K. P. Rodbell

1.2k total citations
32 papers, 950 citations indexed

About

K. P. Rodbell is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, K. P. Rodbell has authored 32 papers receiving a total of 950 indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electronic, Optical and Magnetic Materials, 22 papers in Electrical and Electronic Engineering and 9 papers in Mechanics of Materials. Recurrent topics in K. P. Rodbell's work include Copper Interconnects and Reliability (30 papers), Semiconductor materials and devices (16 papers) and Electronic Packaging and Soldering Technologies (8 papers). K. P. Rodbell is often cited by papers focused on Copper Interconnects and Reliability (30 papers), Semiconductor materials and devices (16 papers) and Electronic Packaging and Soldering Technologies (8 papers). K. P. Rodbell collaborates with scholars based in United States, Italy and Canada. K. P. Rodbell's co-authors include J. M. E. Harper, C.‐K. Hu, D. Edelstein, R. Rosenberg, C. Cabral, E. G. Colgan, Katayun Barmak, P. J. Simpson, K. G. Lynn and Kevin O’Brien and has published in prestigious journals such as Physical review. B, Condensed matter, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

K. P. Rodbell

31 papers receiving 891 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
K. P. Rodbell United States	13	682	633	290	205	180	32	950
P. M. Fryer United States	13	886 1.3×	559 0.9×	297 1.0×	219 1.1×	430 2.4×	20	1.1k
J.S. Reid United States	16	806 1.2×	655 1.0×	564 1.9×	243 1.2×	277 1.5×	22	1.1k
J. M. Molarius Finland	14	458 0.7×	232 0.4×	526 1.8×	392 1.9×	130 0.7×	46	816
Brad J. Burrow United States	9	490 0.7×	285 0.5×	307 1.1×	134 0.7×	234 1.3×	12	668
Miki Moriyama Japan	14	427 0.6×	247 0.4×	179 0.6×	222 1.1×	162 0.9×	26	611
Mao‐Chieh Chen Taiwan	17	608 0.9×	413 0.7×	221 0.8×	164 0.8×	177 1.0×	61	717
Tik Sun United States	10	369 0.5×	304 0.5×	117 0.4×	196 1.0×	169 0.9×	20	548
Sergey Grachev France	15	298 0.4×	190 0.3×	307 1.1×	415 2.0×	164 0.9×	45	759
T. Scherban United States	17	434 0.6×	385 0.6×	247 0.9×	594 2.9×	59 0.3×	26	968
E. Sakuma Poland	18	977 1.4×	239 0.4×	104 0.4×	275 1.3×	255 1.4×	37	1.2k

Countries citing papers authored by K. P. Rodbell

Since Specialization

Citations

This map shows the geographic impact of K. P. Rodbell's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. P. Rodbell with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. P. Rodbell more than expected).

Fields of papers citing papers by K. P. Rodbell

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K. P. Rodbell. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. P. Rodbell. The network helps show where K. P. Rodbell may publish in the future.

Co-authorship network of co-authors of K. P. Rodbell

This figure shows the co-authorship network connecting the top 25 collaborators of K. P. Rodbell. A scholar is included among the top collaborators of K. P. Rodbell based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K. P. Rodbell. K. P. Rodbell is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Pyzyna, A., et al.. (2012). Interconnect Material Choices for Future Scaled Devices. 1 indexed citations

Rodbell, K. P., et al.. (2006). Underlayer effects on texture evolution in copper films. Thin Solid Films. 503(1-2). 207–211. 9 indexed citations

Barmak, Katayun, C. Cabral, K. P. Rodbell, & J. M. E. Harper. (2006). On the use of alloying elements for Cu interconnect applications. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 24(6). 2485–2498. 102 indexed citations

Kozaczek, K. J., Conal E. Murray, & K. P. Rodbell. (2005). Effects of Dielectric Roughness on Texture of Both PVD Seed Layers and EP Copper. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 105. 391–396. 3 indexed citations

Murray, Conal E. & K. P. Rodbell. (2001). Texture Evolution in Al(Cu) Interconnect Materials. MRS Proceedings. 672.

Murray, Conal E. & K. P. Rodbell. (2001). Texture inheritance in Al(Cu) interconnect materials. Journal of Applied Physics. 89(4). 2337–2342. 17 indexed citations

Rosenberg, R., D. Edelstein, C.‐K. Hu, & K. P. Rodbell. (2000). Copper Metallization for High Performance Silicon Technology. Annual Review of Materials Science. 30(1). 229–262. 346 indexed citations

DeHaven, Patrick W., K. P. Rodbell, & L. Gignac. (1999). In-Situ Study of Ti/TiN Stability under Nitrogen Anneal. MRS Proceedings. 564. 1 indexed citations

Rodbell, K. P., et al.. (1998). AC electromigration (10 MHz–1 GHz) in Al metallization. 212–223. 5 indexed citations

10.

Filippi, R. G., et al.. (1997). Electromigration behavior of hot-sputtered Al(Cu) versus chemical vapor deposition W vias. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 15(3). 750–756. 6 indexed citations

11.

Copel, M., K. P. Rodbell, & R. M. Tromp. (1996). Cu segregation at the Al(Cu)/Al2O3 interface. Applied Physics Letters. 68(12). 1625–1627. 21 indexed citations

12.

O’Brien, Kevin, et al.. (1996). Detection of current-induced vacancies in thin aluminum–copper lines using positrons. Applied Physics Letters. 68(3). 406–408. 82 indexed citations

13.

Rodbell, K. P., et al.. (1994). Local Texture and Electromigration in Fine Line Microelectronic Aluminum Metallization. MRS Proceedings. 343. 12 indexed citations

14.

Knorr, D. B. & K. P. Rodbell. (1994). Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects. Materials science forum. 157-162. 1435–1442. 1 indexed citations

15.

Rodbell, K. P., et al.. (1994). Manufacturability Versus Reliability Issues Relevant to Interconnect Metallizations.. MRS Proceedings. 337. 8 indexed citations

16.

Rodbell, K. P., et al.. (1993). Grain Growth in Al-(Cu, Pd, Nb) Thin Films. MRS Proceedings. 309. 3 indexed citations

17.

Colgan, E. G., et al.. (1993). The Effect of Annealing on the Cu Distribution and AI₂Cu Precipitation in Ai(Cu) Thin Films. MRS Proceedings. 309. 5 indexed citations

18.

Rodbell, K. P.. (1992). Electromigration behavior of multilayered Al/Hf and Al/Ti fine lines and its dependence on Cu and Pd solute additions. Microelectronics Reliability. 32(11). 1521–1526. 2 indexed citations

19.

Rodbell, K. P., D. B. Knorr, & D. P. Tracy. (1992). Texture Effects on the Electromigration Behavior of Layered Ti/AlCu/Ti Films. MRS Proceedings. 265(1). 107–112. 16 indexed citations

20.

Rodbell, K. P., et al.. (1991). Fine-line interactions in Al/Hf/Al thin films. Physical review. B, Condensed matter. 43(2). 1422–1432. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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