Xiang Dai

779 total citations
33 papers, 584 citations indexed

About

Xiang Dai is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Xiang Dai has authored 33 papers receiving a total of 584 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 11 papers in Mechanics of Materials and 11 papers in Mechanical Engineering. Recurrent topics in Xiang Dai's work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (9 papers) and Mechanical Behavior of Composites (4 papers). Xiang Dai is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (9 papers) and Mechanical Behavior of Composites (4 papers). Xiang Dai collaborates with scholars based in China, United States and Japan. Xiang Dai's co-authors include Paul S. Ho, Robert G. Parker, Christopher G. Cooley, Chunguang Liu, M. Brillhart, Youlin Xu, Jiaqiang Zheng, Guotao Wang, Min Ding and Haichao Song and has published in prestigious journals such as Journal of Cleaner Production, Chemical Engineering Science and Journal of the Science of Food and Agriculture.

In The Last Decade

Xiang Dai

30 papers receiving 550 citations

Peers

Xiang Dai
Petеr Petrov Bulgaria
Khanh-Hung Nguyen South Korea
Jianli Song China
K.-C. Liao Taiwan
Asa Prateepasen Thailand
Jiewen Lin China
José Alfredo Covolan Ulson Brazil
Robert M. Taylor United States
Yujun Xue China
Petеr Petrov Bulgaria
Xiang Dai
Citations per year, relative to Xiang Dai Xiang Dai (= 1×) peers Petеr Petrov

Countries citing papers authored by Xiang Dai

Since Specialization
Citations

This map shows the geographic impact of Xiang Dai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xiang Dai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xiang Dai more than expected).

Fields of papers citing papers by Xiang Dai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Xiang Dai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xiang Dai. The network helps show where Xiang Dai may publish in the future.

Co-authorship network of co-authors of Xiang Dai

This figure shows the co-authorship network connecting the top 25 collaborators of Xiang Dai. A scholar is included among the top collaborators of Xiang Dai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Xiang Dai. Xiang Dai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Dai, Xiang, Haichao Song, & Liangfu Zhou. (2025). Inline mixing efficacy evaluation using an image-based convolutional neural network combined with numerical simulation and mixture sampling. Chemical Engineering Science. 307. 121321–121321.
2.
3.
Xu, Youlin, et al.. (2023). Discharge characteristics of conical and hyperbolic hoppers based on discharge time distribution. Powder Technology. 426. 118665–118665. 2 indexed citations
4.
Dai, Xiang, Youlin Xu, Haichao Song, & Jiaqiang Zheng. (2022). Using image‐based machine learning and numerical simulation to predict pesticide inline mixing uniformity. Journal of the Science of Food and Agriculture. 103(2). 705–719. 6 indexed citations
5.
Xu, Youlin, et al.. (2020). Reconfigurability Evaluation of Multifunctional Intelligent Boom Sprayer Based on Fuzzy Comprehensive Evaluation. Mathematical Problems in Engineering. 2020. 1–10. 2 indexed citations
6.
Dai, Xiang, Youlin Xu, Junyang Chen, & Jiaqiang Zheng. (2020). Evaluation of Mixing Uniformity for Inline Mixers by Image Processing. Transactions of the ASABE. 63(2). 429–443. 5 indexed citations
7.
Xu, Youlin, et al.. (2018). Study on the extraction and reconstruction of arbitrary frequency topography from precision machined surfaces. Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture. 233(7). 1772–1780. 6 indexed citations
8.
Dai, Xiang, Christopher G. Cooley, & Robert G. Parker. (2016). Dynamic tooth root strains and experimental correlations in spur gear pairs. Mechanism and Machine Theory. 101. 60–74. 39 indexed citations
9.
Dai, Xiang, et al.. (2014). Conceptual core design of an innovative small PWR utilizing fully ceramic microencapsulated fuel. Progress in Nuclear Energy. 75. 63–71. 23 indexed citations
10.
Dai, Xiang, Chao Lu, & Ming Zheng. (2014). FEM Analyses of the TOFD Technique in Unequal Thickness Component. Applied Mechanics and Materials. 574. 427–431. 1 indexed citations
11.
12.
Dai, Xiang, Chao Lu, & Guo Chen. (2014). Numerical Simulation Analyses on Thick Wall Pipe with Radial Cracks Using Circumferential Lamb Wave. Applied Mechanics and Materials. 590. 105–109.
13.
Dai, Xiang, Neal P. Juster, & Yi Qin. (2006). The development of a design tool for micro manufacture. Lincoln Repository (University of Lincoln).
14.
Dai, Xiang, et al.. (2005). High I/O Glass Ceramic Package PbiFree BGA Interconnect Reliability. 2. 23–29. 19 indexed citations
15.
Ho, Paul S., et al.. (2004). Reliability issues for flip-chip packages. Microelectronics Reliability. 44(5). 719–737. 59 indexed citations
16.
Dai, Xiang, et al.. (2003). Analysis of flip-chip packages using high resolution moire interferometry. 979–986. 12 indexed citations
17.
Dai, Xiang, M. Brillhart, & Paul S. Ho. (2000). Adhesion measurement for electronic packaging applications using double cantilever beam method. IEEE Transactions on Components and Packaging Technologies. 23(1). 101–116. 50 indexed citations
18.
Dai, Xiang. (1998). Materials study for interfacial adhesion and reliability of microelectronics packaging structures. 5 indexed citations
19.
Dai, Xiang, M. Brillhart, & Paul S. Ho. (1997). Investigation of Underfill Adhesion in Plastic Flip-Chip Packages. 115–124. 3 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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