C.F. Tsang

682 citations

31 papers · 608 indexed · h-index 12

Electrical and Electronic Engineering top 10%
Polymers and Plastics top 5%
Electronic, Optical and Magnetic Materials top 10%
Materials Chemistry
Mechanical Engineering

Co-authors: Arumugam Manthiram J. Kim Hui Kim Hui Yi Su Jaekook Kim Vladimir Bliznetsov D. J. Wolford Jens Martinsen
Topics: Copper Interconnects and Reliability (13 papers)Semiconductor materials and devices (13 papers)Advancements in Battery Materials (5 papers)
Cited by: Polymers and Plastics Electronic, Optical and Magnetic Materials Catalysis
Journals: Applied Physics Letters Journal of The Electrochemical Society Journal of Materials Chemistry
Partner nations: Singapore United States Japan

In The Last Decade

C.F. Tsang

31 papers receiving 582 citations

Peers

Countries citing papers authored by C.F. Tsang

Since Specialization

Citations

This map shows the geographic impact of C.F. Tsang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.F. Tsang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.F. Tsang more than expected).

Fields of papers citing papers by C.F. Tsang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C.F. Tsang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.F. Tsang. The network helps show where C.F. Tsang may publish in the future.

Co-authorship network of co-authors of C.F. Tsang

This figure shows the co-authorship network connecting the top 25 collaborators of C.F. Tsang. A scholar is included among the top collaborators of C.F. Tsang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C.F. Tsang. C.F. Tsang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Adhesion Studies of Ta∕Low-k (Black Diamond) Interface using Thermocompressive Wafer Bonding and Four-Point Bend 2006 ·Journal of The Electrochemical Society ·W. H. Teh,C.F. Tsang,(unknown),(unknown),Rakesh Kumar,N. Balasubramanian,D. L. Kwong,Suan Ee Ong,(unknown),Chee Lip Gan	7
2	Effects of plasma treatments on structural and electrical properties of methyl-doped silicon oxide low dielectric constant film 2005 ·Thin Solid Films ·Wai Yie Leong,C.F. Tsang,H.Y. Li,Vladimir Bliznetsov,(unknown),(unknown)	4
3	A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections 2004 ·Microelectronics Reliability ·C.F. Tsang,(unknown),Ahila Krishnamoorthy,(unknown),Yi Su,H.Y. Li,(unknown),(unknown)	9
4	Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization 2004 ·Microelectronics Journal ·C.F. Tsang,C.Y. Li,Ahila Krishnamoorthy,Yi Su,H.Y. Li,(unknown),(unknown),L.J. Tang,(unknown)	1
5	TDDB reliability assessments of 0.13 μm Cu/low-k interconnects fabricated with PECVD low-k materials 2004 ·(unknown),(unknown),C.F. Tsang,(unknown),(unknown),A. D. Trigg	4
6	130 nm process technology integration of advanced Cu/CVD low k dielectric material-case study of failure analysis and yield enhancement 2004 ·C.F. Tsang,Yi Su,Vladimir Bliznetsov,(unknown)	3
7	Comparative studies of physical and chemical properties of plasma-treated CVD low k SiOCH dielectrics 2004 ·Thin Solid Films ·C.F. Tsang,Yi Su,Vladimir Bliznetsov	7
8	Improved dense via yields of Cu/CVD low k Coral™ dual damascene metallization at post Cu cap etch wet clean 2004 ·Microelectronic Engineering ·C.F. Tsang,(unknown),Yi Su,(unknown),(unknown),(unknown),M. Koh	1
9	Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects 2004 ·Microelectronic Engineering ·S. Balakumar,(unknown),C.F. Tsang,T. Hara,Won Jong Yoo	4
10	Impact of barrier metal on electrical performance of Cu/low K (Black Diamond™) in 0.13μm dual damascene interconnection 2004 ·Thin Solid Films ·H.Y. Li,C.Y. Li,Yi Su,C.F. Tsang	2
11	An alternative method to the curing study of polymeric die attach adhesives using dynamic mechanical analysis 2001 ·Thermochimica Acta ·C.F. Tsang,Hui Kim Hui	6
12	Chemical and morphological studies of plasma-treated integrated circuit bond pads 2001 ·Journal of Electronic Materials ·(unknown),(unknown),C.F. Tsang,(unknown),(unknown),(unknown)	1
13	Evaluation of copper thin film on SiO2/Si substrates by dynamic ultramicroindentation, SEM and AFM 2000 ·Surface and Interface Analysis ·C.F. Tsang,Hui Kim Hui	5
14	An investigation on the plasma treatment of integrated circuit bond pads 2000 ·Microelectronics Reliability ·(unknown),R. Gopalakrishnan,C.F. Tsang,(unknown),(unknown),(unknown)	18
15	Synthesis of Manganese Oxides by Reduction of KMnO4with KBH4in Aqueous Solutions 1998 ·Journal of Solid State Chemistry ·C.F. Tsang,J. Kim,Arumugam Manthiram	55
16	Synthesis of Nanocrystalline VO 2 and Its Electrochemical Behavior in Lithium Batteries 1997 ·Journal of The Electrochemical Society ·C.F. Tsang,Arumugam Manthiram	180
17	Synthesis of lower-valent molybdenum oxides in aqueous solutions by reducing Na2MoO4 with NaBH4 1997 ·Journal of Materials Chemistry ·C.F. Tsang,Arumugam Manthiram	28
18	Reduction of Aqueous Na₂WO₄ by NaBH₄ at Ambient Temperatures To Obtain Lower Valent Tungsten Oxides 1997 ·Inorganic Chemistry ·C.F. Tsang,(unknown),Arumugam Manthiram	44
19	A new route for the synthesis of LiMn2O4 cathode: variation of composition, microstructure, and electrochemical behavior with synthesis temperature 1996 ·Solid State Ionics ·C.F. Tsang	33
20	Comparison of transport, recombination, and interfacial quality in molecular beam epitaxy and organometallic vapor-phase epitaxy GaAs/AlxGa1−xAs structures 1994 ·Applied Physics Letters ·D. J. Wolford,G. D. Gilliland,T. F. Kuech,John F. Klem,Harold P. Hjalmarson,J. A. Bradley,C.F. Tsang,Jens Martinsen	14

About C.F. Tsang

C.F. Tsang is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Catalysis, having authored 31 papers that have together received 608 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (13 papers), Semiconductor materials and devices (13 papers) and Advancements in Battery Materials (5 papers). The work is most often cited by research in Polymers and Plastics (234 citations), Electronic, Optical and Magnetic Materials (231 citations) and Catalysis (57 citations). C.F. Tsang has collaborated with scholars based in Singapore, United States and Japan. Frequent co-authors include Arumugam Manthiram, J. Kim, Hui Kim Hui, Yi Su, Jaekook Kim, Vladimir Bliznetsov, D. J. Wolford, Jens Martinsen, G. D. Gilliland and J. A. Bradley. Their work appears in journals such as Applied Physics Letters, Journal of The Electrochemical Society and Journal of Materials Chemistry.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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