Dae‐Gon Kim

1.6k total citations
60 papers, 1.3k citations indexed

About

Dae‐Gon Kim is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Dae‐Gon Kim has authored 60 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 46 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 17 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Dae‐Gon Kim's work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (9 papers). Dae‐Gon Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (9 papers). Dae‐Gon Kim collaborates with scholars based in South Korea, United States and Australia. Dae‐Gon Kim's co-authors include Seung‐Boo Jung, Jong‐Woong Kim, Jong‐Man Kim, Jeong-Ho Kong, Jeong‐Won Yoon, John A. Rogers, Ja‐Myeong Koo, Lyndon Scott Stephens, Jonathan J. Wierer and Yonggang Huang and has published in prestigious journals such as Nature Communications, Small and Optics Letters.

In The Last Decade

Dae‐Gon Kim

54 papers receiving 1.3k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Dae‐Gon Kim South Korea 21 993 527 388 131 131 60 1.3k
Nathan Jackson United States 22 726 0.7× 640 1.2× 817 2.1× 76 0.6× 123 0.9× 107 1.4k
Sarah S. Bedair United States 22 993 1.0× 311 0.6× 1.1k 2.7× 261 2.0× 284 2.2× 90 1.6k
Paul McCloskey Ireland 18 1.1k 1.1× 787 1.5× 340 0.9× 224 1.7× 122 0.9× 75 1.5k
Lufeng Che China 20 753 0.8× 240 0.5× 982 2.5× 292 2.2× 108 0.8× 59 1.7k
Yong Xu United States 19 741 0.7× 357 0.7× 827 2.1× 196 1.5× 222 1.7× 85 1.5k
Francesco Guido Italy 22 444 0.4× 352 0.7× 1.0k 2.6× 70 0.5× 137 1.0× 40 1.3k
Zeynep Çelik‐Butler United States 22 926 0.9× 109 0.2× 449 1.2× 216 1.6× 172 1.3× 104 1.2k
Guanggui Cheng China 24 647 0.7× 549 1.0× 996 2.6× 63 0.5× 364 2.8× 189 1.9k
Ethan W. Schaler United States 8 656 0.7× 134 0.3× 687 1.8× 290 2.2× 154 1.2× 18 1.2k
Mei Yang China 24 897 0.9× 391 0.7× 188 0.5× 41 0.3× 578 4.4× 103 1.9k

Countries citing papers authored by Dae‐Gon Kim

Since Specialization
Citations

This map shows the geographic impact of Dae‐Gon Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dae‐Gon Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dae‐Gon Kim more than expected).

Fields of papers citing papers by Dae‐Gon Kim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dae‐Gon Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dae‐Gon Kim. The network helps show where Dae‐Gon Kim may publish in the future.

Co-authorship network of co-authors of Dae‐Gon Kim

This figure shows the co-authorship network connecting the top 25 collaborators of Dae‐Gon Kim. A scholar is included among the top collaborators of Dae‐Gon Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dae‐Gon Kim. Dae‐Gon Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kim, Dohyeong, Dae‐Gon Kim, Yingying Wang, et al.. (2025). A mid-infrared Brillouin laser using ultra-high-Q on-chip resonators. Nature Communications. 16(1). 2707–2707. 4 indexed citations
2.
Kim, Sangcheol, Jieun Park, Inho Song, et al.. (2022). Health effects of PM2.5 constituents and source contributions in major metropolitan cities, South Korea. Environmental Science and Pollution Research. 29(55). 82873–82887. 26 indexed citations
3.
Kim, Dae‐Gon, Sangyoon Han, Dongin Jeong, et al.. (2020). Universal light-guiding geometry for on-chip resonators having extremely high Q-factor. Nature Communications. 11(1). 5933–5933. 42 indexed citations
4.
Kim, Dae‐Gon, Sangyoon Han, Dongin Jeong, et al.. (2020). Octave-Spanning Supercontinuum Generation in Thermally Deposited As2S3 Waveguide on Wet-etched SiO2 Structure. 1767. C8B_2–C8B_2. 1 indexed citations
5.
Kim, Dae‐Gon, et al.. (2016). Electrically and mechanically enhanced Ag nanowires-colorless polyimide composite electrode for flexible capacitive sensor. Applied Surface Science. 380. 223–228. 28 indexed citations
6.
Hwang, Hyejin, Dae‐Gon Kim, Nam‐Su Jang, Jeong-Ho Kong, & Jong‐Man Kim. (2016). Simple method for high-performance stretchable composite conductors with entrapped air bubbles. Nanoscale Research Letters. 11(1). 14–14. 9 indexed citations
7.
Kong, Jeong-Ho, et al.. (2014). A thin all-elastomeric capacitive pressure sensor array based on micro-contact printed elastic conductors. Journal of Materials Chemistry C. 2(22). 4415–4422. 176 indexed citations
8.
Kim, Tae‐il, Yei Hwan Jung, Jizhou Song, et al.. (2012). High‐Efficiency, Microscale GaN Light‐Emitting Diodes and Their Thermal Properties on Unusual Substrates. Small. 8(11). 1643–1649. 185 indexed citations
9.
Lee, Sanghyun, et al.. (2012). A Characteristics of the Applied SOG Lens for the CPV Module. 61(2). 97–102.
10.
11.
Won, Sang Min, Hoon‐Sik Kim, Nanshu Lu, et al.. (2011). Piezoresistive Strain Sensors and Multiplexed Arrays Using Assemblies of Single-Crystalline Silicon Nanoribbons on Plastic Substrates. IEEE Transactions on Electron Devices. 58(11). 4074–4078. 67 indexed citations
12.
Kim, Jong‐Woong, Dae‐Gon Kim, Ja‐Myeong Koo, et al.. (2007). Characterization of Failure Behaviors in Anisotropic Conductive Interconnection. MATERIALS TRANSACTIONS. 48(5). 1070–1078. 10 indexed citations
13.
Kim, Dae‐Gon, et al.. (2007). Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints. Journal of Alloys and Compounds. 458(1-2). 253–260. 31 indexed citations
14.
Kim, Dae‐Gon, Jong‐Woong Kim, Jeong‐Won Yoon, et al.. (2007). Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method. Microelectronic Engineering. 84(11). 2640–2645. 7 indexed citations
15.
Kim, Dae‐Gon & Seung‐Boo Jung. (2005). Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method. MATERIALS TRANSACTIONS. 46(11). 2366–2371. 8 indexed citations
16.
Kim, Dae‐Gon & Seung‐Boo Jung. (2005). Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn–3.0Ag–0.5Cu Solder and Ni–P under Bump Metallurgy. MATERIALS TRANSACTIONS. 46(6). 1295–1300. 7 indexed citations
17.
Kim, Dae‐Gon, Jong‐Woong Kim, & Seung‐Boo Jung. (2005). Evaluation of solder joint reliability in flip chip package under thermal shock test. Thin Solid Films. 504(1-2). 426–430. 20 indexed citations
18.
Kim, Jong‐Woong, Dae‐Gon Kim, Won Sik Hong, & Seung‐Boo Jung. (2005). Evaluation of solder joint reliability in flip-chip packages during accelerated testing. Journal of Electronic Materials. 34(12). 1550–1557. 31 indexed citations
19.
Kim, Dae‐Gon, et al.. (2003). Reaction Diffusion and Formation of Cu<SUB>11</SUB>In<SUB>9</SUB> and In<SUB>27</SUB>Ni<SUB>10</SUB> Phases in the Couple of Indium-Substrates. MATERIALS TRANSACTIONS. 44(1). 72–77. 25 indexed citations
20.
Kim, Dae‐Gon. (2001). Control of a 3-Phase VR Type Self-Bearing Step Motor. Transactions of the Korean Society of Mechanical Engineers A. 25(12). 1974–1980.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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