Jeong‐Won Yoon
- Electrical and Electronic Engineering top 1%
- Mechanical Engineering top 0.5%
- Electronic, Optical and Magnetic Materials top 10%
- Materials Chemistry
- Aerospace Engineering top 5%
- Co-authors
- Seung‐Boo JungBo‐In NohSang-Won KimHyun-Suk ChunChang‐Bae LeeChang-Chae ShurJa‐Myeong KooDae‐Gon Kim
- Topics
- Electronic Packaging and Soldering Technologies (173 papers)3D IC and TSV technologies (136 papers)Advanced Welding Techniques Analysis (68 papers)
- Journals
- Materials Science and Engineering AJournal of Materials ScienceJournal of Alloys and Compounds
- Partner nations
- South KoreaAustraliaUnited States
In The Last Decade
Jeong‐Won Yoon
170 papers receiving 3.5k citations
Peers
Comparison fields: 5 of 56
- Electrical and Electronic Engineering 3.4k
- Mechanical Engineering 2.5k
- Electronic, Optical and Magnetic Materials 245
- Materials Chemistry 238
- Aerospace Engineering 225
Countries citing papers authored by Jeong‐Won Yoon
This map shows the geographic impact of Jeong‐Won Yoon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jeong‐Won Yoon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jeong‐Won Yoon more than expected).
Fields of papers citing papers by Jeong‐Won Yoon
This network shows the impact of papers produced by Jeong‐Won Yoon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jeong‐Won Yoon. The network helps show where Jeong‐Won Yoon may publish in the future.
Co-authorship network of co-authors of Jeong‐Won Yoon
This figure shows the co-authorship network connecting the top 25 collaborators of Jeong‐Won Yoon. A scholar is included among the top collaborators of Jeong‐Won Yoon based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jeong‐Won Yoon. Jeong‐Won Yoon is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 3 | |
| 3 | 1 | |
| 4 | 2 | |
| 5 | 5 | |
| 6 | 3 | |
| 7 | 9 | |
| 8 | 20 | |
| 9 | 2 | |
| 10 | 5 | |
| 11 | 13 | |
| 12 | 2 | |
| 13 | 6 | |
| 14 | 3 | |
| 15 | 12 | |
| 16 | 1 | |
| 17 | 6 | |
| 18 | 5 | |
| 19 | 7 | |
| 20 | 15 |
About Jeong‐Won Yoon
Jeong‐Won Yoon is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and General Materials Science, having authored 180 papers that have together received 3.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (173 papers), 3D IC and TSV technologies (136 papers) and Advanced Welding Techniques Analysis (68 papers). The work is most often cited by research in General Materials Science (219 citations), Mechanical Engineering (2.5k citations) and Electrical and Electronic Engineering (3.4k citations). Jeong‐Won Yoon has collaborated with scholars based in South Korea, Australia and United States. Frequent co-authors include Seung‐Boo Jung, Bo‐In Noh, Sang-Won Kim, Hyun-Suk Chun, Chang‐Bae Lee, Chang-Chae Shur, Ja‐Myeong Koo, Dae‐Gon Kim, Cheol‐Woong Yang and Hoo-Jeong Lee. Their work appears in journals such as Materials Science and Engineering A, Journal of Materials Science and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.