Ja‐Myeong Koo
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Materials Chemistry
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Co-authors
- Seung‐Boo JungJeong‐Won YoonDae‐Gon KimHyun-Suk ChunBo‐In NohJong‐Woong KimSang-Won KimByunghoon Lee
- Topics
- Electronic Packaging and Soldering Technologies (29 papers)3D IC and TSV technologies (27 papers)Advanced Welding Techniques Analysis (15 papers)
- Partner nations
- South KoreaSingaporeChina
In The Last Decade
Ja‐Myeong Koo
36 papers receiving 588 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 514
- Mechanical Engineering 329
- Materials Chemistry 87
- Biomedical Engineering 67
- Electronic, Optical and Magnetic Materials 49
Countries citing papers authored by Ja‐Myeong Koo
This map shows the geographic impact of Ja‐Myeong Koo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ja‐Myeong Koo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ja‐Myeong Koo more than expected).
Fields of papers citing papers by Ja‐Myeong Koo
This network shows the impact of papers produced by Ja‐Myeong Koo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ja‐Myeong Koo. The network helps show where Ja‐Myeong Koo may publish in the future.
Co-authorship network of co-authors of Ja‐Myeong Koo
This figure shows the co-authorship network connecting the top 25 collaborators of Ja‐Myeong Koo. A scholar is included among the top collaborators of Ja‐Myeong Koo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ja‐Myeong Koo. Ja‐Myeong Koo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 5 | |
| 2 | 30 | |
| 3 | 5 | |
| 4 | Electrical Characteristics of Copper Circuit using Inkjet Printing | 3 |
| 5 | 1 | |
| 6 | 0 | |
| 7 | 4 | |
| 8 | 7 | |
| 9 | Effect of Reflow Number on Mechanical and Electrical Properties of Ball Grid Array (BGA) Solder Joints | 2 |
| 10 | 10 | |
| 11 | 31 | |
| 12 | 16 | |
| 13 | 9 | |
| 14 | 39 | |
| 15 | 25 | |
| 16 | 19 | |
| 17 | 33 | |
| 18 | 33 | |
| 19 | 5 | |
| 20 | 22 |
About Ja‐Myeong Koo
Ja‐Myeong Koo is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering, having authored 37 papers that have together received 612 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (27 papers) and Advanced Welding Techniques Analysis (15 papers). The work is most often cited by research in General Materials Science (29 citations), Electrical and Electronic Engineering (514 citations) and Mechanical Engineering (329 citations). Ja‐Myeong Koo has collaborated with scholars based in South Korea, Singapore and China. Frequent co-authors include Seung‐Boo Jung, Jeong‐Won Yoon, Dae‐Gon Kim, Hyun-Suk Chun, Bo‐In Noh, Jong‐Woong Kim, Sang-Won Kim, Byunghoon Lee, Hoo-Jeong Lee and Joo Hwan Shin. Their work appears in journals such as Advanced Materials, Materials Science and Engineering A and Journal of Materials Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.