Y. C. Chan

1.3k total citations
57 papers, 1.1k citations indexed

About

Y. C. Chan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Y. C. Chan has authored 57 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 53 papers in Electrical and Electronic Engineering, 22 papers in Mechanical Engineering and 10 papers in Biomedical Engineering. Recurrent topics in Y. C. Chan's work include Electronic Packaging and Soldering Technologies (33 papers), 3D IC and TSV technologies (24 papers) and Intermetallics and Advanced Alloy Properties (12 papers). Y. C. Chan is often cited by papers focused on Electronic Packaging and Soldering Technologies (33 papers), 3D IC and TSV technologies (24 papers) and Intermetallics and Advanced Alloy Properties (12 papers). Y. C. Chan collaborates with scholars based in Hong Kong, United Kingdom and Taiwan. Y. C. Chan's co-authors include Ahmed Sharif, M.O. Alam, K.C. Yung, K.C. Hung, Asit Kumar Gain, Xin Gu, Jun Shen, J.K.L. Lai, Mobinul Islam and Rashed Adnan Islam and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Y. C. Chan

57 papers receiving 1.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Y. C. Chan Hong Kong	18	1.1k	692	100	99	99	57	1.1k
L.E. Felton United States	11	674 0.6×	452 0.7×	87 0.9×	122 1.2×	64 0.6×	22	779
Agata Skwarek Poland	17	627 0.6×	352 0.5×	121 1.2×	50 0.5×	48 0.5×	74	730
Nan Jiang China	17	709 0.7×	536 0.8×	172 1.7×	85 0.9×	41 0.4×	61	1.0k
Vivek Chidambaram Singapore	13	569 0.5×	361 0.5×	57 0.6×	42 0.4×	52 0.5×	36	661
Hsiang‐Yao Hsiao Taiwan	9	736 0.7×	379 0.5×	234 2.3×	68 0.7×	298 3.0×	10	888
Kil-Won Moon United States	14	868 0.8×	851 1.2×	224 2.2×	325 3.3×	124 1.3×	32	1.3k
E. Ristolainen Finland	15	620 0.6×	265 0.4×	183 1.8×	72 0.7×	45 0.5×	63	799
G.T. Galyon United States	9	424 0.4×	243 0.4×	77 0.8×	72 0.7×	101 1.0×	15	488
F. Wulff Singapore	14	410 0.4×	312 0.5×	98 1.0×	54 0.5×	71 0.7×	29	566
A.E. Hammad Egypt	17	1.1k 1.0×	967 1.4×	95 0.9×	292 2.9×	25 0.3×	28	1.2k

Countries citing papers authored by Y. C. Chan

Since Specialization

Citations

This map shows the geographic impact of Y. C. Chan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Y. C. Chan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Y. C. Chan more than expected).

Fields of papers citing papers by Y. C. Chan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Y. C. Chan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Y. C. Chan. The network helps show where Y. C. Chan may publish in the future.

Co-authorship network of co-authors of Y. C. Chan

This figure shows the co-authorship network connecting the top 25 collaborators of Y. C. Chan. A scholar is included among the top collaborators of Y. C. Chan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Y. C. Chan. Y. C. Chan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Wang, Yuxin, et al.. (2024). Monitoring Escherichia coli in Water through Real-Time Loop-Mediated Isothermal Amplification on Biochips. Micromachines. 15(9). 1112–1112. 1 indexed citations

Wang, Yuxin, et al.. (2023). Programmable Digital-Microfluidic Biochips for SARS-CoV-2 Detection. Bioengineering. 10(8). 923–923. 3 indexed citations

Chan, Y. C. & Chen‐Yi Lee. (2022). A Programmable Bio-Chip With Adaptive Pattern-Control Micro-Electrode-Dot-Array. IEEE Transactions on Circuits & Systems II Express Briefs. 69(11). 4513–4517. 5 indexed citations

Chan, Y. C., et al.. (2021). Parallel Droplet Control in MEDA Biochips using Multi-Agent Reinforcement Learning. International Conference on Machine Learning. 139. 6588–6599. 6 indexed citations

Chen, Chun‐Chi, et al.. (2020). Rapid Portable Electrical Biosensing Design with Dielectrophoresis and its Application for Cardiac Biomarker Detection. IEEE Sensors Journal. 1–1. 4 indexed citations

Chan, Y. C., et al.. (2019). Multitarget Sample Preparation Using MEDA Biochips. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 39(10). 2682–2695. 14 indexed citations

Chan, Y. C., et al.. (2018). 0.4V Reconfigurable Near-Threshold TCAM in 28nm High-k Metal-Gate CMOS Process. 272–277. 5 indexed citations

Kotadia, Hiren R., Shengyong Xu, Hua Lu, et al.. (2014). Electromigration in Sn–Ag solder thin films under high current density. Thin Solid Films. 565. 193–201. 18 indexed citations

Chan, Y. C., et al.. (2014). Electroless Ni-P-ZrO<inf>2</inf> metallization for lead-free solder interconnection. 820–824. 2 indexed citations

10.

Gain, Asit Kumar, Y. C. Chan, & K.C. Yung. (2011). Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates. Microelectronics Reliability. 51(5). 975–984. 102 indexed citations

11.

Gain, Asit Kumar, Tama Fouzder, Y. C. Chan, et al.. (2010). The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads. Journal of Alloys and Compounds. 506(1). 216–223. 76 indexed citations

12.

Gu, Xin, Y. C. Chan, Dan Yang, & Bin Wu. (2008). The shearing behavior and microstructure of Sn–4Ag–0.5Cu solder joints on a Ni–P–carbon nanotubes composite coating. Journal of Alloys and Compounds. 468(1-2). 553–557. 10 indexed citations

13.

Chan, Y. C., et al.. (2005). Process optimization to overcome void formation in nonconductive paste interconnections for fine-pitch applications. Journal of Electronic Materials. 34(8). 1143–1149. 10 indexed citations

14.

Kwong, C.Y., et al.. (2005). The characterization of the optical functions of BCP and CBP thin films by spectroscopic ellipsometry. Synthetic Metals. 150(2). 159–163. 40 indexed citations

15.

Islam, Mobinul & Y. C. Chan. (2005). Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization. Journal of Electronic Materials. 34(5). 662–669. 8 indexed citations

16.

Sharif, Ahmed & Y. C. Chan. (2004). Interfacial reactions on electrolytic Ni and electroless Ni(P) metallization with Sn–In–Ag–Cu solder. Journal of Alloys and Compounds. 393(1-2). 135–140. 22 indexed citations

17.

Chan, Y. C., et al.. (2002). An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder. Journal of Electronic Packaging. 124(3). 305–310. 1 indexed citations

18.

Zou, Xuecheng, Y. C. Chan, D.P. Webb, et al.. (2000). Photoinduced Dehydrogenation of Defects in Undopeda-Si:H Using Positron Annihilation Spectroscopy. Physical Review Letters. 84(4). 769–772. 29 indexed citations

19.

Lin, S.H., Y. C. Chan, D.P. Webb, & Yun Wah Lam. (2000). Reliability in Modeling of Spectroscopic Ellipsometry. physica status solidi (a). 182(2). R1–R2. 1 indexed citations

20.

Chan, Y. C., et al.. (1999). Determination of tellurium in indium antimonide by slurry sampling electrothermal atomic absorption spectrometry. Journal of Analytical Atomic Spectrometry. 14(1). 69–74. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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