Choong-Jae Lee

586 total citations
49 papers, 469 citations indexed

About

Choong-Jae Lee is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Choong-Jae Lee has authored 49 papers receiving a total of 469 indexed citations (citations by other indexed papers that have themselves been cited), including 45 papers in Electrical and Electronic Engineering, 22 papers in Mechanical Engineering and 9 papers in Biomedical Engineering. Recurrent topics in Choong-Jae Lee's work include Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (29 papers) and Intermetallics and Advanced Alloy Properties (8 papers). Choong-Jae Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (29 papers) and Intermetallics and Advanced Alloy Properties (8 papers). Choong-Jae Lee collaborates with scholars based in South Korea. Choong-Jae Lee's co-authors include Seung‐Boo Jung, Kyung Deuk Min, Kwang‐Ho Jung, Jinho Joo, Jungsoo Kim, Don-Hyun Choi, Byunghoon Lee, Ja‐Myeong Koo, Jun‐Ho Jang and Jungsoo Kim and has published in prestigious journals such as Applied Surface Science, Composites Part B Engineering and Journal of Alloys and Compounds.

In The Last Decade

Choong-Jae Lee

48 papers receiving 459 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Choong-Jae Lee South Korea 13 393 282 49 42 38 49 469
Kyung Deuk Min South Korea 13 311 0.8× 226 0.8× 25 0.5× 34 0.8× 31 0.8× 42 375
Sehoon Yoo South Korea 13 475 1.2× 290 1.0× 59 1.2× 86 2.0× 57 1.5× 88 605
Barbara Horváth Hungary 14 355 0.9× 191 0.7× 57 1.2× 82 2.0× 38 1.0× 31 445
Klaus-Juergen Wolter Germany 12 318 0.8× 164 0.6× 62 1.3× 75 1.8× 56 1.5× 48 393
Junghwan Bang South Korea 12 422 1.1× 300 1.1× 31 0.6× 47 1.1× 18 0.5× 51 478
K.-J. Wolter Germany 11 419 1.1× 193 0.7× 71 1.4× 54 1.3× 73 1.9× 74 506
Ruyu Tian China 14 374 1.0× 374 1.3× 55 1.1× 73 1.7× 63 1.7× 30 563
Yong-Ho Ko South Korea 14 612 1.6× 423 1.5× 82 1.7× 69 1.6× 27 0.7× 54 689
Yoonchul Sohn South Korea 10 420 1.1× 312 1.1× 97 2.0× 116 2.8× 34 0.9× 38 579
Lianyong Xu China 14 195 0.5× 272 1.0× 126 2.6× 107 2.5× 52 1.4× 29 458

Countries citing papers authored by Choong-Jae Lee

Since Specialization
Citations

This map shows the geographic impact of Choong-Jae Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Choong-Jae Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Choong-Jae Lee more than expected).

Fields of papers citing papers by Choong-Jae Lee

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Choong-Jae Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Choong-Jae Lee. The network helps show where Choong-Jae Lee may publish in the future.

Co-authorship network of co-authors of Choong-Jae Lee

This figure shows the co-authorship network connecting the top 25 collaborators of Choong-Jae Lee. A scholar is included among the top collaborators of Choong-Jae Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Choong-Jae Lee. Choong-Jae Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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2.
Jang, Jun‐Ho, et al.. (2021). Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test. Journal of Electronic Materials. 50(10). 5639–5646. 3 indexed citations
3.
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Jung, Kwang‐Ho, et al.. (2020). Thermal and Thermomechanical Behaviors of the Fan-Out Package With Embedded Ag Patterns. IEEE Transactions on Components Packaging and Manufacturing Technology. 10(9). 1432–1437. 7 indexed citations
5.
Min, Kyung Deuk, et al.. (2020). Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi. Journal of Alloys and Compounds. 857. 157595–157595. 6 indexed citations
6.
Min, Kyung Deuk, et al.. (2020). Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding. Electronic Materials Letters. 16(4). 347–354. 3 indexed citations
7.
Min, Kyung Deuk, et al.. (2020). Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test. Microelectronics Reliability. 112. 113918–113918. 12 indexed citations
8.
Lee, Choong-Jae, et al.. (2020). Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering. Journal of Material Science and Technology. 53. 13–18. 8 indexed citations
9.
Lee, Choong-Jae, et al.. (2020). The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature. Journal of Electronic Materials. 49(11). 6746–6753. 8 indexed citations
10.
Lee, Choong-Jae, et al.. (2020). Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process. Electronic Materials Letters. 16(4). 332–339. 4 indexed citations
11.
Jung, Kwang‐Ho, et al.. (2020). Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package. Journal of Materials Science Materials in Electronics. 31(9). 6835–6842. 18 indexed citations
12.
Min, Kyung Deuk, Kwang‐Ho Jung, Choong-Jae Lee, & Seung‐Boo Jung. (2019). Pressureless Transient Liquid Phase Sintering Bonding of Sn-58Bi with Ni Particles for High-Temperature Packaging Applications. 2290–2295. 1 indexed citations
13.
Lee, Choong-Jae, et al.. (2019). The effect of pH on synthesizing Ni-decorated MWCNTs and its application for Sn-58Bi solder. Current Applied Physics. 19(11). 1182–1186. 7 indexed citations
14.
Lee, Choong-Jae, et al.. (2019). Electromigration Behavior of Sn58Bi and Sn58Bi Epoxy Solder Joint. Science of Advanced Materials. 12(4). 538–543. 1 indexed citations
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Lee, Choong-Jae, et al.. (2019). Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder. Journal of Materials Science Materials in Electronics. 30(14). 12869–12875. 4 indexed citations
17.
Kim, Jungsoo, et al.. (2018). Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB. Journal of Alloys and Compounds. 775. 581–588. 28 indexed citations
18.
Lee, Choong-Jae, et al.. (2018). Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles. Journal of Electronic Materials. 48(3). 1746–1753. 8 indexed citations
19.
Jung, Kwang‐Ho, et al.. (2018). Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy. Journal of Alloys and Compounds. 748. 898–904. 5 indexed citations
20.
Lee, Choong-Jae, et al.. (2017). Thermal Characteristic of Sn-MWCNT Nanocomposite Solder in LED Package. 2225–2230. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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