Jeong‐Won Yoon

4.3k total citations
180 papers, 3.6k citations indexed

About

Jeong‐Won Yoon is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Jeong‐Won Yoon has authored 180 papers receiving a total of 3.6k indexed citations (citations by other indexed papers that have themselves been cited), including 177 papers in Electrical and Electronic Engineering, 123 papers in Mechanical Engineering and 11 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Jeong‐Won Yoon's work include Electronic Packaging and Soldering Technologies (173 papers), 3D IC and TSV technologies (136 papers) and Advanced Welding Techniques Analysis (68 papers). Jeong‐Won Yoon is often cited by papers focused on Electronic Packaging and Soldering Technologies (173 papers), 3D IC and TSV technologies (136 papers) and Advanced Welding Techniques Analysis (68 papers). Jeong‐Won Yoon collaborates with scholars based in South Korea, Australia and United States. Jeong‐Won Yoon's co-authors include Seung‐Boo Jung, Bo‐In Noh, Sang-Won Kim, Hyun-Suk Chun, Chang‐Bae Lee, Chang-Chae Shur, Ja‐Myeong Koo, Dae‐Gon Kim, Cheol‐Woong Yang and Hoo-Jeong Lee and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Journal of Alloys and Compounds.

In The Last Decade

Jeong‐Won Yoon

170 papers receiving 3.5k citations

Peers

Countries citing papers authored by Jeong‐Won Yoon

Since Specialization

Citations

This map shows the geographic impact of Jeong‐Won Yoon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jeong‐Won Yoon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jeong‐Won Yoon more than expected).

Fields of papers citing papers by Jeong‐Won Yoon

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jeong‐Won Yoon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jeong‐Won Yoon. The network helps show where Jeong‐Won Yoon may publish in the future.

Co-authorship network of co-authors of Jeong‐Won Yoon

This figure shows the co-authorship network connecting the top 25 collaborators of Jeong‐Won Yoon. A scholar is included among the top collaborators of Jeong‐Won Yoon based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jeong‐Won Yoon. Jeong‐Won Yoon is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Title	Journal	Authors	Indexed citations
1	Effects of Supplemental LED Lighting based on Solar Irradiation and Carbon Dioxide Enrichment on Photosynthesis, Growth, and Yield of Greenhouse-Grown Tomato Plants	Journal of people, plants, and environment	Jeong‐Won Yoon et al.	1
2	Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability	Materials Characterization	Kyung Deuk Min, Jeong‐Won Yoon et al.	3
3	Metallurgical reactions and high-temperature long-term reliability of the Sn-2.3Ag flip-chip solder bump	Microelectronic Engineering	Jeong‐Won Yoon et al.	1
4	Metallurgical and mechanical properties of transient liquid phase bonded joints formed using Sn/Ni-foam hybrid preforms	Materials Chemistry and Physics	Jeong‐Won Yoon et al.	2
5	Effects of solder ball size and reflow cycles on properties of Sn-3.0Ag-0.5Cu/Cu joints	Journal of Materials Science Materials in Electronics	Jeong‐Won Yoon et al.	5
6	A comparative study of laser soldering and reflow soldering using Sn–58Bi solder/Cu joints	Journal of Materials Science Materials in Electronics	Jung Soo Kim, Jeong‐Won Yoon et al.	3
7	Metallurgically and mechanically reliable microsilver-sintered joints for automotive power module applications	Journal of Materials Science Materials in Electronics	Jeong‐Won Yoon et al.	9
8	Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints	Journal of Materials Science Materials in Electronics	Jeong‐Won Yoon et al.	20
9	A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste	Journal of Welding and Joining	Jeong‐Won Yoon et al.	2
10	Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging	Journal of Materials Science Materials in Electronics	Jeong‐Won Yoon et al.	5
11	Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications	Journal of Materials Science Materials in Electronics	Seung‐Boo Jung, Jeong‐Won Yoon et al.	13
12	Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging	Journal of Materials Science Materials in Electronics	Jung Soo Kim, Seung‐Boo Jung et al.	2
13	Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications	Thin Solid Films	Seung‐Boo Jung, Jeong‐Won Yoon et al.	6
14	Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging	Journal of Materials Science Materials in Electronics	Jung Soo Kim, Seung‐Boo Jung et al.	3
15	Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn–58Bi solder joint	Journal of Alloys and Compounds	Jung Soo Kim, Seung‐Boo Jung et al.	12
16	The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module	Journal of Welding and Joining	Kyung Deuk Min, Jeong‐Won Yoon et al.	1
17	Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications	Journal of Welding and Joining	Jeong‐Won Yoon et al.	6
18	Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints	Journal of Welding and Joining	Sehoon Yoo, Seung‐Boo Jung et al.	5
19	Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes	Surface and Interface Analysis	Jeong‐Won Yoon, Seung‐Boo Jung et al.	7
20	Comparative study of Au–Sn and Sn–Ag–Cu as die‐attach materials for power electronics applications	Surface and Interface Analysis	Chang‐Woo Lee, Jeong‐Won Yoon et al.	15

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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