Kenny C. Otiaba

488 total citations
16 papers, 405 citations indexed

About

Kenny C. Otiaba is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Kenny C. Otiaba has authored 16 papers receiving a total of 405 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 10 papers in Materials Chemistry. Recurrent topics in Kenny C. Otiaba's work include Electronic Packaging and Soldering Technologies (11 papers), Thermal properties of materials (10 papers) and 3D IC and TSV technologies (6 papers). Kenny C. Otiaba is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Thermal properties of materials (10 papers) and 3D IC and TSV technologies (6 papers). Kenny C. Otiaba collaborates with scholars based in United Kingdom, Ghana and Hong Kong. Kenny C. Otiaba's co-authors include Raj Bhatti, Sabuj Mallik, N.N. Ekere, Emeka H. Amalu, M.O. Alam, Michael Okereke and R. Nedunchezhian and has published in prestigious journals such as Applied Thermal Engineering, Microelectronics Reliability and Engineering Failure Analysis.

In The Last Decade

Kenny C. Otiaba

16 papers receiving 385 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Kenny C. Otiaba United Kingdom	9	253	189	141	65	34	16	405
Dimeji Ibitayo United States	14	326 1.3×	224 1.2×	91 0.6×	23 0.4×	16 0.5×	34	461
Sung Joon Kim South Korea	12	232 0.9×	275 1.5×	117 0.8×	93 1.4×	38 1.1×	45	537
Olaf Wittler Germany	13	468 1.8×	151 0.8×	57 0.4×	150 2.3×	13 0.4×	97	598
Joshua Major United States	12	227 0.9×	120 0.6×	63 0.4×	27 0.4×	13 0.4×	29	317
Thierry Baffie France	10	70 0.3×	265 1.4×	145 1.0×	42 0.6×	54 1.6×	19	388
Jeong Suk Kim South Korea	9	101 0.4×	248 1.3×	76 0.5×	103 1.6×	18 0.5×	18	324
R.J. Werkhoven Netherlands	10	73 0.3×	253 1.3×	153 1.1×	126 1.9×	40 1.2×	25	371
K. Venugopal India	6	212 0.8×	459 2.4×	195 1.4×	49 0.8×	75 2.2×	17	488
S. Ravi Annapragada United States	9	142 0.6×	124 0.7×	55 0.4×	64 1.0×	10 0.3×	19	317
Xiandong Zhou Germany	11	108 0.4×	68 0.4×	279 2.0×	62 1.0×	15 0.4×	25	400

Countries citing papers authored by Kenny C. Otiaba

Since Specialization

Citations

This map shows the geographic impact of Kenny C. Otiaba's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kenny C. Otiaba with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kenny C. Otiaba more than expected).

Fields of papers citing papers by Kenny C. Otiaba

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kenny C. Otiaba. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kenny C. Otiaba. The network helps show where Kenny C. Otiaba may publish in the future.

Co-authorship network of co-authors of Kenny C. Otiaba

This figure shows the co-authorship network connecting the top 25 collaborators of Kenny C. Otiaba. A scholar is included among the top collaborators of Kenny C. Otiaba based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kenny C. Otiaba. Kenny C. Otiaba is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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16 of 16 papers shown

Bhatti, Raj, et al.. (2013). Prediction and optimization of design parameters of microelectronic heat sinks. Journal of Emerging Trends in Engineering and Applied Sciences. 4(3). 493–500. 5 indexed citations

Otiaba, Kenny C., Michael Okereke, & Raj Bhatti. (2013). Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material. Applied Thermal Engineering. 64(1-2). 51–63. 47 indexed citations

Bhatti, Raj, et al.. (2013). The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal. 45(2). 159–166. 6 indexed citations

Bhatti, Raj, et al.. (2013). Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability. 54(1). 239–244. 37 indexed citations

Bhatti, Raj, et al.. (2013). Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications. IMAPSource Proceedings. 2013(1). 473–477. 3 indexed citations

Bhatti, Raj, et al.. (2012). Effects of thermal interface materials (solders) on thermal performance of a microelectronic package. 154–159. 10 indexed citations

Otiaba, Kenny C., Raj Bhatti, N.N. Ekere, et al.. (2012). Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability. 52(7). 1409–1419. 56 indexed citations

Otiaba, Kenny C., et al.. (2012). Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis. 28. 192–207. 58 indexed citations

Otiaba, Kenny C., et al.. (2012). Influence of thermal ageing on void content and shear strength for selected lead free solder die-attach. IMAPSource Proceedings. 2012(1). 882–890. 1 indexed citations

10.

Otiaba, Kenny C., N.N. Ekere, Raj Bhatti, Sabuj Mallik, & Emeka H. Amalu. (2011). Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. Greenwich Academic Literature Archive (University of Greenwich). 1–8. 2 indexed citations

11.

Otiaba, Kenny C., et al.. (2011). Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device. 1–5. 3 indexed citations

12.

Amalu, Emeka H., et al.. (2011). A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering. 88(7). 1610–1617. 20 indexed citations

13.

Otiaba, Kenny C., et al.. (2011). Thermal effects of die-attach voids location and style on performance of chip level package. Greenwich Academic Literature Archive (University of Greenwich). 9. 231–236. 10 indexed citations

14.

Otiaba, Kenny C., N.N. Ekere, Raj Bhatti, et al.. (2011). Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability. 51(12). 2031–2043. 123 indexed citations

15.

Otiaba, Kenny C., N.N. Ekere, Emeka H. Amalu, Raj Bhatti, & Sabuj Mallik. (2011). Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R and D Challenges. Advanced materials research. 367. 301–307. 5 indexed citations

16.

Bhatti, Raj, et al.. (2011). Investigation of effects of heat sinks on thermal performance of microelectronic package. Greenwich Academic Literature Archive (University of Greenwich). 127–132. 19 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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