Sabuj Mallik

1.6k total citations
67 papers, 1.2k citations indexed

About

Sabuj Mallik is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Sabuj Mallik has authored 67 papers receiving a total of 1.2k indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 36 papers in Mechanical Engineering and 19 papers in Mechanics of Materials. Recurrent topics in Sabuj Mallik's work include Electronic Packaging and Soldering Technologies (37 papers), Rheology and Fluid Dynamics Studies (17 papers) and 3D IC and TSV technologies (16 papers). Sabuj Mallik is often cited by papers focused on Electronic Packaging and Soldering Technologies (37 papers), Rheology and Fluid Dynamics Studies (17 papers) and 3D IC and TSV technologies (16 papers). Sabuj Mallik collaborates with scholars based in United Kingdom, Malaysia and Ghana. Sabuj Mallik's co-authors include N.N. Ekere, Raj Bhatti, Emeka H. Amalu, Kenny C. Otiaba, R. Durairaj, Chris Best, Anasyida Abu Seman, M.O. Alam, S. Ramesh and Michael Okereke and has published in prestigious journals such as SHILAP Revista de lepidopterología, Composites Part B Engineering and Journal of Materials Processing Technology.

In The Last Decade

Sabuj Mallik

65 papers receiving 1.1k citations

Peers

Sabuj Mallik
Claudio V. Di Leo United States
Qiuyu Wang China
L.J. Ernst Netherlands
Ali Usman Pakistan
R. Sridhar India
Rafaël Estevez France
D. A. Caulk United States
Claudio V. Di Leo United States
Sabuj Mallik
Citations per year, relative to Sabuj Mallik Sabuj Mallik (= 1×) peers Claudio V. Di Leo

Countries citing papers authored by Sabuj Mallik

Since Specialization
Citations

This map shows the geographic impact of Sabuj Mallik's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sabuj Mallik with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sabuj Mallik more than expected).

Fields of papers citing papers by Sabuj Mallik

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Sabuj Mallik. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sabuj Mallik. The network helps show where Sabuj Mallik may publish in the future.

Co-authorship network of co-authors of Sabuj Mallik

This figure shows the co-authorship network connecting the top 25 collaborators of Sabuj Mallik. A scholar is included among the top collaborators of Sabuj Mallik based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sabuj Mallik. Sabuj Mallik is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Mallik, Sabuj, et al.. (2025). Finite element comparative study on creep and random vibrations of solder joints in BGA package. SHILAP Revista de lepidopterología. 11. 100085–100085. 1 indexed citations
2.
3.
Amalu, Emeka H., et al.. (2023). Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors. Journal of Electronic Materials. 52(6). 3786–3796. 2 indexed citations
4.
5.
Mallik, Sabuj, et al.. (2023). Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging. Journal of Electronic Materials. 52(7). 4655–4671. 9 indexed citations
6.
Mallik, Sabuj, et al.. (2020). Solder joint failures under thermo-mechanical loading conditions – A review. Advances in Materials and Processing Technologies. 7(1). 1–26. 44 indexed citations
7.
Mallik, Sabuj, et al.. (2015). Effects of component stand-off height on reliability of solder joints in assembled electronic component. European Microelectronics and Packaging Conference. 2 indexed citations
8.
9.
Bhatti, Raj, et al.. (2012). Effects of thermal interface materials (solders) on thermal performance of a microelectronic package. 154–159. 10 indexed citations
10.
Otiaba, Kenny C., Raj Bhatti, N.N. Ekere, et al.. (2012). Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability. 52(7). 1409–1419. 56 indexed citations
11.
Otiaba, Kenny C., N.N. Ekere, Raj Bhatti, Sabuj Mallik, & Emeka H. Amalu. (2011). Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. Greenwich Academic Literature Archive (University of Greenwich). 1–8. 2 indexed citations
12.
Bhatti, Raj, et al.. (2011). Advanced thermal management materials for heat sinks used in microelectronics. European Microelectronics and Packaging Conference. 1–8. 9 indexed citations
13.
Amalu, Emeka H., N.N. Ekere, & Sabuj Mallik. (2011). Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. TeesRep (Teesside University). 32(6). 3189–3197. 35 indexed citations
14.
Mohapatra, Soumya Sanjeeb, et al.. (2010). Effect of Tamarind seed mucilage on rheological properties: evaluation of suspending properties. International Journal of Pharma and Bio Sciences. 1(1). 8–9. 5 indexed citations
15.
Mallik, Sabuj, et al.. (2009). Modeling the Structural Breakdown of Solder Paste Using the Structural Kinetic Model. Journal of Materials Engineering and Performance. 19(1). 40–45. 11 indexed citations
16.
Durairaj, R., et al.. (2008). Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Greenwich Academic Literature Archive (University of Greenwich). 136. 1–8. 5 indexed citations
17.
Mallik, Sabuj, Michael Schmidt, Rudolf Bauer, & N.N. Ekere. (2008). Influence of solder paste components on rheological behaviour. Greenwich Academic Literature Archive (University of Greenwich). 1135–1140. 9 indexed citations
18.
Mallik, Sabuj, et al.. (2007). Effect of Abandon Time on Print Quality and Rheological Characteristics for Lead-Free Solder Pastes used for Flip-Chip Assembly. Greenwich Academic Literature Archive (University of Greenwich). 14–19. 2 indexed citations
19.
Mallik, Sabuj, et al.. (2000). Performance of burnt clay tiles in lining different small irrigation channels of geometric shape.. Journal of Farm Sciences. 13(3). 682–686. 1 indexed citations
20.
Mallik, Sabuj, et al.. (1986). Heat transfer during chemical boiling in the presence of free convection. Journal of Engineering Physics and Thermophysics. 50(4). 461–464. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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