T. Scherban

1.2k total citations
26 papers, 968 citations indexed

About

T. Scherban is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, T. Scherban has authored 26 papers receiving a total of 968 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electronic, Optical and Magnetic Materials, 14 papers in Electrical and Electronic Engineering and 12 papers in Mechanics of Materials. Recurrent topics in T. Scherban's work include Metal and Thin Film Mechanics (12 papers), Copper Interconnects and Reliability (11 papers) and Magnetic and transport properties of perovskites and related materials (6 papers). T. Scherban is often cited by papers focused on Metal and Thin Film Mechanics (12 papers), Copper Interconnects and Reliability (11 papers) and Magnetic and transport properties of perovskites and related materials (6 papers). T. Scherban collaborates with scholars based in United States, Spain and France. T. Scherban's co-authors include A. S. Nowick, Rémy Villeneuve, L. Abello, G. Lucazeau, Benyuan Sun, J. Maiz, J.M. Sánchez, J.M. Martínez–Esnaola, Daniel Pantuso and M.R. Elizalde and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Solid State Ionics.

In The Last Decade

T. Scherban

26 papers receiving 937 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
T. Scherban United States 17 594 434 385 247 159 26 968
Li Chang Taiwan 19 919 1.5× 461 1.1× 537 1.4× 245 1.0× 208 1.3× 85 1.2k
Richard Ostwald Belgium 14 314 0.5× 382 0.9× 293 0.8× 197 0.8× 146 0.9× 48 766
J. Pacaud France 17 1.1k 1.8× 468 1.1× 247 0.6× 575 2.3× 121 0.8× 36 1.4k
Hsiu‐Fung Cheng Taiwan 20 1.1k 1.9× 697 1.6× 189 0.5× 185 0.7× 209 1.3× 88 1.2k
Yekan Wang United States 15 645 1.1× 307 0.7× 189 0.5× 145 0.6× 82 0.5× 27 828
A. V. Sotnikov Germany 17 1.2k 2.0× 503 1.2× 634 1.6× 81 0.3× 279 1.8× 86 1.3k
Teresa Hungrı́a France 21 991 1.7× 341 0.8× 545 1.4× 73 0.3× 259 1.6× 60 1.2k
Masaki Fujikane Japan 12 509 0.9× 255 0.6× 111 0.3× 163 0.7× 88 0.6× 22 669
Л. А. Резниченко Russia 16 1.1k 1.9× 548 1.3× 750 1.9× 69 0.3× 259 1.6× 227 1.3k
G. Merad Algeria 17 593 1.0× 267 0.6× 231 0.6× 126 0.5× 57 0.4× 47 842

Countries citing papers authored by T. Scherban

Since Specialization
Citations

This map shows the geographic impact of T. Scherban's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Scherban with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Scherban more than expected).

Fields of papers citing papers by T. Scherban

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Scherban. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Scherban. The network helps show where T. Scherban may publish in the future.

Co-authorship network of co-authors of T. Scherban

This figure shows the co-authorship network connecting the top 25 collaborators of T. Scherban. A scholar is included among the top collaborators of T. Scherban based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Scherban. T. Scherban is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Molina-Aldareguía, J.M., David González, M.R. Elizalde, et al.. (2006). Fracture characterization in patterned thin films by cross-sectional nanoindentation☆. Acta Materialia. 54(13). 3453–3462. 33 indexed citations
2.
Molina-Aldareguía, J.M., David González, M.R. Elizalde, et al.. (2006). Adhesion studies in integrated circuit interconnect structures. Engineering Failure Analysis. 14(2). 349–354. 11 indexed citations
3.
Scherban, T.. (2006). Fracture of Low-k Dielectric Films and Interfaces. AIP conference proceedings. 817. 83–91. 3 indexed citations
4.
Ho, Paul S., et al.. (2006). Effect of passivation on stress relaxation in electroplated copper films. Journal of materials research/Pratt's guide to venture capital sources. 21(6). 1512–1518. 35 indexed citations
5.
Ho, Paul S., et al.. (2005). Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements. Journal of Applied Physics. 97(10). 60 indexed citations
6.
Dauskardt, Reinhold H., T. Scherban, Guangyong Xu, et al.. (2004). Interfacial adhesion of thin-film patterned interconnect structures. 168–170. 6 indexed citations
7.
Andideh, E., et al.. (2004). Compositional effects on electrical and mechanical properties in carbon-doped oxide dielectric films: Application of Fourier-transform infrared spectroscopy. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 22(1). 196–201. 40 indexed citations
8.
Elizalde, M.R., J.M. Sánchez, J.M. Martínez–Esnaola, et al.. (2003). Interfacial fracture induced by cross-sectional nanoindentation in metal–ceramic thin film structures. Acta Materialia. 51(14). 4295–4305. 39 indexed citations
9.
Scherban, T., Daniel Pantuso, Benyuan Sun, et al.. (2003). Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation. International Journal of Fracture. 120(1-2). 421–429. 15 indexed citations
10.
Andideh, E., et al.. (2003). Cohesive strength characterization of brittle low-k films. 57–59. 16 indexed citations
11.
Read, David T., Roy H. Geiss, T. Scherban, et al.. (2003). Nanoindentation and Tensile Behavior of Copper Films. MRS Proceedings. 778. 7 indexed citations
12.
Andideh, E., et al.. (2001). Interfacial adhesion of copper-low k interconnects. 257–259. 44 indexed citations
13.
Palacio, Manuel L. B., et al.. (2001). Nanoindentation Analysis of Viscoelastic Thin Films: Strain Rate and Adhesion Effects. MRS Proceedings. 695. 2 indexed citations
14.
Sánchez, J.M., Benyuan Sun, T. Scherban, et al.. (1999). Cross-sectional nanoindentation: a new technique for thin film interfacial adhesion characterization. Acta Materialia. 47(17). 4405–4413. 105 indexed citations
15.
Scherban, T., et al.. (1993). H+/D+ isotope effect in Y-doped BaCeO3 crystals. Solid State Ionics. 66(1-2). 159–164. 35 indexed citations
16.
Scherban, T., Rémy Villeneuve, L. Abello, & G. Lucazeau. (1993). Raman scattering study of acceptor-doped BaCeO3. Solid State Ionics. 61(1-3). 93–98. 79 indexed citations
17.
Scherban, T., Rémy Villeneuve, L. Abello, & G. Lucazeau. (1993). Raman scattering study of phase transitions in undoped and rare earth ion‐doped BaCeO3 and SrCeO3. Journal of Raman Spectroscopy. 24(11). 805–814. 53 indexed citations
18.
Scherban, T., Rémy Villeneuve, L. Abello, & G. Lucazeau. (1992). Raman scattering study of BaCeO3 and SrCeO3. Solid State Communications. 84(3). 341–344. 62 indexed citations
19.
Scherban, T.. (1989). Bulk protonic conduction in Yb-doped SrCeO3. Solid State Ionics. 35(1-2). 189–194. 136 indexed citations
20.
Scherban, T., et al.. (1988). Bulk protonic conduction in Yb-doped SrCeO3 and BaCeO3. Solid State Ionics. 28-30. 585–588. 62 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Li Chang Breakdown of academic impact, for papers by Richard Ostwald Breakdown of academic impact, for papers by J. Pacaud Breakdown of academic impact, for papers by Hsiu‐Fung Cheng Breakdown of academic impact, for papers by Yekan Wang Breakdown of academic impact, for papers by A. V. Sotnikov Breakdown of academic impact, for papers by Teresa Hungrı́a Breakdown of academic impact, for papers by Masaki Fujikane Breakdown of academic impact, for papers by Л. А. Резниченко Breakdown of academic impact, for papers by G. Merad
Rankless by CCL
2026