Chunjin Hang
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Nanomaterials and Printing Technologies
- Mechanical Engineering top 5%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
Papers in
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- Electronic Packaging and Soldering Technologies 31
- 3D IC and TSV technologies 20
- Nanomaterials and Printing Technologies 5
-
- Aluminum Alloys Composites Properties 16
- Advanced Welding Techniques Analysis 8
- Co-authors
- Yanhong Tian (22 shared papers)Chunqing Wang (13 shared papers)Rui Zhang (4 shared papers)Baolei Liu (5 shared papers)Mingyu Li (13 shared papers)Chenxi Wang (5 shared papers)Hongtao Chen (13 shared papers)Fan Yang (3 shared papers)
- Journals
- Journal of Materials Science Materials in Electronics (14 papers)Journal of Alloys and Compounds (3 papers)Materials Letters (3 papers)Applied Surface Science (2 papers)Materials Characterization (2 papers)
- Partner nations
- ChinaSouth KoreaCanada
In The Last Decade
Chunjin Hang
53 papers receiving 860 citations
Peers
Comparison fields: 5 of 41
- Electrical and Electronic Engineering 727
- Mechanical Engineering 452
- Electronic, Optical and Magnetic Materials 100
- Ceramics and Composites 20
- Polymers and Plastics 48
Countries citing papers authored by Chunjin Hang
This map shows the geographic impact of Chunjin Hang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chunjin Hang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chunjin Hang more than expected).
Fields of papers citing papers by Chunjin Hang
This network shows the impact of papers produced by Chunjin Hang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chunjin Hang. The network helps show where Chunjin Hang may publish in the future.
Co-authors
The 25 scholars most cited alongside Chunjin Hang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 53 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 74 | |
| 2 | 2013 | 60 | |
| 3 | 2013 | 58 | |
| 4 | 2020 | 51 | |
| 5 | 2020 | 51 | |
| 6 | 2011 | 48 | |
| 7 | 2019 | 45 | |
| 8 | 2018 | 43 | |
| 9 | 2019 | 42 | |
| 10 | 2018 | 39 | |
| 11 | 2015 | 24 | |
| 12 | 2019 | 23 | |
| 13 | 2014 | 21 | |
| 14 | 2013 | 19 | |
| 15 | 2019 | 19 | |
| 16 | 2019 | 18 | |
| 17 | 2018 | 16 | |
| 18 | 2019 | 15 | |
| 19 | 2018 | 15 | |
| 20 | 2012 | 15 |
About Chunjin Hang
Chunjin Hang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 53 papers that have together received 867 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (20 papers), Aluminum Alloys Composites Properties (16 papers), Advanced Welding Techniques Analysis (8 papers), Nanomaterials and Printing Technologies (5 papers), Anodic Oxide Films and Nanostructures (4 papers), Advanced Sensor and Energy Harvesting Materials (4 papers) and Nanoporous metals and alloys (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (727 citations), Mechanical Engineering (452 citations), Electronic, Optical and Magnetic Materials (100 citations), Ceramics and Composites (20 citations) and Polymers and Plastics (48 citations). Chunjin Hang has collaborated with scholars based in China, South Korea and Canada. Frequent co-authors include Yanhong Tian, Chunqing Wang, Rui Zhang, Baolei Liu, Mingyu Li, Chenxi Wang, Hongtao Chen, Fan Yang, He Zhang and Jiayun Feng. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Journal of Alloys and Compounds, Materials Letters, Applied Surface Science and Materials Characterization.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.