Gokul Kumar

485 total citations
15 papers, 243 citations indexed

About

Gokul Kumar is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Aerospace Engineering. According to data from OpenAlex, Gokul Kumar has authored 15 papers receiving a total of 243 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Electrical and Electronic Engineering, 5 papers in Biomedical Engineering and 3 papers in Aerospace Engineering. Recurrent topics in Gokul Kumar's work include 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (6 papers) and Nanofabrication and Lithography Techniques (4 papers). Gokul Kumar is often cited by papers focused on 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (6 papers) and Nanofabrication and Lithography Techniques (4 papers). Gokul Kumar collaborates with scholars based in United States, South Korea and India. Gokul Kumar's co-authors include Rao Tummala, Venky Sundaram, Yuya Suzuki, Vijay Sukumaran, Kaya Demir, Yoichiro Sato, Qiao Chen, Tapobrata Bandyopadhyay, Sung Kyu Lim and Fuhan Liu and has published in prestigious journals such as SHILAP Revista de lepidopterología, Materials Science in Semiconductor Processing and IEEE Transactions on Components Packaging and Manufacturing Technology.

In The Last Decade

Gokul Kumar

12 papers receiving 232 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Gokul Kumar United States 6 223 48 22 19 12 15 243
Bahareh Banijamali United States 9 295 1.3× 70 1.5× 35 1.6× 27 1.4× 10 0.8× 15 314
H.Y. Li Singapore 10 304 1.4× 77 1.6× 44 2.0× 35 1.8× 10 0.8× 35 328
Josef Weber Germany 8 295 1.3× 59 1.2× 48 2.2× 12 0.6× 8 0.7× 20 323
T. Enot France 10 241 1.1× 93 1.9× 58 2.6× 11 0.6× 3 0.3× 21 278
Xiaopeng Xu United States 10 342 1.5× 111 2.3× 25 1.1× 27 1.4× 4 0.3× 36 373
K. Soejima Japan 8 272 1.2× 46 1.0× 33 1.5× 30 1.6× 3 0.3× 16 297
A. Sharma United States 6 327 1.5× 46 1.0× 47 2.1× 29 1.5× 4 0.3× 8 362
Curtis Zwenger United States 9 282 1.3× 35 0.7× 41 1.9× 30 1.6× 4 0.3× 9 293
Siddharth Ravichandran United States 12 287 1.3× 50 1.0× 22 1.0× 18 0.9× 65 5.4× 24 327
Riko Radojcic United States 11 282 1.3× 38 0.8× 37 1.7× 13 0.7× 4 0.3× 45 312

Countries citing papers authored by Gokul Kumar

Since Specialization
Citations

This map shows the geographic impact of Gokul Kumar's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Gokul Kumar with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Gokul Kumar more than expected).

Fields of papers citing papers by Gokul Kumar

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Gokul Kumar. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Gokul Kumar. The network helps show where Gokul Kumar may publish in the future.

Co-authorship network of co-authors of Gokul Kumar

This figure shows the co-authorship network connecting the top 25 collaborators of Gokul Kumar. A scholar is included among the top collaborators of Gokul Kumar based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Gokul Kumar. Gokul Kumar is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

15 of 15 papers shown
1.
2.
Xing, Fa, et al.. (2024). Investigation on memory package crack and prevention under temperature cycling test. Materials Science in Semiconductor Processing. 180. 108560–108560. 3 indexed citations
3.
4.
Subramanian, K. N., et al.. (2023). Effect of Isometric Exercises (Quadriceps Strengthening) in Patients with Osteoarthritis Knee. SHILAP Revista de lepidopterología. 5(1). 20–23. 1 indexed citations
5.
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Kumar, Gokul, Srikrishna Sitaraman, Jonghyun Cho, et al.. (2015). Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages. IEEE Transactions on Components Packaging and Manufacturing Technology. 6(1). 87–99. 15 indexed citations
7.
8.
Sukumaran, Vijay, Gokul Kumar, Yuya Suzuki, et al.. (2014). Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(5). 786–795. 107 indexed citations
9.
Chen, Qiao, Yuya Suzuki, Gokul Kumar, Venky Sundaram, & Rao Tummala. (2014). Modeling, Fabrication, and Characterization of Low-Cost and High-Performance Polycrystalline Panel-Based Silicon Interposer With Through Vias and Redistribution Layers. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(12). 2035–2041. 23 indexed citations
10.
Kumar, Gokul, Srikrishna Sitaraman, Jonghyun Cho, et al.. (2013). Power delivery network analysis of 3D double-side glass interposers for high bandwidth applications. 1100–1108. 7 indexed citations
11.
Kumar, Gokul, et al.. (2013). MPI based cluster computing for performance evaluation of parallel applications. 1. 1123–1128. 3 indexed citations
12.
Kumar, Gokul, Srikrishna Sitaraman, Fuhan Liu, et al.. (2012). Modeling and design of an ultra-miniaturized WLAN sub-system with chip-last embedded PA and digital dies. 1015–1022. 3 indexed citations
13.
Sundaram, Venky, Qiao Chen, Yuya Suzuki, et al.. (2012). Low-cost and low-loss 3D silicon interposer for high bandwidth logic-to-memory interconnections without TSV in the logic IC. 292–297. 32 indexed citations
14.
Kumar, Gokul, Tapobrata Bandyopadhyay, Vijay Sukumaran, et al.. (2011). Ultra-high I/O density glass/silicon interposers for high bandwidth smart mobile applications. 217–223. 43 indexed citations
15.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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