Dan Oh
Impact in
- Hardware and Architecture top 5%
- VLSI and Analog Circuit Testing
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Advancements in PLL and VCO Technologies
- Electronic Packaging and Soldering Technologies
- Low-power high-performance VLSI design
- Radio Frequency Integrated Circuit Design
- Electrostatic Discharge in Electronics
Papers in ⓘ
-
- Electromagnetic Compatibility and Noise Suppression 50
- Advancements in PLL and VCO Technologies 37
- 3D IC and TSV technologies 29
- Low-power high-performance VLSI design 23
- Electronic Packaging and Soldering Technologies 13
- Radio Frequency Integrated Circuit Design 6
- Power Line Communications and Noise 6
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- VLSI and Analog Circuit Testing 13
- Co-authors
- Joong-Ho Kim (11 shared papers)Yujeong Shim (9 shared papers)Sam Chang (10 shared papers)Chuck Yuan (11 shared papers)Jihong Ren (10 shared papers)Guang Chen (1 shared paper)Kil‐Soo Kim (6 shared papers)Ercan M. Dede (1 shared paper)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)IEEE Transactions on Electromagnetic Compatibility (2 papers)IEEE Transactions on Advanced Packaging (1 paper)IEEE Microwave and Wireless Components Letters (1 paper)Journal of Electronic Packaging (1 paper)
- Partner nations
- United StatesSouth KoreaUnited Kingdom
In The Last Decade
Dan Oh
70 papers receiving 637 citations
Peers
Comparison fields: 5 of 44
- Hardware and Architecture 94
- Electrical and Electronic Engineering 605
- Biomedical Engineering 98
- Electronic, Optical and Magnetic Materials 35
- Computer Networks and Communications 41
Countries citing papers authored by Dan Oh
This map shows the geographic impact of Dan Oh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dan Oh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dan Oh more than expected).
Fields of papers citing papers by Dan Oh
This network shows the impact of papers produced by Dan Oh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dan Oh. The network helps show where Dan Oh may publish in the future.
Co-authors
The 25 scholars most cited alongside Dan Oh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 78 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 46 | |
| 2 | 2020 | 44 | |
| 3 | 2018 | 38 | |
| 4 | 2018 | 37 | |
| 5 | 2018 | 30 | |
| 6 | 2006 | 25 | |
| 7 | 2014 | 20 | |
| 8 | 2007 | 20 | |
| 9 | 2012 | 19 | |
| 10 | 2018 | 18 | |
| 11 | 2007 | 17 | |
| 12 | 2009 | 17 | |
| 13 | 2007 | 15 | |
| 14 | 2008 | 15 | |
| 15 | 2014 | 15 | |
| 16 | 2015 | 14 | |
| 17 | 2007 | 14 | |
| 18 | 2014 | 13 | |
| 19 | 2011 | 13 | |
| 20 | 2007 | 13 |
About Dan Oh
Dan Oh is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Biomedical Engineering, Mechanical Engineering and Computer Networks and Communications, having authored 78 papers that have together received 682 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (50 papers), Advancements in PLL and VCO Technologies (37 papers), 3D IC and TSV technologies (29 papers), Low-power high-performance VLSI design (23 papers), VLSI and Analog Circuit Testing (13 papers), Electronic Packaging and Soldering Technologies (13 papers), Radio Frequency Integrated Circuit Design (6 papers) and Power Line Communications and Noise (6 papers). The work is most often cited by research in Hardware and Architecture (94 citations), Electrical and Electronic Engineering (605 citations), Biomedical Engineering (98 citations), Electronic, Optical and Magnetic Materials (35 citations) and Computer Networks and Communications (41 citations). Dan Oh has collaborated with scholars based in United States, South Korea and United Kingdom. Frequent co-authors include Joong-Ho Kim, Yujeong Shim, Sam Chang, Chuck Yuan, Jihong Ren, Guang Chen, Kil‐Soo Kim, Ercan M. Dede, Prabhakar R. Bandaru and Jaeho Lee. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Advanced Packaging, IEEE Microwave and Wireless Components Letters and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.