A.S.M.A. Haseeb

2.4k total citations
99 papers, 2.0k citations indexed

About

A.S.M.A. Haseeb is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, A.S.M.A. Haseeb has authored 99 papers receiving a total of 2.0k indexed citations (citations by other indexed papers that have themselves been cited), including 77 papers in Electrical and Electronic Engineering, 62 papers in Mechanical Engineering and 17 papers in Materials Chemistry. Recurrent topics in A.S.M.A. Haseeb's work include Electronic Packaging and Soldering Technologies (66 papers), 3D IC and TSV technologies (34 papers) and Intermetallics and Advanced Alloy Properties (20 papers). A.S.M.A. Haseeb is often cited by papers focused on Electronic Packaging and Soldering Technologies (66 papers), 3D IC and TSV technologies (34 papers) and Intermetallics and Advanced Alloy Properties (20 papers). A.S.M.A. Haseeb collaborates with scholars based in Malaysia, Japan and United States. A.S.M.A. Haseeb's co-authors include Mohd Rafie Johan, H.H. Masjuki, M.A. Fazal, M.M. Arafat, Klaus J. Bade, Farazila Yusof, M. M. Quazi, Arslan Ahmed, Yingxin Goh and Wan Jefrey Basirun and has published in prestigious journals such as Electrochimica Acta, Journal of Materials Science and Journal of Alloys and Compounds.

In The Last Decade

A.S.M.A. Haseeb

96 papers receiving 1.9k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
A.S.M.A. Haseeb Malaysia 24 1.3k 1.2k 346 288 214 99 2.0k
Jae Pil Jung South Korea 28 2.1k 1.6× 1.3k 1.1× 481 1.4× 191 0.7× 232 1.1× 190 2.8k
Dongyun Zhang China 29 1.1k 0.8× 1.8k 1.4× 925 2.7× 205 0.7× 162 0.8× 134 3.3k
Anmin Hu China 30 1.5k 1.2× 783 0.6× 744 2.2× 240 0.8× 151 0.7× 153 2.5k
Hamid Omidvar Iran 31 665 0.5× 1.6k 1.3× 793 2.3× 271 0.9× 520 2.4× 117 2.5k
Shu Guo China 22 528 0.4× 732 0.6× 669 1.9× 153 0.5× 296 1.4× 61 1.7k
Dongbai Sun China 27 422 0.3× 720 0.6× 967 2.8× 296 1.0× 233 1.1× 91 1.7k
Guangsheng Song China 23 1.0k 0.8× 1.1k 0.9× 667 1.9× 131 0.5× 365 1.7× 88 2.3k
Xiaohua Jie China 25 429 0.3× 797 0.6× 798 2.3× 532 1.8× 195 0.9× 67 1.5k
M. Schneider Germany 30 2.1k 1.7× 657 0.5× 672 1.9× 134 0.5× 263 1.2× 180 3.1k
Hossein Aghajani Iran 27 471 0.4× 896 0.7× 873 2.5× 624 2.2× 224 1.0× 116 1.8k

Countries citing papers authored by A.S.M.A. Haseeb

Since Specialization
Citations

This map shows the geographic impact of A.S.M.A. Haseeb's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A.S.M.A. Haseeb with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A.S.M.A. Haseeb more than expected).

Fields of papers citing papers by A.S.M.A. Haseeb

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A.S.M.A. Haseeb. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A.S.M.A. Haseeb. The network helps show where A.S.M.A. Haseeb may publish in the future.

Co-authorship network of co-authors of A.S.M.A. Haseeb

This figure shows the co-authorship network connecting the top 25 collaborators of A.S.M.A. Haseeb. A scholar is included among the top collaborators of A.S.M.A. Haseeb based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with A.S.M.A. Haseeb. A.S.M.A. Haseeb is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Ang, Bee Chin, et al.. (2025). Progress in degradable polyurethane scaffolds with variable degradation rates for tissue engineering applications. Polymer Engineering and Science. 65(3). 931–949. 3 indexed citations
2.
Ang, Bee Chin, et al.. (2023). Κappa-Carrageenan Modified Polyurethane Foam Scaffolds for Skeletal Muscle Tissue Engineering. Journal of Polymers and the Environment. 31(6). 2653–2667. 4 indexed citations
3.
Arafat, M.M., A.S.M.A. Haseeb, Sheikh A. Akbar, et al.. (2021). Growth of 1D TiO 2 nanostructures on Ti substrates incorporated with residual stress through humid oxidation and their characterizations. Nanotechnology. 32(47). 475607–475607. 3 indexed citations
4.
Haseeb, A.S.M.A., et al.. (2020). Recent advances in tissue engineering scaffolds based on polyurethane and modified polyurethane. Materials Science and Engineering C. 118. 111228–111228. 159 indexed citations
5.
Arafat, M.M., Shaifulazuar Rozali, A.S.M.A. Haseeb, & S. S. Ibrahim. (2020). Direct and catalyst-free synthesis of ZnO nanowires on brass by thermal oxidation. Nanotechnology. 31(17). 175603–175603. 8 indexed citations
6.
7.
Haseeb, A.S.M.A., et al.. (2016). Effect of Pedestal Temperature on Bonding Strength and Deformation Characteristics for 5N Copper Wire Bonding. Journal of Electronic Materials. 45(6). 3244–3248. 5 indexed citations
8.
Leong, Yee‐Kwong & A.S.M.A. Haseeb. (2016). Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition. Materials. 9(7). 522–522. 26 indexed citations
9.
Haseeb, A.S.M.A., et al.. (2015). Mechanical properties of intermetallic compounds in electrodeposited multilayered thin film at small scale by nanoindentation. Materials Letters. 147. 50–53. 14 indexed citations
10.
Haseeb, A.S.M.A., et al.. (2014). Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate. Materials Characterization. 97. 199–209. 49 indexed citations
11.
12.
Goh, Yingxin, et al.. (2013). Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow. Journal of Materials Science Materials in Electronics. 24(6). 2052–2057. 6 indexed citations
13.
Haseeb, A.S.M.A., et al.. (2012). Effects of Sn concentration and current density on Sn-Bi electrodeposition in additive free plating bath. 10. 286–290. 2 indexed citations
14.
Haseeb, A.S.M.A., et al.. (2011). Effects of addition of copper particles of different size to Sn-3.5Ag solder. Journal of Materials Science Materials in Electronics. 23(1). 86–93. 9 indexed citations
15.
Haseeb, A.S.M.A., et al.. (2011). Understanding the effects of addition of copper nanoparticles to Sn‐3.5 Ag solder. Soldering and Surface Mount Technology. 23(2). 68–74. 26 indexed citations
16.
Haseeb, A.S.M.A., et al.. (2010). Effect of addition Cobalt nanoparticles on Sn-Ag-Cu lead-free solder. 433–436. 8 indexed citations
17.
Haque, A., et al.. (2010). Investigations on Zn-Al-Ge alloys as high temperature die attach material. 1–5. 7 indexed citations
18.
Chong, Wu Yi, et al.. (2009). Spreading profile of dopant solution on pre-sintered silica layers for selective area doping of integrated optic planar glass samples. Thin Solid Films. 518(1). 378–382. 1 indexed citations
19.
Haseeb, A.S.M.A. & Klaus J. Bade. (2007). LIGA fabrication of nanocrystalline Ni–W alloy micro specimens from ammonia-citrate bath. Microsystem Technologies. 14(3). 379–388. 18 indexed citations
20.
Haseeb, A.S.M.A., et al.. (2007). Friction and wear characteristics of electrodeposited nanocrystalline nickel–tungsten alloy films. Wear. 264(1-2). 106–112. 87 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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