Bo‐In Noh

1.3k total citations
57 papers, 1.1k citations indexed

About

Bo‐In Noh is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Bo‐In Noh has authored 57 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 54 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 9 papers in Mechanics of Materials. Recurrent topics in Bo‐In Noh's work include Electronic Packaging and Soldering Technologies (49 papers), 3D IC and TSV technologies (37 papers) and Advanced Welding Techniques Analysis (17 papers). Bo‐In Noh is often cited by papers focused on Electronic Packaging and Soldering Technologies (49 papers), 3D IC and TSV technologies (37 papers) and Advanced Welding Techniques Analysis (17 papers). Bo‐In Noh collaborates with scholars based in South Korea, Australia and Japan. Bo‐In Noh's co-authors include Seung‐Boo Jung, Jeong‐Won Yoon, Chang-Chae Shur, Junghyun Choi, Ja‐Myeong Koo, Jong‐Woong Kim, Boyoung Lee, Kwang‐Seok Kim, Yee Hui Lee and Dae‐Gon Kim and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and Japanese Journal of Applied Physics.

In The Last Decade

Bo‐In Noh

56 papers receiving 1.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Bo‐In Noh South Korea	22	1.0k	559	139	115	96	57	1.1k
M.O. Alam Hong Kong	22	1.4k 1.3×	784 1.4×	185 1.3×	170 1.5×	102 1.1×	52	1.5k
Panyawat Wangyao Thailand	18	507 0.5×	468 0.8×	182 1.3×	175 1.5×	93 1.0×	90	1.0k
Kyung W. Paik South Korea	17	726 0.7×	302 0.5×	228 1.6×	150 1.3×	283 2.9×	58	1.1k
Yee‐Wen Yen Taiwan	22	984 1.0×	825 1.5×	246 1.8×	65 0.6×	55 0.6×	106	1.3k
Seok‐Hwan Huh South Korea	10	1.2k 1.2×	981 1.8×	165 1.2×	94 0.8×	30 0.3×	49	1.4k
Chunjin Hang China	17	708 0.7×	444 0.8×	138 1.0×	45 0.4×	135 1.4×	53	838
Jesus N. Calata United States	20	1.2k 1.2×	604 1.1×	209 1.5×	90 0.8×	81 0.8×	38	1.4k
Yong Xiao China	19	581 0.6×	590 1.1×	194 1.4×	83 0.7×	163 1.7×	50	1.0k
Min‐Su Kim South Korea	15	413 0.4×	259 0.5×	173 1.2×	64 0.6×	40 0.4×	68	782
Dhafer Abdulameer Shnawah Malaysia	17	990 1.0×	744 1.3×	784 5.6×	58 0.5×	69 0.7×	22	1.6k

Countries citing papers authored by Bo‐In Noh

Since Specialization

Citations

This map shows the geographic impact of Bo‐In Noh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bo‐In Noh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bo‐In Noh more than expected).

Fields of papers citing papers by Bo‐In Noh

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Bo‐In Noh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bo‐In Noh. The network helps show where Bo‐In Noh may publish in the future.

Co-authorship network of co-authors of Bo‐In Noh

This figure shows the co-authorship network connecting the top 25 collaborators of Bo‐In Noh. A scholar is included among the top collaborators of Bo‐In Noh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bo‐In Noh. Bo‐In Noh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Kim, Kwang‐Seok, et al.. (2012). Electrochemical Migration Characteristics of Screen-Printed Silver Patterns on FR-4 Substrate. Journal of Nanoscience and Nanotechnology. 12(4). 3219–3223. 6 indexed citations

Noh, Bo‐In, et al.. (2012). Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder. Microelectronic Engineering. 103. 1–6. 25 indexed citations

Yoon, Jeong‐Won, et al.. (2011). Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process. Journal of Alloys and Compounds. 509(9). L153–L156. 68 indexed citations

Yoon, Jeong‐Won, et al.. (2011). Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders. Journal of Materials Science Materials in Electronics. 23(1). 41–47. 6 indexed citations

Noh, Bo‐In, Jeong‐Won Yoon, Kwang‐Seok Kim, Young‐Chul Lee, & Seung‐Boo Jung. (2010). Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern. Journal of Electronic Materials. 40(1). 35–41. 27 indexed citations

Noh, Bo‐In, Jeong‐Won Yoon, & Seung‐Boo Jung. (2010). Effect of Ni-Cr seed layer thickness on the adhesion characteristics of flexible copper clad laminates fabricated using a roll-to-roll process. Metals and Materials International. 16(5). 779–784. 16 indexed citations

Noh, Bo‐In, Jeong‐Won Yoon, Junghyun Choi, & Seung‐Boo Jung. (2009). Effect of Cr Thickness on Adhesion Strength of Cu/Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process. MATERIALS TRANSACTIONS. 51(1). 85–89. 17 indexed citations

Noh, Bo‐In, et al.. (2009). Reliability of Au bump flip chip packages with adhesive materials using four-point bending test. International Journal of Adhesion and Adhesives. 29(6). 650–655. 9 indexed citations

Nam, Nguyễn Đăng, et al.. (2009). Effect of Ag addition on the corrosion properties of Sn‐based solder alloys. Materials and Corrosion. 61(1). 30–33. 33 indexed citations

10.

Noh, Bo‐In, Jeong‐Won Yoon, Boyoung Lee, & Seung‐Boo Jung. (2008). Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness. Journal of Materials Science Materials in Electronics. 20(9). 885–890. 23 indexed citations

11.

Koo, Ja‐Myeong, et al.. (2008). Ultrasonic Bonding Technology for Flip Chip Packaging. Journal of Welding and Joining. 26(1). 31–36. 4 indexed citations

12.

Noh, Bo‐In & Seung‐Boo Jung. (2008). Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate. Journal of Electronic Materials. 38(1). 46–53. 14 indexed citations

13.

Koo, Ja‐Myeong, et al.. (2008). Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate. Japanese Journal of Applied Physics. 47(5S). 4309–4309. 7 indexed citations

14.

Noh, Bo‐In, et al.. (2007). Characteristics of Reliability for Flip Chip Package with Non-conductive paste. Journal of the Microelectronics and Packaging Society. 14(4). 9–14. 1 indexed citations

15.

Noh, Bo‐In, et al.. (2007). Study on Characteristics of Sn-0.7wt%Cu-Xwt%Re Solder. Journal of the Microelectronics and Packaging Society. 14(4). 21–25. 2 indexed citations

16.

Noh, Bo‐In & Seung‐Boo Jung. (2007). SURFACE MODIFICATION OF PLASMA TREATMENT ON SiO₂ LAYER WITH UNDERFILL. Surface Review and Letters. 14(4). 849–852. 2 indexed citations

17.

Kim, Dae‐Gon, et al.. (2007). Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints. Journal of Alloys and Compounds. 458(1-2). 253–260. 31 indexed citations

18.

Noh, Bo‐In, et al.. (2007). Effect of surface finish material on printed circuit board for electrochemical migration. Microelectronics Reliability. 48(4). 652–656. 59 indexed citations

19.

Noh, Bo‐In, et al.. (2006). Characteristic of Underfill with Various Epoxy Resin. Journal of the Microelectronics and Packaging Society. 13(3). 39–45. 3 indexed citations

20.

Noh, Bo‐In, et al.. (2006). Effect of plasma treatment on adhesion characteristics at interfaces between underfill and substrate. International Journal of Adhesion and Adhesives. 27(3). 200–206. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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