Hoo-Jeong Lee
- Electrical and Electronic Engineering top 2%
- Materials Chemistry top 5%
- Biomedical Engineering top 5%
- Mechanical Engineering top 5%
- Electronic, Optical and Magnetic Materials top 5%
- Co-authors
- Ainissa G. RamirezJoon‐Shik ParkJun-Gu KangKee-Won KwonSun-Ho KimHyoungsub KimJ. C. BravmanHai Ni
- Topics
- Electronic Packaging and Soldering Technologies (30 papers)3D IC and TSV technologies (22 papers)Thin-Film Transistor Technologies (21 papers)
- Partner nations
- South KoreaUnited StatesChina
In The Last Decade
Hoo-Jeong Lee
137 papers receiving 2.5k citations
Peers
Comparison fields: 5 of 79
- Electrical and Electronic Engineering 1.7k
- Materials Chemistry 1.2k
- Biomedical Engineering 519
- Mechanical Engineering 504
- Electronic, Optical and Magnetic Materials 408
Countries citing papers authored by Hoo-Jeong Lee
This map shows the geographic impact of Hoo-Jeong Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hoo-Jeong Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hoo-Jeong Lee more than expected).
Fields of papers citing papers by Hoo-Jeong Lee
This network shows the impact of papers produced by Hoo-Jeong Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hoo-Jeong Lee. The network helps show where Hoo-Jeong Lee may publish in the future.
Co-authorship network of co-authors of Hoo-Jeong Lee
This figure shows the co-authorship network connecting the top 25 collaborators of Hoo-Jeong Lee. A scholar is included among the top collaborators of Hoo-Jeong Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hoo-Jeong Lee. Hoo-Jeong Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 0 | |
| 3 | 9 | |
| 4 | 15 | |
| 5 | 11 | |
| 6 | 2 | |
| 7 | 2 | |
| 8 | 31 | |
| 9 | 28 | |
| 10 | 4 | |
| 11 | 9 | |
| 12 | 1 | |
| 13 | 1 | |
| 14 | 28 | |
| 15 | 7 | |
| 16 | 22 | |
| 17 | 15 | |
| 18 | 23 | |
| 19 | 10 | |
| 20 | 15 |
About Hoo-Jeong Lee
Hoo-Jeong Lee is a scholar working on Electrical and Electronic Engineering, Polymers and Plastics and Bioengineering, having authored 141 papers that have together received 2.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (22 papers) and Thin-Film Transistor Technologies (21 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.7k citations), Materials Chemistry (1.2k citations) and Bioengineering (146 citations). Hoo-Jeong Lee has collaborated with scholars based in South Korea, United States and China. Frequent co-authors include Ainissa G. Ramirez, Joon‐Shik Park, Jun-Gu Kang, Kee-Won Kwon, Sun-Ho Kim, Hyoungsub Kim, J. C. Bravman, Hai Ni, Seung‐Boo Jung and Robert Sinclair. Their work appears in journals such as ACS Nano, Applied Physics Letters and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.