Thomas E. Sarvey

612 total citations
30 papers, 510 citations indexed

About

Thomas E. Sarvey is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Computational Mechanics. According to data from OpenAlex, Thomas E. Sarvey has authored 30 papers receiving a total of 510 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Mechanical Engineering, 21 papers in Electrical and Electronic Engineering and 8 papers in Computational Mechanics. Recurrent topics in Thomas E. Sarvey's work include Heat Transfer and Optimization (24 papers), Heat Transfer and Boiling Studies (15 papers) and 3D IC and TSV technologies (12 papers). Thomas E. Sarvey is often cited by papers focused on Heat Transfer and Optimization (24 papers), Heat Transfer and Boiling Studies (15 papers) and 3D IC and TSV technologies (12 papers). Thomas E. Sarvey collaborates with scholars based in United States and China. Thomas E. Sarvey's co-authors include Muhannad S. Bakir, Yogendra Joshi, Andrei G. Fedorov, Xuchen Zhang, Yuanchen Hu, Peter A. Kottke, Suresh K. Sitaraman, Arifur Rahman, Xuefei Han and Aravind Dasu and has published in prestigious journals such as International Journal of Heat and Mass Transfer, Journal of Heat Transfer and Journal of Electronic Packaging.

In The Last Decade

Thomas E. Sarvey

30 papers receiving 495 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Thomas E. Sarvey United States 13 375 236 73 67 57 30 510
Vadim Gektin United States 9 230 0.6× 211 0.9× 39 0.5× 30 0.4× 72 1.3× 28 413
Je-Young Chang United States 9 439 1.2× 73 0.3× 68 0.9× 98 1.5× 41 0.7× 23 505
Hilton Toy United States 6 268 0.7× 121 0.5× 41 0.6× 33 0.5× 46 0.8× 9 346
R. J. Bezama United States 7 482 1.3× 129 0.5× 67 0.9× 90 1.3× 54 0.9× 10 547
T.F. Lemczyk Canada 11 205 0.5× 122 0.5× 37 0.5× 37 0.6× 55 1.0× 14 347
J.G. Maveety United States 12 403 1.1× 125 0.5× 192 2.6× 174 2.6× 40 0.7× 20 569
Jeffrey A. Zitz United States 6 261 0.7× 105 0.4× 39 0.5× 31 0.5× 31 0.5× 10 324
Raphael Mandel United States 11 322 0.9× 108 0.5× 36 0.5× 92 1.4× 36 0.6× 35 401
Mark Mihalic United States 10 143 0.4× 274 1.2× 19 0.3× 25 0.4× 106 1.9× 13 424
Gary Mandrusiak United States 14 182 0.5× 282 1.2× 32 0.4× 72 1.1× 46 0.8× 24 502

Countries citing papers authored by Thomas E. Sarvey

Since Specialization
Citations

This map shows the geographic impact of Thomas E. Sarvey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Thomas E. Sarvey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Thomas E. Sarvey more than expected).

Fields of papers citing papers by Thomas E. Sarvey

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Thomas E. Sarvey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Thomas E. Sarvey. The network helps show where Thomas E. Sarvey may publish in the future.

Co-authorship network of co-authors of Thomas E. Sarvey

This figure shows the co-authorship network connecting the top 25 collaborators of Thomas E. Sarvey. A scholar is included among the top collaborators of Thomas E. Sarvey based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Thomas E. Sarvey. Thomas E. Sarvey is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Sarvey, Thomas E., et al.. (2021). Monolithic Microfluidic Cooling of a Heterogeneous 2.5-D FPGA With Low-Profile 3-D Printed Manifolds. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(6). 974–982. 12 indexed citations
3.
Li, Yongsheng, Huan Yu, Hang Jin, et al.. (2019). Dynamic Thermal Management for 3-D ICs With Time-Dependent Power Map Using Microchannel Cooling and Machine Learning. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(7). 1244–1252. 13 indexed citations
4.
Sarvey, Thomas E., et al.. (2019). Microfluidic Cooling of a 14-nm 2.5-D FPGA With 3-D Printed Manifolds for High-Density Computing: Design Considerations, Fabrication, and Electrical Characterization. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(12). 2393–2403. 13 indexed citations
5.
Kottke, Peter A., Xuchen Zhang, Thomas E. Sarvey, et al.. (2017). Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps. International Journal of Heat and Mass Transfer. 108. 1702–1713. 26 indexed citations
6.
Sarvey, Thomas E., Yuanchen Hu, Peter A. Kottke, et al.. (2017). Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(9). 1465–1475. 41 indexed citations
7.
Sarvey, Thomas E., et al.. (2017). Thermal Evaluation of 2.5-D Integration Using Bridge-Chip Technology: Challenges and Opportunities. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(7). 1101–1110. 20 indexed citations
8.
Hu, Yuanchen, Thomas E. Sarvey, Muhannad S. Bakir, & Yogendra Joshi. (2017). Single phase liquid cooling of hotspots in a heterogeneous pin-fin-enhanced microgap with non-uniform fin array. 500–504. 11 indexed citations
9.
10.
Zhang, Xuchen, Xuefei Han, Thomas E. Sarvey, et al.. (2016). Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications. Journal of Electronic Packaging. 138(1). 21 indexed citations
11.
Sarvey, Thomas E., et al.. (2016). The impact of 3D stacking on GPU-accelerated deep neural networks: An experimental study. 1–4. 1 indexed citations
12.
13.
Kottke, Peter A., Thomas E. Sarvey, Yogendra Joshi, et al.. (2016). Combined finned microgap with dedicated extreme-microgap hotspot flow for high performance thermal management. 1388–1392. 11 indexed citations
14.
Sarvey, Thomas E., et al.. (2015). Embedded cooling technologies for densely integrated electronic systems. 1–8. 27 indexed citations
15.
Sarvey, Thomas E., et al.. (2015). Reliability study of micro-pin fin array for on-chip cooling. 2283–2287. 10 indexed citations
16.
17.
Han, Xuefei, Thomas E. Sarvey, Xuchen Zhang, et al.. (2015). A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration. Journal of Electronic Packaging. 137(4). 52 indexed citations
18.
Zhang, Yue, et al.. (2015). Thermal Isolation Using Air Gap and Mechanically Flexible Interconnects for Heterogeneous 3-D ICs. IEEE Transactions on Components Packaging and Manufacturing Technology. 6(1). 31–39. 10 indexed citations
19.
Sarvey, Thomas E., et al.. (2014). Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation. 1–5. 8 indexed citations
20.
Sarvey, Thomas E., et al.. (2014). Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems. 205–212. 21 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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