Byunghoon Lee
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- Electronic Packaging and Soldering Technologies 15
- 3D IC and TSV technologies 12
- Advancements in Photolithography Techniques 10
- Nanomaterials and Printing Technologies 7
- Integrated Circuits and Semiconductor Failure Analysis 7
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- Electron and X-Ray Spectroscopy Techniques 6
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- Advanced Welding Techniques Analysis 5
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- Nanofabrication and Lithography Techniques 6
- Co-authors
- Kee-Won KwonHoo-Jeong LeeJa‐Myeong KooHaseok JeonMaenghyo ChoSungwoo ParkJongseo ParkJaewon Kim
- Partner nations
- South KoreaUnited StatesSingapore
In The Last Decade
Byunghoon Lee
51 papers receiving 490 citations
Peers
Comparison fields: 5 of 71
- Electrical and Electronic Engineering 354
- Surfaces, Coatings and Films 39
- Mechanical Engineering 134
- Electronic, Optical and Magnetic Materials 59
- Automotive Engineering 38
Countries citing papers authored by Byunghoon Lee
This map shows the geographic impact of Byunghoon Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Byunghoon Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Byunghoon Lee more than expected).
Fields of papers citing papers by Byunghoon Lee
This network shows the impact of papers produced by Byunghoon Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Byunghoon Lee. The network helps show where Byunghoon Lee may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Byunghoon Lee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2024 | 10 | |
| 3 | 2024 | 0 | |
| 4 | 2024 | 0 | |
| 5 | 2022 | 2 | |
| 6 | 2021 | 2 | |
| 7 | 2020 | 12 | |
| 8 | 2020 | 4 | |
| 9 | 2018 | 2 | |
| 10 | 2017 | 7 | |
| 11 | 2015 | 3 | |
| 12 | 2014 | 4 | |
| 13 | 2013 | 12 | |
| 14 | 2013 | 0 | |
| 15 | 2011 | 15 | |
| 16 | 2010 | 14 | |
| 17 | 2010 | 8 | |
| 18 | 2007 | 1 | |
| 19 | 2007 | 7 | |
| 20 | 1995 | 7 |
About Byunghoon Lee
Byunghoon Lee is a scholar working on Surfaces, Coatings and Films, Hardware and Architecture and Electrical and Electronic Engineering, having authored 58 papers that have together received 515 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (12 papers), Advancements in Photolithography Techniques (10 papers), Nanomaterials and Printing Technologies (7 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers), Nanofabrication and Lithography Techniques (6 papers), Electron and X-Ray Spectroscopy Techniques (6 papers) and Advanced Welding Techniques Analysis (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (354 citations), Surfaces, Coatings and Films (39 citations) and Mechanical Engineering (134 citations). Byunghoon Lee has collaborated with scholars based in South Korea, United States and Singapore. Frequent co-authors include Kee-Won Kwon, Hoo-Jeong Lee, Ja‐Myeong Koo, Haseok Jeon, Maenghyo Cho, Sungwoo Park, Jongseo Park, Jaewon Kim, Chee Lip Gan and Joo Hwan Shin. Their work appears in journals such as Advanced Materials, ACS Nano and Biochemistry.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.