Vijay Sukumaran
- Electrical and Electronic Engineering top 5%
- Biomedical Engineering
- Automotive Engineering top 10%
- Electronic, Optical and Magnetic Materials
- Computational Mechanics
- Co-authors
- Rao TummalaVenky SundaramTapobrata BandyopadhyayYoichiro SatoQiao ChenGokul KumarYuya SuzukiNitesh Kumbhat
- Topics
- 3D IC and TSV technologies (11 papers)Electronic Packaging and Soldering Technologies (7 papers)Nanofabrication and Lithography Techniques (6 papers)
- Journals
- Journal of Materials Science Materials in ElectronicsIEEE Transactions on Components Packaging and Manufacturing TechnologyIMAPSource Proceedings
- Partner nations
- United StatesJapanFrance
In The Last Decade
Vijay Sukumaran
14 papers receiving 659 citations
Peers
Comparison fields: 5 of 32
- Electrical and Electronic Engineering 663
- Biomedical Engineering 185
- Automotive Engineering 79
- Electronic, Optical and Magnetic Materials 63
- Computational Mechanics 48
Countries citing papers authored by Vijay Sukumaran
This map shows the geographic impact of Vijay Sukumaran's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Vijay Sukumaran with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Vijay Sukumaran more than expected).
Fields of papers citing papers by Vijay Sukumaran
This network shows the impact of papers produced by Vijay Sukumaran. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Vijay Sukumaran. The network helps show where Vijay Sukumaran may publish in the future.
Co-authorship network of co-authors of Vijay Sukumaran
This figure shows the co-authorship network connecting the top 25 collaborators of Vijay Sukumaran. A scholar is included among the top collaborators of Vijay Sukumaran based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Vijay Sukumaran. Vijay Sukumaran is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 10 | |
| 2 | 21 | |
| 3 | 107 | |
| 4 | 20 | |
| 5 | 12 | |
| 6 | 24 | |
| 7 | 2 | |
| 8 | 209 | |
| 9 | 43 | |
| 10 | 71 | |
| 11 | 8 | |
| 12 | 34 | |
| 13 | 101 | |
| 14 | 49 |
About Vijay Sukumaran
Vijay Sukumaran is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Biomedical Engineering, having authored 14 papers that have together received 711 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (7 papers) and Nanofabrication and Lithography Techniques (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (663 citations), Automotive Engineering (79 citations) and Biomedical Engineering (185 citations). Vijay Sukumaran has collaborated with scholars based in United States, Japan and France. Frequent co-authors include Rao Tummala, Venky Sundaram, Tapobrata Bandyopadhyay, Yoichiro Sato, Qiao Chen, Gokul Kumar, Yuya Suzuki, Nitesh Kumbhat, Fuhan Liu and Kaya Demir. Their work appears in journals such as Journal of Materials Science Materials in Electronics, IEEE Transactions on Components Packaging and Manufacturing Technology and IMAPSource Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.