Chunjin Hang

1.0k total citations
53 papers, 838 citations indexed

About

Chunjin Hang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Chunjin Hang has authored 53 papers receiving a total of 838 indexed citations (citations by other indexed papers that have themselves been cited), including 42 papers in Electrical and Electronic Engineering, 27 papers in Mechanical Engineering and 8 papers in Materials Chemistry. Recurrent topics in Chunjin Hang's work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (20 papers) and Aluminum Alloys Composites Properties (16 papers). Chunjin Hang is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (20 papers) and Aluminum Alloys Composites Properties (16 papers). Chunjin Hang collaborates with scholars based in China, Canada and South Korea. Chunjin Hang's co-authors include Yanhong Tian, Chunqing Wang, Rui Zhang, Baolei Liu, Mingyu Li, Chenxi Wang, Hongtao Chen, Jiayun Feng, He Zhang and Fan Yang and has published in prestigious journals such as Scientific Reports, Chemical Engineering Journal and Materials Science and Engineering A.

In The Last Decade

Chunjin Hang

51 papers receiving 825 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chunjin Hang China 17 708 444 138 135 98 53 838
Bo‐In Noh South Korea 22 1.0k 1.4× 559 1.3× 139 1.0× 96 0.7× 94 1.0× 57 1.1k
Sehoon Yoo South Korea 13 475 0.7× 290 0.7× 86 0.6× 59 0.4× 52 0.5× 88 605
M.O. Alam Hong Kong 22 1.4k 1.9× 784 1.8× 185 1.3× 102 0.8× 116 1.2× 52 1.5k
Yoonchul Sohn South Korea 10 420 0.6× 312 0.7× 116 0.8× 97 0.7× 48 0.5× 38 579
Ikuo Shohji Japan 15 861 1.2× 678 1.5× 120 0.9× 35 0.3× 51 0.5× 174 1.0k
Lianyong Xu China 14 195 0.3× 272 0.6× 107 0.8× 126 0.9× 24 0.2× 29 458
Zuoxing Guo China 17 222 0.3× 353 0.8× 238 1.7× 64 0.5× 130 1.3× 29 713
Xuming Pang China 15 230 0.3× 187 0.4× 384 2.8× 229 1.7× 146 1.5× 54 629
Shalini Mohanty India 17 558 0.8× 426 1.0× 370 2.7× 275 2.0× 205 2.1× 46 905

Countries citing papers authored by Chunjin Hang

Since Specialization
Citations

This map shows the geographic impact of Chunjin Hang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chunjin Hang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chunjin Hang more than expected).

Fields of papers citing papers by Chunjin Hang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chunjin Hang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chunjin Hang. The network helps show where Chunjin Hang may publish in the future.

Co-authorship network of co-authors of Chunjin Hang

This figure shows the co-authorship network connecting the top 25 collaborators of Chunjin Hang. A scholar is included among the top collaborators of Chunjin Hang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chunjin Hang. Chunjin Hang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, Xiangji, Chunjin Hang, Zhihao Zhang, et al.. (2025). A stretchable AgNW aerogel composite material for electromagnetic interference shielding. Materials Letters. 394. 138644–138644.
2.
Wang, Pengbo, et al.. (2025). Study on the electrochemical migration inhibition mechanism of micron-scale Cu@In-In and nano-Ag sandwich structure. Applied Surface Science. 720. 165259–165259.
3.
4.
Huang, Shixin, Wei Liu, Chunjin Hang, et al.. (2024). Enhanced reaction kinetics and structure integrity of Cu/F co-doped SnO2@C composite for high-performance lithium-ion batteries. Chemical Engineering Journal. 496. 154346–154346. 10 indexed citations
5.
Guan, Wei, et al.. (2024). Mechanical Properties and Fatigue Life Analysis of Motion Cables in Sensors under Cyclic Loading. Sensors. 24(4). 1109–1109. 1 indexed citations
6.
Liu, Wei, et al.. (2024). Highly efficient SnO2-Carbon nanosphere heterojunctions decorated with Ag for detecting isopropanol at low operating temperatures. Applied Surface Science. 679. 161208–161208. 3 indexed citations
7.
Liu, Wei, et al.. (2024). Atomic insights into the sintering behaviour of Ag–Cu solid solution nanoparticles on Ag substrate. Journal of Materials Research and Technology. 33. 9123–9134. 2 indexed citations
8.
Liu, Wei, et al.. (2023). Thermal cycle reliability and creep behavior of nano-IMC mixed solder joints. Journal of Materials Science Materials in Electronics. 34(28). 5 indexed citations
9.
Wang, Jianqiang, Fengyi Wang, Jintao Wang, et al.. (2022). Interconnection method based on Cu-foam/Sn composite preform for high-temperature applications. Journal of Materials Science Materials in Electronics. 33(34). 25964–25975. 3 indexed citations
10.
Liu, Wei, et al.. (2022). Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu3Sn Paste for High-Power Electronics Packaging. ACS Applied Electronic Materials. 4(7). 3457–3469. 14 indexed citations
11.
Liu, Yihan, et al.. (2021). Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste. Journal of Materials Science Materials in Electronics. 32(12). 16230–16241. 2 indexed citations
12.
Zhang, He, Shang Wang, Yanhong Tian, et al.. (2020). Electrodeposition fabrication of Cu@Ni core shell nanowire network for highly stable transparent conductive films. Chemical Engineering Journal. 390. 124495–124495. 50 indexed citations
13.
Su, Yue, et al.. (2019). Interconnection method based on solder-filled nanoporous copper as interlayer for high-temperature applications. Microelectronic Engineering. 214. 60–67. 14 indexed citations
14.
Liu, Jiahao, et al.. (2019). A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging. Journal of Materials Science Materials in Electronics. 31(3). 1808–1816. 18 indexed citations
15.
Hang, Chunjin, et al.. (2018). Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging. Scientific Reports. 8(1). 17422–17422. 14 indexed citations
16.
Hang, Chunjin, et al.. (2018). An interconnection method based on Sn-coated Ni core-shell powder preforms for high-temperature applications. Journal of Alloys and Compounds. 776. 791–797. 16 indexed citations
17.
Feng, Jiayun, Chunjin Hang, Yanhong Tian, Baolei Liu, & Chenxi Wang. (2018). Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current. Scientific Reports. 8(1). 1775–1775. 43 indexed citations
18.
Hang, Chunjin, Yanhong Tian, Rui Zhang, & Dongsheng Yang. (2013). Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process. Journal of Materials Science Materials in Electronics. 24(10). 3905–3913. 58 indexed citations
19.
Zhang, Rui, Yanhong Tian, Baolei Liu, & Chunjin Hang. (2013). Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate. 102. 1276–1279. 1 indexed citations
20.
Hang, Chunjin, et al.. (2012). Thermal characterization of high power LED array in aluminum base copper clad laminate package. 5187. 1425–1428. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026