S. Hegde

460 total citations
17 papers, 182 citations indexed

About

S. Hegde is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, S. Hegde has authored 17 papers receiving a total of 182 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Electrical and Electronic Engineering, 3 papers in Biomedical Engineering and 2 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in S. Hegde's work include Photonic and Optical Devices (8 papers), Semiconductor Lasers and Optical Devices (8 papers) and Electronic Packaging and Soldering Technologies (6 papers). S. Hegde is often cited by papers focused on Photonic and Optical Devices (8 papers), Semiconductor Lasers and Optical Devices (8 papers) and Electronic Packaging and Soldering Technologies (6 papers). S. Hegde collaborates with scholars based in United States, Netherlands and India. S. Hegde's co-authors include Suresh K. Sitaraman, J. S. McMurray, B. Doris, M. Gribelyuk, David J. Smith, Paul Ronsheim, Martha R. McCartney, Jing Li, Ch. S. N. Murthy and Raghuram V. Pucha and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Journal of Applied Polymer Science.

In The Last Decade

S. Hegde

15 papers receiving 170 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
S. Hegde United States 6 139 65 42 38 27 17 182
Paul Gundel Germany 13 437 3.1× 9 0.1× 131 3.1× 25 0.7× 22 0.8× 34 462
Anyan Du China 8 179 1.3× 4 0.1× 59 1.4× 11 0.3× 41 1.5× 36 213
Mathias Steinmair Austria 8 231 1.7× 15 0.2× 126 3.0× 8 0.2× 271 10.0× 10 335
Tobias A. de Jong Netherlands 6 33 0.2× 10 0.2× 54 1.3× 6 0.2× 18 0.7× 10 137
Mark van Dal Belgium 10 256 1.8× 8 0.1× 204 4.9× 5 0.1× 60 2.2× 26 285
Taizo Kanagawa Japan 6 114 0.8× 8 0.1× 399 9.5× 12 0.3× 59 2.2× 7 434
Hiroyuki Okino Japan 11 195 1.4× 6 0.1× 263 6.3× 6 0.2× 75 2.8× 31 373
Lucas Petersen Barbosa Lima Brazil 7 199 1.4× 3 0.0× 44 1.0× 6 0.2× 49 1.8× 29 241
Akimasa Kinoshita Japan 12 375 2.7× 5 0.1× 128 3.0× 6 0.2× 15 0.6× 40 407
Phillip Crout United Kingdom 5 7 0.1× 31 0.5× 13 0.3× 33 0.9× 11 0.4× 11 102

Countries citing papers authored by S. Hegde

Since Specialization
Citations

This map shows the geographic impact of S. Hegde's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Hegde with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Hegde more than expected).

Fields of papers citing papers by S. Hegde

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Hegde. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Hegde. The network helps show where S. Hegde may publish in the future.

Co-authorship network of co-authors of S. Hegde

This figure shows the co-authorship network connecting the top 25 collaborators of S. Hegde. A scholar is included among the top collaborators of S. Hegde based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Hegde. S. Hegde is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

17 of 17 papers shown
1.
Hegde, S., et al.. (2025). Experimentally-informed in silico design of melt-electrowritten scaffolds for tissue engineering applications. Materials & Design. 258. 114603–114603. 1 indexed citations
2.
Hegde, S. & Suresh K. Sitaraman. (2008). Thermal Aging Reliability of Package-Level Polymer Optical Waveguides. IEEE Transactions on Advanced Packaging. 31(2). 410–416. 1 indexed citations
3.
Hegde, S., Fuhan Liu, Gee‐Kung Chang, & Suresh K. Sitaraman. (2007). Optical loss changes in siloxane polymer waveguides during thermal curing. Journal of Applied Polymer Science. 106(4). 2320–2327. 6 indexed citations
4.
Hegde, S. & Suresh K. Sitaraman. (2007). Stress-induced birefringence in siloxane polymer waveguides. Applied Physics Letters. 91(8). 2 indexed citations
5.
Chang, Gee-Kung, Daniel Guidotti, Lixi Wan, et al.. (2005). High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper). Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5814. 176–176. 4 indexed citations
6.
Hegde, S., Lei Shan, Daniel M. Kuchta, et al.. (2005). Thermal-mechanical analysis of Terabus high-speed optoelectronic package. 2. 1854–1858. 2 indexed citations
7.
Hegde, S., Raghuram V. Pucha, V. Sundaram, et al.. (2004). Materials, processes and reliability of mixed-signal substrates for SOP technology. 1630–1635.
8.
Kumbhat, Nitesh, S. Hegde, P. Markondeya Raj, et al.. (2004). Novel board material technology for next-generation packaging. 247–252. 1 indexed citations
9.
Hegde, S. & Suresh K. Sitaraman. (2004). Thermo-mechanical evaluation of embedded optical interconnects on board. 274–279. 1 indexed citations
10.
Pucha, Raghuram V., et al.. (2004). System-Level Reliability Assessment of Mixed-Signal Convergent Microsystems. IEEE Transactions on Advanced Packaging. 27(2). 438–452. 5 indexed citations
11.
Chang, Gee‐Kung, Daniel Guidotti, V. Sundaram, et al.. (2004). Chip-to-Chip Optoelectronics SOP on Organic Boards or Packages. IEEE Transactions on Advanced Packaging. 27(2). 386–397. 26 indexed citations
12.
Hegde, S., Raghuram V. Pucha, Daniel Guidotti, et al.. (2004). Design, fabrication, and reliability testing of embedded optical interconnects on package. 895–900. 6 indexed citations
13.
Hegde, S., Raghuram V. Pucha, & Suresh K. Sitaraman. (2004). Enhanced reliability of high-density wiring (HDW) substrates through new base substrate and dielectric materials. Journal of Materials Science Materials in Electronics. 15(5). 287–296. 13 indexed citations
14.
Hegde, S., et al.. (2003). Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards. 165–170. 5 indexed citations
15.
Gribelyuk, M., Martha R. McCartney, Jing Li, et al.. (2002). Mapping of Electrostatic Potential in Deep Submicron CMOS Devices by Electron Holography. Physical Review Letters. 89(2). 25502–25502. 88 indexed citations
16.
Hegde, S., Raghuram V. Pucha, & Suresh K. Sitaraman. (2002). Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials. 283–290. 4 indexed citations
17.
O’Sullivan, E. J., Emanuel I. Cooper, L. T. Romankiw, et al.. (1998). Integrated, variable-reluctance magnetic minimotor. IBM Journal of Research and Development. 42(5). 681–694. 17 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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