Sang-Won Kim
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 5%
- Aerospace Engineering
- General Materials Science top 5%
- Mechanics of Materials
- Co-authors
- Jeong‐Won YoonSeung‐Boo JungDae‐Gon KimJa‐Myeong KooYoun-Jea KimJong-Moon ChoiKee-Won KwonMinseo Park
- Topics
- Electronic Packaging and Soldering Technologies (7 papers)3D IC and TSV technologies (6 papers)Advanced Welding Techniques Analysis (6 papers)
- Partner nations
- South Korea
In The Last Decade
Sang-Won Kim
10 papers receiving 486 citations
Peers
Comparison fields: 5 of 13
- Electrical and Electronic Engineering 510
- Mechanical Engineering 430
- Aerospace Engineering 44
- General Materials Science 32
- Mechanics of Materials 18
Countries citing papers authored by Sang-Won Kim
This map shows the geographic impact of Sang-Won Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sang-Won Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sang-Won Kim more than expected).
Fields of papers citing papers by Sang-Won Kim
This network shows the impact of papers produced by Sang-Won Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sang-Won Kim. The network helps show where Sang-Won Kim may publish in the future.
Co-authorship network of co-authors of Sang-Won Kim
This figure shows the co-authorship network connecting the top 25 collaborators of Sang-Won Kim. A scholar is included among the top collaborators of Sang-Won Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sang-Won Kim. Sang-Won Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 3 | |
| 3 | 2 | |
| 4 | 1 | |
| 5 | 29 | |
| 6 | 67 | |
| 7 | 96 | |
| 8 | 111 | |
| 9 | 73 | |
| 10 | 61 | |
| 11 | 74 |
About Sang-Won Kim
Sang-Won Kim is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Control and Systems Engineering, having authored 11 papers that have together received 517 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (6 papers). The work is most often cited by research in Mechanical Engineering (430 citations), General Materials Science (32 citations) and Electrical and Electronic Engineering (510 citations). Sang-Won Kim has collaborated with scholars based in South Korea. Frequent co-authors include Jeong‐Won Yoon, Seung‐Boo Jung, Dae‐Gon Kim, Ja‐Myeong Koo, Youn-Jea Kim, Jong-Moon Choi, Kee-Won Kwon, Minseo Park, Joonho Gil and Eun‐Seong Kim. Their work appears in journals such as Journal of Alloys and Compounds, Journal of Electronic Materials and Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.