Sehoon Yoo
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Mechanical Engineering top 10%
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
Papers in
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- Electronic Packaging and Soldering Technologies 65
- 3D IC and TSV technologies 57
- Electrodeposition and Electroless Coatings 8
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- Advanced Welding Techniques Analysis 23
- Co-authors
- Chang‐Woo Lee (26 shared papers)Yong-Ho Ko (12 shared papers)Young-Bae Park (11 shared papers)Young‐Ho Kim (9 shared papers)Junghwan Bang (5 shared papers)Jeong‐Won Yoon (5 shared papers)Yutaka S. Sato (3 shared papers)Soon-Yong Kwon (3 shared papers)
- Journals
- Journal of Materials Science Materials in Electronics (7 papers)Journal of Electronic Materials (5 papers)Journal of Alloys and Compounds (4 papers)Microelectronic Engineering (3 papers)Japanese Journal of Applied Physics (3 papers)
- Partner nations
- South KoreaUnited StatesJapan
In The Last Decade
Sehoon Yoo
86 papers receiving 597 citations
Peers
Comparison fields: 5 of 46
- Electrical and Electronic Engineering 483
- Mechanical Engineering 293
- General Materials Science 20
- Automotive Engineering 37
- Electronic, Optical and Magnetic Materials 53
Countries citing papers authored by Sehoon Yoo
This map shows the geographic impact of Sehoon Yoo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sehoon Yoo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sehoon Yoo more than expected).
Fields of papers citing papers by Sehoon Yoo
This network shows the impact of papers produced by Sehoon Yoo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sehoon Yoo. The network helps show where Sehoon Yoo may publish in the future.
Co-authors
The 25 scholars most cited alongside Sehoon Yoo, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 90 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 39 | |
| 2 | 2011 | 34 | |
| 3 | 2011 | 29 | |
| 4 | 2011 | 24 | |
| 5 | 2013 | 21 | |
| 6 | 2020 | 20 | |
| 7 | 2014 | 18 | |
| 8 | 2017 | 17 | |
| 9 | 2012 | 16 | |
| 10 | 2014 | 15 | |
| 11 | 2014 | 15 | |
| 12 | 2013 | 14 | |
| 13 | 2010 | 14 | |
| 14 | 2008 | 12 | |
| 15 | 2010 | 12 | |
| 16 | 2016 | 11 | |
| 17 | 2019 | 11 | |
| 18 | 2011 | 11 | |
| 19 | 2022 | 10 | |
| 20 | 2018 | 10 |
About Sehoon Yoo
Sehoon Yoo is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Automotive Engineering and Materials Chemistry, having authored 90 papers that have together received 623 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (65 papers), 3D IC and TSV technologies (57 papers), Advanced Welding Techniques Analysis (23 papers), Additive Manufacturing and 3D Printing Technologies (9 papers), Electrodeposition and Electroless Coatings (8 papers), Copper Interconnects and Reliability (7 papers), Synthesis and properties of polymers (5 papers) and Engineering Applied Research (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (483 citations), Mechanical Engineering (293 citations), General Materials Science (20 citations), Automotive Engineering (37 citations) and Electronic, Optical and Magnetic Materials (53 citations). Sehoon Yoo has collaborated with scholars based in South Korea, United States and Japan. Frequent co-authors include Chang‐Woo Lee, Yong-Ho Ko, Young-Bae Park, Young‐Ho Kim, Junghwan Bang, Jeong‐Won Yoon, Yutaka S. Sato, Soon-Yong Kwon, Youngkwan Lee and Heung Soo Kim. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Journal of Electronic Materials, Journal of Alloys and Compounds, Microelectronic Engineering and Japanese Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.