Yong-Ho Ko

827 total citations
54 papers, 689 citations indexed

About

Yong-Ho Ko is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Yong-Ho Ko has authored 54 papers receiving a total of 689 indexed citations (citations by other indexed papers that have themselves been cited), including 52 papers in Electrical and Electronic Engineering, 32 papers in Mechanical Engineering and 4 papers in Materials Chemistry. Recurrent topics in Yong-Ho Ko's work include Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (42 papers) and Advanced Welding Techniques Analysis (18 papers). Yong-Ho Ko is often cited by papers focused on Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (42 papers) and Advanced Welding Techniques Analysis (18 papers). Yong-Ho Ko collaborates with scholars based in South Korea, China and Japan. Yong-Ho Ko's co-authors include Chang‐Woo Lee, Junghwan Bang, Ming Yang, Mingyu Li, Taek‐Soo Kim, Jin Yu, Sehoon Yoo, Hongjun Ji, Jianxin Wu and Shuai Wang and has published in prestigious journals such as ACS Applied Materials & Interfaces, Journal of Materials Chemistry A and Journal of Alloys and Compounds.

In The Last Decade

Yong-Ho Ko

52 papers receiving 671 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yong-Ho Ko South Korea 14 612 423 82 69 54 54 689
Sehoon Yoo South Korea 13 475 0.8× 290 0.7× 59 0.7× 86 1.2× 36 0.7× 88 605
Ja‐Myeong Koo South Korea 16 514 0.8× 329 0.8× 67 0.8× 87 1.3× 21 0.4× 37 612
Chunjin Hang China 17 708 1.2× 444 1.0× 135 1.6× 138 2.0× 63 1.2× 53 838
K.-J. Wolter Germany 11 419 0.7× 193 0.5× 71 0.9× 54 0.8× 45 0.8× 74 506
Barbara Horváth Hungary 14 355 0.6× 191 0.5× 57 0.7× 82 1.2× 43 0.8× 31 445
Yoonchul Sohn South Korea 10 420 0.7× 312 0.7× 97 1.2× 116 1.7× 20 0.4× 38 579
Guoyuan Li China 15 370 0.6× 132 0.3× 139 1.7× 154 2.2× 27 0.5× 51 548
Rong An China 16 506 0.8× 364 0.9× 54 0.7× 138 2.0× 66 1.2× 55 654
Choong-Jae Lee South Korea 13 393 0.6× 282 0.7× 49 0.6× 42 0.6× 21 0.4× 49 469

Countries citing papers authored by Yong-Ho Ko

Since Specialization
Citations

This map shows the geographic impact of Yong-Ho Ko's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yong-Ho Ko with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yong-Ho Ko more than expected).

Fields of papers citing papers by Yong-Ho Ko

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yong-Ho Ko. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yong-Ho Ko. The network helps show where Yong-Ho Ko may publish in the future.

Co-authorship network of co-authors of Yong-Ho Ko

This figure shows the co-authorship network connecting the top 25 collaborators of Yong-Ho Ko. A scholar is included among the top collaborators of Yong-Ho Ko based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yong-Ho Ko. Yong-Ho Ko is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Ko, Yong-Ho, et al.. (2024). Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications. Electronics. 13(11). 2173–2173. 1 indexed citations
3.
Kim, Jung Soo, Dae Young Park, Junghwan Bang, et al.. (2021). Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad. Microelectronics Reliability. 129. 114472–114472. 5 indexed citations
4.
5.
Kim, Minsu, et al.. (2021). Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules. Journal of Materials Science Materials in Electronics. 32(3). 3324–3333. 7 indexed citations
6.
Park, Kyoung Ryeol, Ghulam Ali, Yong-Ho Ko, et al.. (2019). Oxygen Evolution Reaction of Co-Mn-O Electrocatalyst Prepared by Solution Combustion Synthesis. Catalysts. 9(6). 564–564. 15 indexed citations
7.
Ko, Yong-Ho, et al.. (2019). Improving Joint Reliability of Lead-free Solder on Flexible Substrate under Cyclic Bending by Adding Graphene Oxide Powder. Journal of the Microelectronics and Packaging Society. 26(3). 43–49. 2 indexed citations
8.
Bang, Junghwan, et al.. (2019). Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate. Microelectronics Reliability. 99. 62–73. 25 indexed citations
9.
Ko, Yong-Ho, et al.. (2019). Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability. Journal of Materials Science Materials in Electronics. 30(17). 15889–15896. 11 indexed citations
10.
Ko, Yong-Ho, et al.. (2018). A Study on the Electrochemical Corrosion Property of Sn-xSb Solder Alloy. Journal of Welding and Joining. 36(3). 78–82. 2 indexed citations
11.
Park, Dae Young, et al.. (2018). Properties of Lead-free Solder Joints on Flexible Substrate for Automotive Electronics. Journal of the Microelectronics and Packaging Society. 25(2). 25–30. 1 indexed citations
12.
Kwon, Soon-Yong, et al.. (2018). Effects of Flux Activator on Wettability and Slump of Sn-Ag-Cu Solder Paste. Journal of the Microelectronics and Packaging Society. 25(4). 123–128. 1 indexed citations
13.
Kim, Min‐Su, et al.. (2016). Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling. MATERIALS TRANSACTIONS. 57(7). 1192–1196. 8 indexed citations
14.
Ko, Yong-Ho, Jong‐Dae Lee, Taeshik Yoon, Chang‐Woo Lee, & Taek‐Soo Kim. (2016). Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene. ACS Applied Materials & Interfaces. 8(8). 5679–5686. 45 indexed citations
15.
Ko, Yong-Ho, et al.. (2014). Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging. Journal of Welding and Joining. 32(3). 19–26. 2 indexed citations
16.
Lee, Youngkwan, Yong-Ho Ko, Junki Kim, Chang‐Woo Lee, & Sehoon Yoo. (2013). The effect of intermetallic compound evolution on the fracture behavior of Au stud bumps joined with Sn-3.5Ag solder. Electronic Materials Letters. 9(1). 31–39. 21 indexed citations
17.
Kim, Taek, Jusung Kim, Yongsoo Park, et al.. (2012). Monolithic White LED with Controllable Color Temperature. 74. ATh5A.5–ATh5A.5. 1 indexed citations
18.
Ko, Yong-Ho, Sehoon Yoo, & Chang‐Woo Lee. (2010). Evaluation on Reliability of High Temperature Lead-free Solder for Automotive Electronics. Journal of the Microelectronics and Packaging Society. 17(4). 35–40. 9 indexed citations
19.
Ko, Yong-Ho, et al.. (2007). Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad. Journal of materials research/Pratt's guide to venture capital sources. 22(7). 1879–1887. 64 indexed citations
20.
Ko, Yong-Ho, et al.. (2006). Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads. Electronic Materials Letters. 2(3). 161–166. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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