Tiwei Wei

756 total citations
50 papers, 502 citations indexed

About

Tiwei Wei is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Computational Mechanics. According to data from OpenAlex, Tiwei Wei has authored 50 papers receiving a total of 502 indexed citations (citations by other indexed papers that have themselves been cited), including 29 papers in Mechanical Engineering, 23 papers in Electrical and Electronic Engineering and 10 papers in Computational Mechanics. Recurrent topics in Tiwei Wei's work include Heat Transfer and Optimization (23 papers), Heat Transfer Mechanisms (22 papers) and 3D IC and TSV technologies (15 papers). Tiwei Wei is often cited by papers focused on Heat Transfer and Optimization (23 papers), Heat Transfer Mechanisms (22 papers) and 3D IC and TSV technologies (15 papers). Tiwei Wei collaborates with scholars based in United States, Belgium and China. Tiwei Wei's co-authors include Vladimir Cherman, Eric Beyne, Herman Oprins, Martine Baelmans, Ingrid De Wolf, Jun Qian, Mehdi Asheghi, Man Prakash Gupta, Kenneth E. Goodson and M.W. Degner and has published in prestigious journals such as Journal of Applied Physics, IEEE Transactions on Power Electronics and International Journal of Heat and Mass Transfer.

In The Last Decade

Tiwei Wei

38 papers receiving 490 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tiwei Wei United States 15 332 190 108 69 58 50 502
Min-Soo Kang South Korea 11 241 0.7× 165 0.9× 69 0.6× 36 0.5× 44 0.8× 39 418
Kevin Bennion United States 14 284 0.9× 245 1.3× 59 0.5× 52 0.8× 28 0.5× 39 450
Daeyoung Kong South Korea 12 303 0.9× 81 0.4× 92 0.9× 28 0.4× 61 1.1× 49 424
U. Kloter Switzerland 10 592 1.8× 205 1.1× 182 1.7× 27 0.4× 90 1.6× 13 722
Hamed Mohaddes Deylami Iran 12 162 0.5× 203 1.1× 162 1.5× 89 1.3× 95 1.6× 38 443
Liqiang Deng China 11 536 1.6× 64 0.3× 94 0.9× 73 1.1× 72 1.2× 12 618
Daniel P. Rini United States 12 393 1.2× 182 1.0× 431 4.0× 56 0.8× 48 0.8× 26 625
Vadim Gektin United States 9 230 0.7× 211 1.1× 30 0.3× 33 0.5× 39 0.7× 28 413
Yiwen Fan China 10 222 0.7× 52 0.3× 71 0.7× 39 0.6× 80 1.4× 15 353
Ignacio Lope Spain 14 452 1.4× 724 3.8× 32 0.3× 36 0.5× 53 0.9× 56 829

Countries citing papers authored by Tiwei Wei

Since Specialization
Citations

This map shows the geographic impact of Tiwei Wei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tiwei Wei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tiwei Wei more than expected).

Fields of papers citing papers by Tiwei Wei

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tiwei Wei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tiwei Wei. The network helps show where Tiwei Wei may publish in the future.

Co-authorship network of co-authors of Tiwei Wei

This figure shows the co-authorship network connecting the top 25 collaborators of Tiwei Wei. A scholar is included among the top collaborators of Tiwei Wei based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tiwei Wei. Tiwei Wei is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wei, Tiwei, et al.. (2025). Multi-chip Jet impingement cooling for heat dissipation in 2.5D integrated system with 1 kW+ thermal design power. International Journal of Heat and Mass Transfer. 244. 126978–126978. 3 indexed citations
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Beechem, Thomas E., et al.. (2025). Scaling effects on the microstructure and thermomechanical response of through silicon vias (TSVs). Journal of Applied Physics. 137(8). 4 indexed citations
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Wei, Tiwei, et al.. (2025). Direct-on-chip two-phase jet impingement cooling of multichip packages: Distributed inlet-outlet nozzles. International Journal of Heat and Mass Transfer. 252. 127514–127514.
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Wei, Tiwei, et al.. (2025). Exploring Efficient Thermal Management Solutions for Backside Power Delivery Network (BSPDN) Systems Using Multiscale Modeling. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(6). 1237–1247.
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Wei, Tiwei, et al.. (2024). Experimental Investigation of a Compact Lid-Compatible Multijet Impingement Manifold for Direct-On-Chip Cooling. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(4). 748–756. 2 indexed citations
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Wei, Tiwei, Hao Chen, Man Prakash Gupta, et al.. (2023). Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module. Journal of Electronic Packaging. 146(1). 20 indexed citations
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Wei, Tiwei, et al.. (2022). Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling. International Journal of Heat and Mass Transfer. 197. 123356–123356. 19 indexed citations
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Wei, Tiwei, Herman Oprins, Liang Fang, et al.. (2021). Heat transfer and pressure drop correlations for direct on-chip microscale jet impingement cooling with alternating feeding and draining jets. International Journal of Heat and Mass Transfer. 182. 121865–121865. 18 indexed citations
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Wei, Tiwei, Herman Oprins, Vladimir Cherman, et al.. (2020). Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications. 1422–1429. 8 indexed citations
17.
Wei, Tiwei, Herman Oprins, Vladimir Cherman, et al.. (2019). First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet Hotspot-Targeted Cooler for High Power Applications. Lirias. 126–134. 6 indexed citations
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Wei, Tiwei, Herman Oprins, Vladimir Cherman, et al.. (2018). NOZZLE ARRAY SCALING EFFECTS ON THE THERMAL/HYDRAULIC PERFORMANCE OF LIQUID JET IMPINGEMENT COOLERS FOR HIGH PERFORMANCE ELECTRONIC APPLICATIONS. International Heat Transfer Conference 16. 4 indexed citations
19.
Wei, Tiwei, Herman Oprins, Vladimir Cherman, et al.. (2017). High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler. Lirias (KU Leuven). 32.5.1–32.5.4. 27 indexed citations
20.
Wei, Tiwei, Qian Wang, Jian Cai, et al.. (2014). Performance and reliability study of TGV interposer in 3D integration. 601–605. 17 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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