Chang-Chae Shur

569 total citations
13 papers, 501 citations indexed

About

Chang-Chae Shur is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Chang-Chae Shur has authored 13 papers receiving a total of 501 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 3 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Chang-Chae Shur's work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (6 papers). Chang-Chae Shur is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (6 papers). Chang-Chae Shur collaborates with scholars based in South Korea and Japan. Chang-Chae Shur's co-authors include Seung‐Boo Jung, Chang‐Bae Lee, Jeong‐Won Yoon, Young-Eui Shin, Bo‐In Noh, Jonghyun Park, Seung Zeon Han, In‐Young Lee, Dae-Up Kim and Cheol‐Woong Yang and has published in prestigious journals such as Journal of Materials Science, Journal of Alloys and Compounds and Microelectronic Engineering.

In The Last Decade

Chang-Chae Shur

13 papers receiving 484 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chang-Chae Shur South Korea 9 395 357 92 73 39 13 501
N. Kurokawa Japan 9 425 1.1× 455 1.3× 148 1.6× 63 0.9× 89 2.3× 10 560
Dong Nyung Lee South Korea 9 153 0.4× 315 0.9× 72 0.8× 169 2.3× 47 1.2× 10 419
Polina Snugovsky Canada 12 344 0.9× 212 0.6× 88 1.0× 33 0.5× 8 0.2× 30 372
Masanori Kajihara Japan 13 217 0.5× 533 1.5× 172 1.9× 166 2.3× 23 0.6× 43 597
Motoi Hara Japan 10 59 0.1× 247 0.7× 183 2.0× 138 1.9× 38 1.0× 78 363
Mohammad Hossein Tavakoli Iran 13 74 0.2× 232 0.6× 52 0.6× 233 3.2× 24 0.6× 39 361
J.E. May Brazil 12 73 0.2× 356 1.0× 58 0.6× 217 3.0× 51 1.3× 28 445
George C. Rybicki United States 7 95 0.2× 223 0.6× 347 3.8× 271 3.7× 27 0.7× 15 479
Jarosław Dąbek Poland 11 104 0.3× 136 0.4× 151 1.6× 222 3.0× 9 0.2× 35 335
Z. Żurek Poland 10 55 0.1× 197 0.6× 127 1.4× 179 2.5× 8 0.2× 82 354

Countries citing papers authored by Chang-Chae Shur

Since Specialization
Citations

This map shows the geographic impact of Chang-Chae Shur's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chang-Chae Shur with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chang-Chae Shur more than expected).

Fields of papers citing papers by Chang-Chae Shur

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chang-Chae Shur. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chang-Chae Shur. The network helps show where Chang-Chae Shur may publish in the future.

Co-authorship network of co-authors of Chang-Chae Shur

This figure shows the co-authorship network connecting the top 25 collaborators of Chang-Chae Shur. A scholar is included among the top collaborators of Chang-Chae Shur based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chang-Chae Shur. Chang-Chae Shur is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

13 of 13 papers shown
1.
Yoon, Jeong‐Won, et al.. (2009). Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints. Journal of Alloys and Compounds. 486(1-2). 142–147. 124 indexed citations
2.
Yoon, Jeong‐Won, Jonghyun Park, Chang-Chae Shur, & Seung‐Boo Jung. (2007). Characteristic evaluation of electroless nickel–phosphorus deposits with different phosphorus contents. Microelectronic Engineering. 84(11). 2552–2557. 60 indexed citations
3.
Yoon, Jeong‐Won, Ja‐Myeong Koo, Jong‐Woong Kim, et al.. (2007). Effect of boron content in electroless Ni–B layer on plating layer properties and soldering characteristics with Sn–Ag solder. Journal of Alloys and Compounds. 466(1-2). 73–79. 25 indexed citations
4.
Shur, Chang-Chae, et al.. (2007). Effect of Cr on the corrosion resistance of Cu–6Ni–4Sn alloys. Journal of Alloys and Compounds. 455(1-2). 358–363. 45 indexed citations
5.
Koo, Junmo, et al.. (2005). Standardization of the Important Test Parameters in the Solder Ball Shear Test for Evaluation of the Mechanical Joint Strength. 5(1). 15–28. 1 indexed citations
6.
Lee, Wonbae, Sang-Won Kim, Chang‐Young Lee, et al.. (2004). Effects of Welding Parameters on the Friction Stir Weldability of 5052 AI alloy. 22(3). 69–76. 1 indexed citations
7.
Lee, Chang‐Bae, Jeong‐Won Yoon, Su‐Jeong Suh, et al.. (2003). Intermetallic compound layer formation between Sn–3.5 mass %Ag BGA solder ball and (Cu, immersion Au/electroless Ni–P/Cu) substrate. Journal of Materials Science Materials in Electronics. 14(8). 487–493. 41 indexed citations
8.
Jung, Seung‐Boo, et al.. (2003). Mechanical properties of copper to titanium joined by friction welding. Journal of Materials Science. 38(6). 1281–1287. 29 indexed citations
9.
Lee, Wonbae, et al.. (2003). Joinability of Tool Steels by TLP Bonding. 21(4). 69–74. 2 indexed citations
10.
Lee, Chang‐Bae, Seung‐Boo Jung, Young-Eui Shin, & Chang-Chae Shur. (2002). Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder. MATERIALS TRANSACTIONS. 43(8). 1858–1863. 77 indexed citations
11.
Lee, Chang‐Bae, In‐Young Lee, Seung‐Boo Jung, & Chang-Chae Shur. (2002). Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn-3.5 mass%Ag Solder. MATERIALS TRANSACTIONS. 43(4). 751–756. 36 indexed citations
12.
Lee, Chang‐Bae, Seung‐Boo Jung, Young-Eui Shin, & Chang-Chae Shur. (2001). The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders. MATERIALS TRANSACTIONS. 42(5). 751–755. 58 indexed citations
13.
Yoon, Dae Ho, Chang-Chae Shur, & T. Fukuda. (1998). Phase Matched Wavelength Dependent on Atomic Displacement in Potassium Lithium Niobate Crystals Grown by Micro Pulling Down Method. Crystal Research and Technology. 33(1). 59–64. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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