Jeong‐Won Yoon

4.3k total citations
180 papers, 3.6k citations indexed

About

Jeong‐Won Yoon is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Jeong‐Won Yoon has authored 180 papers receiving a total of 3.6k indexed citations (citations by other indexed papers that have themselves been cited), including 177 papers in Electrical and Electronic Engineering, 123 papers in Mechanical Engineering and 11 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Jeong‐Won Yoon's work include Electronic Packaging and Soldering Technologies (173 papers), 3D IC and TSV technologies (136 papers) and Advanced Welding Techniques Analysis (68 papers). Jeong‐Won Yoon is often cited by papers focused on Electronic Packaging and Soldering Technologies (173 papers), 3D IC and TSV technologies (136 papers) and Advanced Welding Techniques Analysis (68 papers). Jeong‐Won Yoon collaborates with scholars based in South Korea, Australia and United States. Jeong‐Won Yoon's co-authors include Seung‐Boo Jung, Bo‐In Noh, Sang-Won Kim, Hyun-Suk Chun, Chang‐Bae Lee, Chang-Chae Shur, Ja‐Myeong Koo, Dae‐Gon Kim, Cheol‐Woong Yang and Hoo-Jeong Lee and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Journal of Alloys and Compounds.

In The Last Decade

Jeong‐Won Yoon

170 papers receiving 3.5k citations

Peers

Jeong‐Won Yoon

EEE

EOMM

Songbai Xue China

Tung‐Han Chuang Taiwan

A.A. El-Daly Egypt

Yee‐Wen Yen Taiwan

I. Dutta United States

Dhafer Abdulameer Shnawah Malaysia

J. Pstruś Poland

Jingdong Guo China

Jieshi Chen China

Maureen Williams United States

Songbai Xue China

Jeong‐Won Yoon

2.5k ×0.7

EEE

2.6k ×1.1

181 ×0.7

EOMM

347 ×1.5

740 ×3.3

Citations per year, relative to Jeong‐Won Yoon Jeong‐Won Yoon (= 1×) peers Songbai Xue

Countries citing papers authored by Jeong‐Won Yoon

Since Specialization

Citations

This map shows the geographic impact of Jeong‐Won Yoon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jeong‐Won Yoon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jeong‐Won Yoon more than expected).

Fields of papers citing papers by Jeong‐Won Yoon

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jeong‐Won Yoon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jeong‐Won Yoon. The network helps show where Jeong‐Won Yoon may publish in the future.

Co-authorship network of co-authors of Jeong‐Won Yoon

This figure shows the co-authorship network connecting the top 25 collaborators of Jeong‐Won Yoon. A scholar is included among the top collaborators of Jeong‐Won Yoon based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jeong‐Won Yoon. Jeong‐Won Yoon is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Yoon, Jeong‐Won, et al.. (2025). Effects of Supplemental LED Lighting based on Solar Irradiation and Carbon Dioxide Enrichment on Photosynthesis, Growth, and Yield of Greenhouse-Grown Tomato Plants. Journal of people, plants, and environment. 28(1). 1–12. 1 indexed citations

Min, Kyung Deuk, et al.. (2024). Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability. Materials Characterization. 216. 114289–114289. 3 indexed citations

Yoon, Jeong‐Won, et al.. (2024). Metallurgical reactions and high-temperature long-term reliability of the Sn-2.3Ag flip-chip solder bump. Microelectronic Engineering. 296. 112293–112293. 1 indexed citations

Yoon, Jeong‐Won, et al.. (2024). Metallurgical and mechanical properties of transient liquid phase bonded joints formed using Sn/Ni-foam hybrid preforms. Materials Chemistry and Physics. 333. 130340–130340. 2 indexed citations

Yoon, Jeong‐Won, et al.. (2023). Effects of solder ball size and reflow cycles on properties of Sn-3.0Ag-0.5Cu/Cu joints. Journal of Materials Science Materials in Electronics. 34(33). 5 indexed citations

Kim, Jung Soo, et al.. (2023). A comparative study of laser soldering and reflow soldering using Sn–58Bi solder/Cu joints. Journal of Materials Science Materials in Electronics. 34(28). 3 indexed citations

Yoon, Jeong‐Won, et al.. (2022). Metallurgically and mechanically reliable microsilver-sintered joints for automotive power module applications. Journal of Materials Science Materials in Electronics. 33(3). 1724–1737. 9 indexed citations

Yoon, Jeong‐Won, et al.. (2022). Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints. Journal of Materials Science Materials in Electronics. 33(10). 7983–7994. 20 indexed citations

Yoon, Jeong‐Won, et al.. (2021). A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste. Journal of Welding and Joining. 39(4). 376–383. 2 indexed citations

10.

Yoon, Jeong‐Won, et al.. (2021). Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging. Journal of Materials Science Materials in Electronics. 32(20). 24790–24800. 5 indexed citations

11.

Jung, Seung‐Boo, et al.. (2020). Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications. Journal of Materials Science Materials in Electronics. 31(18). 15048–15060. 13 indexed citations

12.

Kim, Jung Soo, Seung‐Boo Jung, & Jeong‐Won Yoon. (2020). Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging. Journal of Materials Science Materials in Electronics. 31(22). 19852–19874. 2 indexed citations

13.

Jung, Seung‐Boo, et al.. (2020). Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications. Thin Solid Films. 698. 137873–137873. 6 indexed citations

14.

Kim, Jung Soo, et al.. (2019). Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging. Journal of Materials Science Materials in Electronics. 30(14). 12911–12923. 3 indexed citations

15.

Kim, Jung Soo, Seung‐Boo Jung, & Jeong‐Won Yoon. (2019). Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn–58Bi solder joint. Journal of Alloys and Compounds. 820. 153396–153396. 12 indexed citations

16.

Min, Kyung Deuk, et al.. (2019). The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module. Journal of Welding and Joining. 37(2). 1–6. 1 indexed citations

17.

Yoon, Jeong‐Won, et al.. (2019). Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications. Journal of Welding and Joining. 37(2). 26–34. 6 indexed citations

18.

Yoo, Sehoon, et al.. (2018). Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints. Journal of Welding and Joining. 36(5). 52–60. 5 indexed citations

19.

Yoon, Jeong‐Won, et al.. (2018). Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes. Surface and Interface Analysis. 50(11). 1046–1050. 7 indexed citations

20.

Lee, Chang‐Woo, et al.. (2016). Comparative study of Au–Sn and Sn–Ag–Cu as die‐attach materials for power electronics applications. Surface and Interface Analysis. 48(7). 493–497. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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