J. M. E. Harper

6.9k citations

155 papers · 5.5k indexed · 1 hit paper · h-index 39

Electronic, Optical and Magnetic Materials top 1%
- Copper Interconnects and Reliability 57
Mechanics of Materials top 0.5%
- Metal and Thin Film Mechanics 44
Electrical and Electronic Engineering top 1%
- Semiconductor materials and devices 56
- Electronic Packaging and Soldering Technologies 11
Atomic and Molecular Physics, and Optics top 2%
- Semiconductor materials and interfaces 48
Condensed Matter Physics top 5%
Computational Mechanics
- Ion-surface interactions and analysis 32
Mechanical Engineering
- Intermetallics and Advanced Alloy Properties 12
- Aluminum Alloys Composites Properties 11

Co-authors: C. Cabral F. M. d’Heurle J. J. Cuomo H. R. Kaufman C.‐K. Hu P. M. Fryer Katayun Barmak K. P. Rodbell
Cited by: Electronic, Optical and Magnetic Materials Mechanics of Materials Electrical and Electronic Engineering
Journals: Journal of Applied Physics (28 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (17 papers)Applied Physics Letters (13 papers)
Partner nations: United States Sweden Canada

In The Last Decade

J. M. E. Harper

152 papers receiving 5.2k citations

Hit Papers

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Peers

Countries citing papers authored by J. M. E. Harper

Since Specialization

Citations

This map shows the geographic impact of J. M. E. Harper's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. M. E. Harper with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. M. E. Harper more than expected).

Fields of papers citing papers by J. M. E. Harper

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. M. E. Harper. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. M. E. Harper. The network helps show where J. M. E. Harper may publish in the future.

Co-authorship network

The 25 scholars most cited alongside J. M. E. Harper, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with J. M. E. Harper Line = papers co-authored together J. M. E. Harper links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Copper Interconnect: Fabrication And Reliability Chunhua Hu,J. M. E. Harper	2005	3
2	Texture of TiSi2 thin films on Si (001) Journal of Applied Physics ·Ahmet S. Özcan,Karl Ludwig,Ermes Giuzio,C. Lavoie,C. Cabral,J. M. E. Harper	2002	25
3	Cu and Dilute Binary Cu(Ti), Cu(Sn) and Cu(Al) Thin Films: Texture, Grain Growth and Resistivity MRS Proceedings ·Dirk Basart,Katayun Barmak,Anthony D. Rollett,C. Cabral,J. M. E. Harper	2002	2
4	Texture and resistivity of dilute binary Cu(Al), Cu(In), Cu(Ti), Cu(Nb), Cu(Ir), and Cu(W) alloy thin films Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena ·Dirk Basart,Katayun Barmak,Anthony D. Rollett,C. Cabral,J. M. E. Harper	2002	18
5	Texture formation in Ti–Ta alloy disilicide thin films Journal of Applied Physics ·Ahmet S. Özcan,Karl Ludwig,C. Cabral,C. Lavoie,J. M. E. Harper	2002	5
6	Formation of C54 TiSi2: Effects of niobium additions on the apparent activation energy Journal of Applied Physics ·F. M. d’Heurle,R Sivakumar,C. Lavoie,P. Gas,C. Cabral,J. M. E. Harper	2001	5
7	Dissociation of dilute immiscible copper alloy thin films Journal of Applied Physics ·Katayun Barmak,G. Lucadamo,C. Cabral,C. Lavoie,J. M. E. Harper	2000	48
8	In situ and Ex situ Measurements of Stress Evolution in the Cobalt-Silicon System MRS Proceedings ·G. Lucadamo,C. Lavoie,C. Cabral,R. Carruthers,J. M. E. Harper	2000	4
9	Crystallographic texture change during abnormal grain growth in Cu-Co thin films Applied Physics Letters ·J. M. E. Harper,純森泉,D. A. Smith,Madhusudhana Reddy H,Karen Holloway,C. Cabral,D. P. Tracy,D. B. Knorr	1994	31
10	Giant magnetoresistance of dilute Cu(Co) granular films Journal of Applied Physics ·R. J. Gambino,T. R. McGuire,J. M. E. Harper,C. Cabral	1994	11
11	Rapid Evaluation of Thin Film Interfacial Reactions Using Temperature-Ramped Measurements MRS Proceedings ·J. M. E. Harper,L. A. Clevenger,E. G. Colgan,C. Cabral,W. Hachmann	1993	4
12	Detection of Titanium Silicide Formation and Phase Transformation by Picosecond Ultrasonics MRS Proceedings ·Heh‐Nan Lin,Robert Stoner,Humphrey J. Maris,J. M. E. Harper,C. Cabral,J.-M. Halbout,Gary W. Rubloff	1992	1
13	Highly selective argon–oxygen ion beam etching process for Pb alloys Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ·David F. Moore,Juan Carlos Severiche Maldonado,A. W. Kleinsasser,J. M. E. Harper	1985	1
14	Reactive sputtering of copper and silicon near the sputtering threshold Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ·T. M. Mayer,J. M. E. Harper,J. J. Cuomo	1985	5
15	Synthesis of compound thin films by dual ion beam deposition. I. Experimental approach Journal of Applied Physics ·J. M. E. Harper,J. J. Cuomo,H. T. G. Hentzell	1985	58
16	Summary Abstract: A quantitative ion beam process applied to the deposition of aluminum nitride thin films Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ·J. M. E. Harper,H. T. G. Hentzell,J. J. Cuomo	1984	3
17	Summary Abstract: Developments in broad-beam ion source technology and applications Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ·J. M. E. Harper,J. J. Cuomo,H. R. Kaufman	1983	3
18	Quantitative ion beam process for the deposition of compound thin films Applied Physics Letters ·J. M. E. Harper,J. J. Cuomo,H. T. G. Hentzell	1983	96
19	Materials and techniques used in nanostructure fabrication Journal of Vacuum Science and Technology ·W. W. Molzen,A. N. Broers,J. J. Cuomo,J. M. E. Harper,R. B. Laibowitz	1979	35
20	Origin and Effects of Negative Ions in the Sputtering of Intermetallic Compounds IBM Journal of Research and Development ·J. J. Cuomo,R. J. Gambino,J. M. E. Harper,J. D. Kuptsis	1977	36

About J. M. E. Harper

J. M. E. Harper is a scholar working on Electronic, Optical and Magnetic Materials, Mechanics of Materials, Atomic and Molecular Physics, and Optics, Computational Mechanics and Electrical and Electronic Engineering, having authored 155 papers that have together received 5.5k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (57 papers), Semiconductor materials and devices (56 papers), Semiconductor materials and interfaces (48 papers), Metal and Thin Film Mechanics (44 papers), Ion-surface interactions and analysis (32 papers), Intermetallics and Advanced Alloy Properties (12 papers), Aluminum Alloys Composites Properties (11 papers) and Electronic Packaging and Soldering Technologies (11 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (2.3k citations), Mechanics of Materials (1.9k citations), Electrical and Electronic Engineering (3.5k citations), Atomic and Molecular Physics, and Optics (1.6k citations) and Condensed Matter Physics (463 citations). J. M. E. Harper has collaborated with scholars based in United States, Sweden and Canada. Frequent co-authors include C. Cabral, F. M. d’Heurle, J. J. Cuomo, H. R. Kaufman, C.‐K. Hu, J. J. Cuomo, P. M. Fryer, Katayun Barmak, K. P. Rodbell and H. T. G. Hentzell. Their work appears in journals such as Journal of Applied Physics, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, Applied Physics Letters, Thin Solid Films and Journal of materials research/Pratt's guide to venture capital sources.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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