Y. C. Chan
Impact in
- General Materials Science top 2%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 5%
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 33
- 3D IC and TSV technologies 24
- Thin-Film Transistor Technologies 7
- Electrowetting and Microfluidic Technologies 6
-
- Intermetallics and Advanced Alloy Properties 12
- Advanced Welding Techniques Analysis 8
- Co-authors
- Ahmed Sharif (6 shared papers)M.O. Alam (8 shared papers)K.C. Hung (4 shared papers)K.C. Yung (4 shared papers)Asit Kumar Gain (2 shared papers)Xin Gu (4 shared papers)Jun Shen (1 shared paper)J.K.L. Lai (5 shared papers)
- Journals
- Journal of Alloys and Compounds (4 papers)Journal of Materials Science Materials in Electronics (4 papers)Journal of Electronic Materials (4 papers)Journal of Electronic Packaging (3 papers)Microelectronics Reliability (3 papers)
- Partner nations
- Hong KongTaiwanUnited Kingdom
In The Last Decade
Y. C. Chan
57 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 46
- General Materials Science 60
- Mechanical Engineering 692
- Electrical and Electronic Engineering 1.1k
- Electronic, Optical and Magnetic Materials 99
- Aerospace Engineering 99
Countries citing papers authored by Y. C. Chan
This map shows the geographic impact of Y. C. Chan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Y. C. Chan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Y. C. Chan more than expected).
Fields of papers citing papers by Y. C. Chan
This network shows the impact of papers produced by Y. C. Chan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Y. C. Chan. The network helps show where Y. C. Chan may publish in the future.
Co-authors
The 25 scholars most cited alongside Y. C. Chan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 57 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 104 | |
| 2 | 2011 | 102 | |
| 3 | 2002 | 102 | |
| 4 | 2010 | 76 | |
| 5 | 2006 | 57 | |
| 6 | 2003 | 57 | |
| 7 | 1997 | 53 | |
| 8 | 2003 | 50 | |
| 9 | 2009 | 47 | |
| 10 | 2005 | 40 | |
| 11 | 2000 | 30 | |
| 12 | 2000 | 29 | |
| 13 | 2000 | 27 | |
| 14 | 2016 | 25 | |
| 15 | 2009 | 23 | |
| 16 | 2004 | 22 | |
| 17 | 2014 | 18 | |
| 18 | 2008 | 18 | |
| 19 | 2007 | 17 | |
| 20 | 2016 | 16 |
About Y. C. Chan
Y. C. Chan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials, having authored 57 papers that have together received 1.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (33 papers), 3D IC and TSV technologies (24 papers), Intermetallics and Advanced Alloy Properties (12 papers), Advanced Welding Techniques Analysis (8 papers), Copper Interconnects and Reliability (7 papers), Thin-Film Transistor Technologies (7 papers), Electrowetting and Microfluidic Technologies (6 papers) and Silicon Nanostructures and Photoluminescence (5 papers). The work is most often cited by research in General Materials Science (60 citations), Mechanical Engineering (692 citations), Electrical and Electronic Engineering (1.1k citations), Electronic, Optical and Magnetic Materials (99 citations) and Aerospace Engineering (99 citations). Y. C. Chan has collaborated with scholars based in Hong Kong, Taiwan and United Kingdom. Frequent co-authors include Ahmed Sharif, M.O. Alam, K.C. Hung, K.C. Yung, Asit Kumar Gain, Xin Gu, Jun Shen, J.K.L. Lai, Mobinul Islam and Rashed Adnan Islam. Their work appears in journals such as Journal of Alloys and Compounds, Journal of Materials Science Materials in Electronics, Journal of Electronic Materials, Journal of Electronic Packaging and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.