Ja‐Myeong Koo

721 total citations
37 papers, 612 citations indexed

About

Ja‐Myeong Koo is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Ja‐Myeong Koo has authored 37 papers receiving a total of 612 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 19 papers in Mechanical Engineering and 5 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Ja‐Myeong Koo's work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (27 papers) and Advanced Welding Techniques Analysis (15 papers). Ja‐Myeong Koo is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (27 papers) and Advanced Welding Techniques Analysis (15 papers). Ja‐Myeong Koo collaborates with scholars based in South Korea, Singapore and China. Ja‐Myeong Koo's co-authors include Seung‐Boo Jung, Jeong‐Won Yoon, Dae‐Gon Kim, Hyun-Suk Chun, Bo‐In Noh, Jong‐Woong Kim, Sang-Won Kim, Byunghoon Lee, Hoo-Jeong Lee and Joo Hwan Shin and has published in prestigious journals such as Advanced Materials, Materials Science and Engineering A and Journal of Materials Science.

In The Last Decade

Ja‐Myeong Koo

36 papers receiving 588 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ja‐Myeong Koo South Korea 16 514 329 87 67 49 37 612
Yoonchul Sohn South Korea 10 420 0.8× 312 0.9× 116 1.3× 97 1.4× 48 1.0× 38 579
Sehoon Yoo South Korea 13 475 0.9× 290 0.9× 86 1.0× 59 0.9× 52 1.1× 88 605
Barbara Horváth Hungary 14 355 0.7× 191 0.6× 82 0.9× 57 0.9× 57 1.2× 31 445
Rong An China 16 506 1.0× 364 1.1× 138 1.6× 54 0.8× 76 1.6× 55 654
K.-J. Wolter Germany 11 419 0.8× 193 0.6× 54 0.6× 71 1.1× 26 0.5× 74 506
Yong-Ho Ko South Korea 14 612 1.2× 423 1.3× 69 0.8× 82 1.2× 45 0.9× 54 689
Keisuke Uenishi Japan 14 281 0.5× 459 1.4× 165 1.9× 56 0.8× 34 0.7× 58 629
Choong-Jae Lee South Korea 13 393 0.8× 282 0.9× 42 0.5× 49 0.7× 33 0.7× 49 469
Changyoul Moon South Korea 9 275 0.5× 114 0.3× 112 1.3× 154 2.3× 36 0.7× 16 433

Countries citing papers authored by Ja‐Myeong Koo

Since Specialization
Citations

This map shows the geographic impact of Ja‐Myeong Koo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ja‐Myeong Koo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ja‐Myeong Koo more than expected).

Fields of papers citing papers by Ja‐Myeong Koo

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ja‐Myeong Koo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ja‐Myeong Koo. The network helps show where Ja‐Myeong Koo may publish in the future.

Co-authorship network of co-authors of Ja‐Myeong Koo

This figure shows the co-authorship network connecting the top 25 collaborators of Ja‐Myeong Koo. A scholar is included among the top collaborators of Ja‐Myeong Koo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ja‐Myeong Koo. Ja‐Myeong Koo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lee, Ju Seung, Seung‐Ji Kang, Joo Hwan Shin, et al.. (2020). Nanoscale Dewetting: Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing (Adv. Mater. 21/2020). Advanced Materials. 32(21). 5 indexed citations
2.
Jung, Kwang‐Ho, Kyung Deuk Min, Choong-Jae Lee, et al.. (2019). Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages. Applied Surface Science. 495. 143487–143487. 30 indexed citations
3.
Kim, Jaewon, Byunghoon Lee, Ja‐Myeong Koo, & Chee Lip Gan. (2017). Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection. 1–4. 5 indexed citations
4.
Kim, Kwang‐Seok, Ja‐Myeong Koo, Jaewoo Joung, Byung‐Sung Kim, & Seung‐Boo Jung. (2010). Electrical Characteristics of Copper Circuit using Inkjet Printing. Journal of the Microelectronics and Packaging Society. 17(3). 43–49. 3 indexed citations
5.
Koo, Ja‐Myeong, et al.. (2009). Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF). The Journal of Adhesion. 85(6). 341–350. 1 indexed citations
6.
Koo, Ja‐Myeong, et al.. (2009). Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film. Japanese Journal of Applied Physics. 48(7). 07GA08–07GA08.
7.
Koo, Ja‐Myeong, et al.. (2008). Ultrasonic Bonding Technology for Flip Chip Packaging. Journal of Welding and Joining. 26(1). 31–36. 4 indexed citations
8.
Koo, Ja‐Myeong, et al.. (2008). Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate. Japanese Journal of Applied Physics. 47(5S). 4309–4309. 7 indexed citations
9.
Koo, Ja‐Myeong, Chang‐Yong Lee, & Seung‐Boo Jung. (2007). Effect of Reflow Number on Mechanical and Electrical Properties of Ball Grid Array (BGA) Solder Joints. Journal of the Microelectronics and Packaging Society. 14(4). 71–77. 2 indexed citations
10.
Kim, Jong‐Woong, Dae‐Gon Kim, Ja‐Myeong Koo, et al.. (2007). Characterization of Failure Behaviors in Anisotropic Conductive Interconnection. MATERIALS TRANSACTIONS. 48(5). 1070–1078. 10 indexed citations
11.
Kim, Dae‐Gon, et al.. (2007). Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints. Journal of Alloys and Compounds. 458(1-2). 253–260. 31 indexed citations
12.
Koo, Ja‐Myeong, et al.. (2007). Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows. Journal of Electronic Materials. 37(1). 118–124. 16 indexed citations
13.
Kim, Jong‐Woong, Ja‐Myeong Koo, Chang‐Yong Lee, et al.. (2007). Thermal degradation of anisotropic conductive film joints under temperature fluctuation. International Journal of Adhesion and Adhesives. 28(6). 314–320. 9 indexed citations
14.
Yoon, Jeong‐Won, Hyun-Suk Chun, Ja‐Myeong Koo, Hoo-Jeong Lee, & Seung‐Boo Jung. (2007). Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions. Scripta Materialia. 56(8). 661–664. 39 indexed citations
15.
Yoon, Jeong‐Won, Ja‐Myeong Koo, Jong‐Woong Kim, et al.. (2007). Effect of boron content in electroless Ni–B layer on plating layer properties and soldering characteristics with Sn–Ag solder. Journal of Alloys and Compounds. 466(1-2). 73–79. 25 indexed citations
16.
Koo, Ja‐Myeong & Seung‐Boo Jung. (2007). Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package. Microsystem Technologies. 13(11-12). 1567–1573. 19 indexed citations
17.
Koo, Ja‐Myeong & Seung‐Boo Jung. (2006). Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging. Microelectronics Reliability. 47(12). 2169–2178. 33 indexed citations
18.
Yoon, Jeong‐Won, Hyun-Suk Chun, Ja‐Myeong Koo, & Seung‐Boo Jung. (2006). Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications. Microsystem Technologies. 13(11-12). 1463–1469. 33 indexed citations
19.
Koo, Ja‐Myeong, et al.. (2005). Induction Brazing of γ-TiAl to Alloy Steel AISI 4140 Using Filler Metal of Eutectic Ag-Cu Alloy Coated with Ti Film. MATERIALS TRANSACTIONS. 46(2). 303–308. 5 indexed citations
20.
Koo, Ja‐Myeong & Seung‐Boo Jung. (2005). Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow process. Journal of Electronic Materials. 34(12). 1565–1572. 22 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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