Sehoon Yoo

763 total citations
88 papers, 605 citations indexed

About

Sehoon Yoo is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Sehoon Yoo has authored 88 papers receiving a total of 605 indexed citations (citations by other indexed papers that have themselves been cited), including 73 papers in Electrical and Electronic Engineering, 37 papers in Mechanical Engineering and 10 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Sehoon Yoo's work include Electronic Packaging and Soldering Technologies (64 papers), 3D IC and TSV technologies (56 papers) and Advanced Welding Techniques Analysis (23 papers). Sehoon Yoo is often cited by papers focused on Electronic Packaging and Soldering Technologies (64 papers), 3D IC and TSV technologies (56 papers) and Advanced Welding Techniques Analysis (23 papers). Sehoon Yoo collaborates with scholars based in South Korea, United States and Japan. Sehoon Yoo's co-authors include Chang‐Woo Lee, Yong-Ho Ko, Junki Kim, Young-Bae Park, Young‐Ho Kim, Junghwan Bang, Jeong‐Won Yoon, Yutaka S. Sato, H. Fujii and Youngkwan Lee and has published in prestigious journals such as Carbon, RSC Advances and Journal of Alloys and Compounds.

In The Last Decade

Sehoon Yoo

83 papers receiving 576 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Sehoon Yoo South Korea 13 475 290 86 59 57 88 605
Ja‐Myeong Koo South Korea 16 514 1.1× 329 1.1× 87 1.0× 67 1.1× 47 0.8× 37 612
Barbara Horváth Hungary 14 355 0.7× 191 0.7× 82 1.0× 57 1.0× 38 0.7× 31 445
Yong-Ho Ko South Korea 14 612 1.3× 423 1.5× 69 0.8× 82 1.4× 27 0.5× 54 689
Yoonchul Sohn South Korea 10 420 0.9× 312 1.1× 116 1.3× 97 1.6× 34 0.6× 38 579
Choong-Jae Lee South Korea 13 393 0.8× 282 1.0× 42 0.5× 49 0.8× 38 0.7× 49 469
Ruyu Tian China 14 374 0.8× 374 1.3× 73 0.8× 55 0.9× 63 1.1× 30 563
Chunjin Hang China 17 708 1.5× 444 1.5× 138 1.6× 135 2.3× 45 0.8× 53 838
Jiang Ding China 12 239 0.5× 156 0.5× 111 1.3× 60 1.0× 41 0.7× 51 504
K.-J. Wolter Germany 11 419 0.9× 193 0.7× 54 0.6× 71 1.2× 73 1.3× 74 506

Countries citing papers authored by Sehoon Yoo

Since Specialization
Citations

This map shows the geographic impact of Sehoon Yoo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sehoon Yoo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sehoon Yoo more than expected).

Fields of papers citing papers by Sehoon Yoo

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Sehoon Yoo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sehoon Yoo. The network helps show where Sehoon Yoo may publish in the future.

Co-authorship network of co-authors of Sehoon Yoo

This figure shows the co-authorship network connecting the top 25 collaborators of Sehoon Yoo. A scholar is included among the top collaborators of Sehoon Yoo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sehoon Yoo. Sehoon Yoo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Lee, Tae Young, et al.. (2022). Enhancement of dielectric performance of encapsulation in barium titanate oxide using size-controlled reduced graphene oxide. RSC Advances. 12(26). 16412–16418. 8 indexed citations
4.
Lee, Jung Min, Tae Young Lee, Jong Hoon Jung, et al.. (2022). Reduction time effect on the dielectric characteristics of reduced-graphene-oxide--encapsulated barium titanate powder fillers. Carbon. 199. 23–32. 10 indexed citations
5.
Lee, Tae Young, Minsu Kang, Sehoon Yoo, Young‐Ho Kim, & Minsu Kim. (2020). Effect of (Ni, Au) 3 Sn 4 growth on the thermal resistance of Au-20 wt% Sn solder/ENIG joint in flip-chip LED packages. Japanese Journal of Applied Physics. 59(SL). SLLE03–SLLE03. 1 indexed citations
6.
Yoo, Sehoon, et al.. (2018). Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints. Journal of Welding and Joining. 36(5). 52–60. 5 indexed citations
7.
Kwon, Soon-Yong, et al.. (2018). Effects of Flux Activator on Wettability and Slump of Sn-Ag-Cu Solder Paste. Journal of the Microelectronics and Packaging Society. 25(4). 123–128. 1 indexed citations
8.
Yoo, Sehoon, et al.. (2017). Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint. Journal of Welding and Joining. 35(6). 51–58. 7 indexed citations
9.
Cho, Seung Yull, D. Lee, İmran Ali, et al.. (2017). Highly reliable automotive integrated protection circuit for human body model ESD of +6 kV, over voltage, and reverse voltage. Electronics Letters. 53(13). 843–845. 4 indexed citations
10.
Lee, Youngkwan, Yong-Ho Ko, Junki Kim, Chang‐Woo Lee, & Sehoon Yoo. (2013). The effect of intermetallic compound evolution on the fracture behavior of Au stud bumps joined with Sn-3.5Ag solder. Electronic Materials Letters. 9(1). 31–39. 21 indexed citations
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Bae, Sung Min, et al.. (2011). Development of Knowledge Sharing Platform for Digitization of Surface Mount Technology. Journal of the Microelectronics and Packaging Society. 18(1). 1–5. 2 indexed citations
13.
Kim, Jeonghan, et al.. (2011). Evaluation of Solder Printing Efficiency with the Variation of Stencil Aperture Size. Journal of the Microelectronics and Packaging Society. 18(4). 71–77. 1 indexed citations
14.
Yoo, Sehoon, et al.. (2010). Temperature Measurement and Contact Resistance of Au Stud Bump Bonding and Ag Paste Bonding with Thermal Heater Device. Journal of the Microelectronics and Packaging Society. 17(2). 55–61. 2 indexed citations
15.
Yoo, Sehoon, et al.. (2010). Variation of Thermal Resistance of LED Module Embedded by Thermal Via. Journal of the Microelectronics and Packaging Society. 17(4). 95–100. 4 indexed citations
16.
Ko, Yong-Ho, Sehoon Yoo, & Chang‐Woo Lee. (2010). Evaluation on Reliability of High Temperature Lead-free Solder for Automotive Electronics. Journal of the Microelectronics and Packaging Society. 17(4). 35–40. 9 indexed citations
17.
Yoo, Sehoon, et al.. (2010). Effect of PCB Surface Finishs on Intermetallic Compound Growth Kinetics of Sn-3.0Ag-0.5Cu Solder Bump. Journal of the Microelectronics and Packaging Society. 17(1). 81–88. 2 indexed citations
18.
Yoo, Sehoon, et al.. (2009). Mechanical and microstructural properties of SiC-mixed Sn-Bi composite solder bumps by electroplating. European Microelectronics and Packaging Conference. 1–4. 3 indexed citations
19.
Yoo, Sehoon, et al.. (2009). Study on the Reliability of COB Flip Chip Package using NCP. Journal of the Microelectronics and Packaging Society. 16(3). 25–29.
20.
Yoo, Sehoon, et al.. (2009). Technologies of TSV Filling and Solder Bumping for 3D Packaging. Journal of the Korean Society for Precision Engineering. 26(12). 18–22. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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