K. P. Rodbell
- Electrical and Electronic Engineering top 5%
- Electronic, Optical and Magnetic Materials top 5%
- Mechanics of Materials top 5%
- Materials Chemistry
- Atomic and Molecular Physics, and Optics top 10%
- Co-authors
- J. M. E. HarperC.‐K. HuD. EdelsteinR. RosenbergC. CabralE. G. ColganKatayun BarmakP. J. Simpson
- Topics
- Copper Interconnects and Reliability (30 papers)Semiconductor materials and devices (16 papers)Electronic Packaging and Soldering Technologies (8 papers)
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringMechanics of Materials
- Partner nations
- United StatesItalyCanada
In The Last Decade
K. P. Rodbell
31 papers receiving 891 citations
Peers
Comparison fields: 5 of 43
- Electrical and Electronic Engineering 682
- Electronic, Optical and Magnetic Materials 633
- Mechanics of Materials 290
- Materials Chemistry 205
- Atomic and Molecular Physics, and Optics 180
Countries citing papers authored by K. P. Rodbell
This map shows the geographic impact of K. P. Rodbell's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. P. Rodbell with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. P. Rodbell more than expected).
Fields of papers citing papers by K. P. Rodbell
This network shows the impact of papers produced by K. P. Rodbell. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. P. Rodbell. The network helps show where K. P. Rodbell may publish in the future.
Co-authorship network of co-authors of K. P. Rodbell
This figure shows the co-authorship network connecting the top 25 collaborators of K. P. Rodbell. A scholar is included among the top collaborators of K. P. Rodbell based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K. P. Rodbell. K. P. Rodbell is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | Interconnect Material Choices for Future Scaled Devices | 1 |
| 2 | 9 | |
| 3 | 102 | |
| 4 | 3 | |
| 5 | 0 | |
| 6 | 17 | |
| 7 | 346 | |
| 8 | 1 | |
| 9 | 5 | |
| 10 | 6 | |
| 11 | 21 | |
| 12 | 82 | |
| 13 | 12 | |
| 14 | 1 | |
| 15 | 8 | |
| 16 | 3 | |
| 17 | 5 | |
| 18 | 2 | |
| 19 | 16 | |
| 20 | 11 |
About K. P. Rodbell
K. P. Rodbell is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Mechanics of Materials, having authored 32 papers that have together received 950 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (30 papers), Semiconductor materials and devices (16 papers) and Electronic Packaging and Soldering Technologies (8 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (633 citations), Electrical and Electronic Engineering (682 citations) and Mechanics of Materials (290 citations). K. P. Rodbell has collaborated with scholars based in United States, Italy and Canada. Frequent co-authors include J. M. E. Harper, C.‐K. Hu, D. Edelstein, R. Rosenberg, C. Cabral, E. G. Colgan, Katayun Barmak, P. J. Simpson, K. G. Lynn and Kevin O’Brien. Their work appears in journals such as Physical review. B, Condensed matter, Applied Physics Letters and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.