Vijay Sukumaran

1.1k total citations
14 papers, 711 citations indexed

About

Vijay Sukumaran is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Vijay Sukumaran has authored 14 papers receiving a total of 711 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 4 papers in Automotive Engineering. Recurrent topics in Vijay Sukumaran's work include 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (7 papers) and Nanofabrication and Lithography Techniques (6 papers). Vijay Sukumaran is often cited by papers focused on 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (7 papers) and Nanofabrication and Lithography Techniques (6 papers). Vijay Sukumaran collaborates with scholars based in United States, Japan and France. Vijay Sukumaran's co-authors include Rao Tummala, Venky Sundaram, Tapobrata Bandyopadhyay, Yoichiro Sato, Qiao Chen, Nitesh Kumbhat, Fuhan Liu, Gokul Kumar, Yuya Suzuki and Kaya Demir and has published in prestigious journals such as Journal of Materials Science Materials in Electronics, IEEE Transactions on Components Packaging and Manufacturing Technology and IMAPSource Proceedings.

In The Last Decade

Vijay Sukumaran

14 papers receiving 659 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Vijay Sukumaran United States	11	663	185	79	63	48	14	711
Tapobrata Bandyopadhyay United States	11	753 1.1×	137 0.7×	71 0.9×	65 1.0×	33 0.7×	12	791
Scott Pollard United States	14	338 0.5×	84 0.5×	57 0.7×	54 0.9×	20 0.4×	39	380
Nitesh Kumbhat United States	11	398 0.6×	109 0.6×	55 0.7×	41 0.7×	41 0.9×	31	475
Kenneth June Rebibis Belgium	14	513 0.8×	167 0.9×	102 1.3×	43 0.7×	11 0.2×	76	554
Navas Khan Singapore	15	545 0.8×	132 0.7×	137 1.7×	41 0.7×	49 1.0×	46	666
Ser Choong Chong Singapore	12	446 0.7×	99 0.5×	60 0.8×	46 0.7×	11 0.2×	96	488
E.B. Liao Singapore	14	465 0.7×	157 0.8×	80 1.0×	38 0.6×	9 0.2×	35	530
Vasarla Nagendra Sekhar Singapore	11	417 0.6×	80 0.4×	65 0.8×	50 0.8×	8 0.2×	64	456
David Ho Singapore	12	583 0.9×	113 0.6×	32 0.4×	94 1.5×	9 0.2×	47	632
Kurt K. Christenson United States	9	213 0.3×	148 0.8×	113 1.4×	17 0.3×	41 0.9×	24	368

Countries citing papers authored by Vijay Sukumaran

Since Specialization

Citations

This map shows the geographic impact of Vijay Sukumaran's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Vijay Sukumaran with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Vijay Sukumaran more than expected).

Fields of papers citing papers by Vijay Sukumaran

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Vijay Sukumaran. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Vijay Sukumaran. The network helps show where Vijay Sukumaran may publish in the future.

Co-authorship network of co-authors of Vijay Sukumaran

This figure shows the co-authorship network connecting the top 25 collaborators of Vijay Sukumaran. A scholar is included among the top collaborators of Vijay Sukumaran based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Vijay Sukumaran. Vijay Sukumaran is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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14 of 14 papers shown

Demir, Kaya, Vijay Sukumaran, Yoichiro Sato, et al.. (2018). Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications. Journal of Materials Science Materials in Electronics. 29(15). 12669–12680. 10 indexed citations

Sitaraman, Srikrishna, Vijay Sukumaran, P. Markondeya Raj, et al.. (2017). Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(9). 1410–1418. 21 indexed citations

Sukumaran, Vijay, Gokul Kumar, Yuya Suzuki, et al.. (2014). Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(5). 786–795. 107 indexed citations

Chou, Bruce C. S., Yoichiro Sato, Vijay Sukumaran, et al.. (2013). Modeling, design, and fabrication of ultra-high bandwidth 3D Glass Photonics (3DGP) in glass interposers. 286–291. 12 indexed citations

Demir, Kaya, Yoichiro Sato, Qiao Chen, et al.. (2013). Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages. 353–359. 20 indexed citations

Sato, Yoichiro, Srikrishna Sitaraman, Vijay Sukumaran, et al.. (2013). Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules. 1656–1661. 24 indexed citations

Sato, Yoichiro, Bruce C. S. Chou, Vijay Sukumaran, et al.. (2013). RF Device Integration on Glass Interposer toward 3D-IPAC Packages. IMAPSource Proceedings. 2013(1). 825–830. 2 indexed citations

Sukumaran, Vijay, Tapobrata Bandyopadhyay, Venky Sundaram, & Rao Tummala. (2012). Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(9). 1426–1433. 209 indexed citations

Sukumaran, Vijay, Tapobrata Bandyopadhyay, Qiao Chen, et al.. (2011). Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias. 583–588. 71 indexed citations

10.

Kumar, Gokul, Tapobrata Bandyopadhyay, Vijay Sukumaran, et al.. (2011). Ultra-high I/O density glass/silicon interposers for high bandwidth smart mobile applications. 217–223. 43 indexed citations

11.

Sundaram, Venky, Vijay Sukumaran, Fuhan Liu, et al.. (2011). High density electrical interconnections in liquid crystal polymer (LCP) substrates for retinal and neural prosthesis applications. 1308–1313. 8 indexed citations

12.

Min, Sung-Hwan, et al.. (2010). Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV). 530–535. 34 indexed citations

13.

Sukumaran, Vijay, Qiao Chen, Fuhan Liu, et al.. (2010). Through-package-via formation and metallization of glass interposers. 557–563. 101 indexed citations

14.

Tummala, Rao, Venky Sundaram, Ritwik Chatterjee, et al.. (2009). Trend from ICs to 3D ICs to 3D systems. 439–444. 49 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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