Byunghoon Lee
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering
- Biomedical Engineering
- Materials Chemistry
- Electronic, Optical and Magnetic Materials
- Co-authors
- Kee-Won KwonHoo-Jeong LeeJa‐Myeong KooHaseok JeonMaenghyo ChoSungwoo ParkJongseo ParkJaewon Kim
- Topics
- Electronic Packaging and Soldering Technologies (15 papers)3D IC and TSV technologies (12 papers)Advancements in Photolithography Techniques (10 papers)
- Partner nations
- South KoreaUnited StatesSingapore
In The Last Decade
Byunghoon Lee
51 papers receiving 490 citations
Peers
Comparison fields: 5 of 71
- Electrical and Electronic Engineering 354
- Mechanical Engineering 134
- Biomedical Engineering 116
- Materials Chemistry 86
- Electronic, Optical and Magnetic Materials 59
Countries citing papers authored by Byunghoon Lee
This map shows the geographic impact of Byunghoon Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Byunghoon Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Byunghoon Lee more than expected).
Fields of papers citing papers by Byunghoon Lee
This network shows the impact of papers produced by Byunghoon Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Byunghoon Lee. The network helps show where Byunghoon Lee may publish in the future.
Co-authorship network of co-authors of Byunghoon Lee
This figure shows the co-authorship network connecting the top 25 collaborators of Byunghoon Lee. A scholar is included among the top collaborators of Byunghoon Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Byunghoon Lee. Byunghoon Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 10 | |
| 3 | 0 | |
| 4 | 0 | |
| 5 | 2 | |
| 6 | 2 | |
| 7 | 12 | |
| 8 | 4 | |
| 9 | 2 | |
| 10 | 7 | |
| 11 | 3 | |
| 12 | 4 | |
| 13 | 12 | |
| 14 | 0 | |
| 15 | 15 | |
| 16 | 14 | |
| 17 | 8 | |
| 18 | 1 | |
| 19 | 7 | |
| 20 | 7 |
About Byunghoon Lee
Byunghoon Lee is a scholar working on Surfaces, Coatings and Films, Hardware and Architecture and Electrical and Electronic Engineering, having authored 58 papers that have together received 515 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (12 papers) and Advancements in Photolithography Techniques (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (354 citations), Surfaces, Coatings and Films (39 citations) and Mechanical Engineering (134 citations). Byunghoon Lee has collaborated with scholars based in South Korea, United States and Singapore. Frequent co-authors include Kee-Won Kwon, Hoo-Jeong Lee, Ja‐Myeong Koo, Haseok Jeon, Maenghyo Cho, Sungwoo Park, Jongseo Park, Jaewon Kim, Chee Lip Gan and Joo Hwan Shin. Their work appears in journals such as Advanced Materials, ACS Nano and Biochemistry.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.