Dan Oh

962 total citations
78 papers, 682 citations indexed

About

Dan Oh is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Biomedical Engineering. According to data from OpenAlex, Dan Oh has authored 78 papers receiving a total of 682 indexed citations (citations by other indexed papers that have themselves been cited), including 76 papers in Electrical and Electronic Engineering, 15 papers in Hardware and Architecture and 5 papers in Biomedical Engineering. Recurrent topics in Dan Oh's work include Electromagnetic Compatibility and Noise Suppression (50 papers), Advancements in PLL and VCO Technologies (37 papers) and 3D IC and TSV technologies (29 papers). Dan Oh is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (50 papers), Advancements in PLL and VCO Technologies (37 papers) and 3D IC and TSV technologies (29 papers). Dan Oh collaborates with scholars based in United States, South Korea and United Kingdom. Dan Oh's co-authors include Joong-Ho Kim, Sam Chang, Yujeong Shim, Chuck Yuan, Jihong Ren, Guang Chen, Kil‐Soo Kim, Prabhakar R. Bandaru, Jaeho Lee and Ercan M. Dede and has published in prestigious journals such as IEEE Microwave and Wireless Components Letters, IEEE Transactions on Electromagnetic Compatibility and IEEE Transactions on Advanced Packaging.

In The Last Decade

Dan Oh

70 papers receiving 637 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Dan Oh United States 15 605 98 94 41 41 78 682
Meng-Kai Shih Taiwan 12 418 0.7× 108 1.1× 45 0.5× 19 0.5× 84 2.0× 64 500
Chin‐Li Kao Taiwan 12 435 0.7× 61 0.6× 40 0.4× 21 0.5× 81 2.0× 40 496
C.-P Hung Taiwan 9 321 0.5× 47 0.5× 41 0.4× 21 0.5× 39 1.0× 51 375
Debendra Mallik United States 7 339 0.6× 57 0.6× 75 0.8× 41 1.0× 45 1.1× 11 392
Liang Deng China 11 216 0.4× 61 0.6× 53 0.6× 27 0.7× 28 0.7× 43 376
Kaladhar Radhakrishnan United States 17 909 1.5× 125 1.3× 100 1.1× 54 1.3× 60 1.5× 61 1.0k
Chang-Chi Lee Taiwan 10 311 0.5× 125 1.3× 35 0.4× 60 1.5× 58 1.4× 28 370
Peiyi Zhao United States 14 526 0.9× 217 2.2× 112 1.2× 51 1.2× 58 1.4× 44 642
Gamal Refai-Ahmed United States 13 275 0.5× 33 0.3× 35 0.4× 21 0.5× 183 4.5× 77 459
Sri M. Sri-Jayantha United States 8 672 1.1× 109 1.1× 36 0.4× 42 1.0× 104 2.5× 14 776

Countries citing papers authored by Dan Oh

Since Specialization
Citations

This map shows the geographic impact of Dan Oh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dan Oh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dan Oh more than expected).

Fields of papers citing papers by Dan Oh

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dan Oh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dan Oh. The network helps show where Dan Oh may publish in the future.

Co-authorship network of co-authors of Dan Oh

This figure shows the co-authorship network connecting the top 25 collaborators of Dan Oh. A scholar is included among the top collaborators of Dan Oh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dan Oh. Dan Oh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lee, Sangmin, et al.. (2023). Predicting reliability behavior in HBM packages through numerical simulation. 689–693. 1 indexed citations
2.
Oh, Dan, et al.. (2020). Advanced RDL Interposer PKG Technology for Heterogeneous Integration. 1–5. 9 indexed citations
4.
Kim, Yong‐Hoon, et al.. (2019). Differential-To-Common-Mode Conversion Suppression Using Mushroom Structure on Bent Differential Transmission Lines. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(4). 702–711. 9 indexed citations
5.
Yoon, Won‐Sang, et al.. (2018). Design of Miniaturized Vertical Split-Ring Resonator Based on Coupled Coplanar Waveguide. IEEE Microwave and Wireless Components Letters. 28(9). 753–755. 4 indexed citations
6.
Oh, Dan, et al.. (2018). Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages. 1295–1301. 37 indexed citations
8.
Shim, Yujeong & Dan Oh. (2016). System Level Modeling of Timing Margin Loss Due to Dynamic Supply Noise for High-Speed Clock Forwarding Interface. IEEE Transactions on Electromagnetic Compatibility. 58(4). 1349–1358. 6 indexed citations
9.
Oh, Dan, et al.. (2015). Supply noise induced jitter modeling and optimization for high-speed interfaces. 1–42. 4 indexed citations
10.
Feng, Jun‐e, et al.. (2013). System level signal and power integrity analysis for 3200Mbps DDR4 interface. 1081–1086. 9 indexed citations
11.
Oh, Dan, et al.. (2012). Optimizing the timing center for high-speed parallel buses. 168–175. 3 indexed citations
12.
Oh, Dan. (2012). System level jitter characterization of high speed I/O systems. 173–178. 19 indexed citations
13.
Ren, Jihong, et al.. (2011). System design considerations for a 5Gb/s source-synchronous link with common-mode clocking. 143–146. 1 indexed citations
14.
Oh, Dan. (2011). Plane bounce in high-speed single-ended signaling I/O interfaces. 3–6. 1 indexed citations
15.
Kim, Joong-Ho, et al.. (2009). Challenges and solutions for next generation main memory systems. 93–96. 9 indexed citations
16.
Kim, Joong-Ho, Dan Oh, W.T. Beyene, et al.. (2009). Design of low cost QFP packages for multi-gigabit memory interface. 1662–1669. 2 indexed citations
17.
Chang, Sam, et al.. (2007). Jitter Amplification Considerations for PCB Clock Channel Design. 135–138. 15 indexed citations
18.
Ren, Jihong, Haechang Lee, Brian Leibowitz, et al.. (2007). Precursor ISI Reduction in High-Speed I/O. 134–135. 17 indexed citations
19.
Kim, Joong-Ho, et al.. (2006). S-parameters Based Transmission Line Modeling with Accurate Low-Frequency Response. 19. 79–82. 11 indexed citations
20.
Kim, Joong-Ho, et al.. (2006). Power Delivery Design for 800MHz DDR2 Memory Systems in Low-Cost Wire-Bond Packages. 222–228. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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