. (2011). Co-W as an advanced barrier for intermetallics and electromigration in fine-pitch flipchip interconnections. 916–920. 6 indexed citations
10.
Sukumaran, Vijay, Tapobrata Bandyopadhyay, Qiao Chen, et al.. (2011). Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias. 583–588. 71 indexed citations
11.
Sukumaran, Vijay, Qiao Chen, Fuhan Liu, et al.. (2010). Through-package-via formation and metallization of glass interposers. 557–563. 101 indexed citations
12.
Kumbhat, Nitesh, P. Markondeya Raj, Rongwei Zhang, et al.. (2010). Low temperature, low profile, ultra-fine pitch copper-to-copper chip-last embedded-active interconnection technology. 350–356. 16 indexed citations
13.
Raj, P. Markondeya, et al.. (2010). Co-electrodeposited graphite and diamond-loaded solder nanocomposites as thermal interface materials. 87. 1708–1712. 2 indexed citations
14.
Liu, Fuhan, Venky Sundaram, Sung-Hwan Min, et al.. (2010). Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications. 758–763. 24 indexed citations
15.
Kumbhat, Nitesh, M. Raine, P. Markondeya Raj, et al.. (2009). Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF. 19. 1479–1485. 18 indexed citations
16.
Kumbhat, Nitesh, et al.. (2007). Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging. IEEE Transactions on Advanced Packaging. 30(4). 641–653.
17.
Kumbhat, Nitesh, P.M. Raj, Raghuram V. Pucha, et al.. (2005). Recent Advances in Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging Applications. 2. 1364–1372. 5 indexed citations
18.
Kumbhat, Nitesh, P. Markondeya Raj, Raghuram V. Pucha, et al.. (2004). Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly. 1843–1850. 10 indexed citations
19.
Kumbhat, Nitesh, S. Hegde, P. Markondeya Raj, et al.. (2004). Novel board material technology for next-generation packaging. 247–252. 1 indexed citations
20.
Kumbhat, Nitesh, P. Markondeya Raj, Shubhra Bansal, et al.. (2004). New package/board materials technology for next-generation convergent microsystems. 331–335. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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