Jianbiao Pan

505 total citations
37 papers, 367 citations indexed

About

Jianbiao Pan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Media Technology. According to data from OpenAlex, Jianbiao Pan has authored 37 papers receiving a total of 367 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 6 papers in Media Technology. Recurrent topics in Jianbiao Pan's work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (14 papers) and Experimental Learning in Engineering (6 papers). Jianbiao Pan is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (14 papers) and Experimental Learning in Engineering (6 papers). Jianbiao Pan collaborates with scholars based in United States, Taiwan and Germany. Jianbiao Pan's co-authors include Jeh‐Nan Pan, Robert H. Storer, Jyhwen Wang, David Shaddock, Jason B. Baxter, Zhanping Xu, Florin Bobaru, David Geiger, Javad Mehrmashhadi and Yuye Tang and has published in prestigious journals such as International Journal of Production Research, Journal of Electronic Materials and Microelectronics Reliability.

In The Last Decade

Jianbiao Pan

32 papers receiving 345 citations

Peers

Jianbiao Pan

EEE

IME

Ji‐Min Kim South Korea

T. Reinikainen United States

Bob Willis United Kingdom

Przemyslaw Jakub Gromala Germany

Guicui Fu China

Chao-Pin Yeh United States

Ke Pan United States

Chao Tan China

Chengdi Xiao China

Ji‐Min Kim South Korea

Jianbiao Pan

501 ×2.0

EEE

144 ×1.3

48 ×0.7

16 ×0.3

IME

28 ×0.7

Citations per year, relative to Jianbiao Pan Jianbiao Pan (= 1×) peers Ji‐Min Kim

Countries citing papers authored by Jianbiao Pan

Since Specialization

Citations

This map shows the geographic impact of Jianbiao Pan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jianbiao Pan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jianbiao Pan more than expected).

Fields of papers citing papers by Jianbiao Pan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jianbiao Pan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jianbiao Pan. The network helps show where Jianbiao Pan may publish in the future.

Co-authorship network of co-authors of Jianbiao Pan

This figure shows the co-authorship network connecting the top 25 collaborators of Jianbiao Pan. A scholar is included among the top collaborators of Jianbiao Pan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jianbiao Pan. Jianbiao Pan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Pan, Jianbiao, et al.. (2020). A Project Based Electronics Manufacturing Laboratory Course For Lower Division Engineering Students. 13.90.1–13.90.16. 3 indexed citations

Pan, Jianbiao, et al.. (2018). Screen Printing Fine Pitch Stretchable Silver Inks onto a Flexible Substrate for Wearable Applications. Journal of Microelectronics and Electronic Packaging. 15(4). 179–186. 2 indexed citations

Mehrmashhadi, Javad, Yuye Tang, Xiaoliang Zhao, et al.. (2018). The Effect of Solder Joint Microstructure on the Drop Test Failure—A Peridynamic Analysis. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(1). 58–71. 29 indexed citations

Pan, Jianbiao. (2013). Effect of Voiding in Solder Joints on Thermal Performance of the LED. IMAPSource Proceedings. 2013(1). 895–901.

Pan, Jianbiao, et al.. (2011). Effect of Gold Content on the Reliability of SnAgCu Solder Joints. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(10). 1662–1669. 19 indexed citations

Pan, Jianbiao, et al.. (2009). Drop Impact Dynamic Response Study of JEDEC JESD22-B111 Test Board. DigitalCommons - CalPoly (California State Polytechnic University). 2(1). 10. 1 indexed citations

Pan, Jeh‐Nan, et al.. (2009). Optimization of engineering tolerance design using revised loss functions. Engineering Optimization. 41(2). 99–118. 15 indexed citations

Pan, Jianbiao, et al.. (2009). Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Soldering and Surface Mount Technology. 21(4). 32–37. 25 indexed citations

Pan, Jianbiao, et al.. (2009). The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability. Journal of Microelectronics and Electronic Packaging. 6(1). 89–95. 1 indexed citations

10.

Pan, Jeh‐Nan, et al.. (2008). Finding and optimising the key factors for the multiple-response manufacturing process. International Journal of Production Research. 47(9). 2327–2344. 6 indexed citations

11.

Pan, Jianbiao, et al.. (2008). Board Level Failure Analysis of Chip Scale Package Drop Test Assemblies. DigitalCommons - CalPoly (California State Polytechnic University). 4 indexed citations

12.

Pan, Jianbiao, et al.. (2008). Drop Impact Dynamic Response Study of JEDEC JESD22-B111 Test Board. DigitalCommons - CalPoly (California State Polytechnic University). 3 indexed citations

13.

Pan, Jianbiao, et al.. (2006). Effect of Chromium–Gold and Titanium–Titanium Nitride–Platinum–Gold Metallization on Wire/Ribbon Bondability. IEEE Transactions on Advanced Packaging. 29(4). 707–713. 21 indexed citations

14.

Pan, Jianbiao. (2006). Estimation of Liquidus Temperature when SnAgCu BGA/CSP Components are Soldered with SnPb Paste. DigitalCommons - CalPoly (California State Polytechnic University). 92. 1–6. 3 indexed citations

15.

Pan, Jianbiao, Jyhwen Wang, & David Shaddock. (2005). Lead-free Solder Joint Reliability – State of the Art and Perspectives. Journal of Microelectronics and Electronic Packaging. 2(1). 72–83. 20 indexed citations

16.

Pan, Jianbiao, et al.. (2004). Wire Bonding Challenges in Optoelectronics Packaging. Bulletin of Environmental Contamination and Toxicology. 9(1). 10–43. 8 indexed citations

17.

Pan, Jianbiao, et al.. (2004). Effect of chromium-gold and titanium-titanium nitride-platinum-gold metallization on wire/ribbon bondability. DigitalCommons - CalPoly (California State Polytechnic University). 180–185. 1 indexed citations

18.

Pan, Jianbiao, Jyhwen Wang, & David Shaddock. (2004). Lead-free Solder Joint Reliability – State of the Art and Perspectives. DigitalCommons - CalPoly (California State Polytechnic University). 1 indexed citations

19.

Pan, Jianbiao, et al.. (2003). Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP. DigitalCommons - CalPoly (California State Polytechnic University). 94–101. 40 indexed citations

20.

Pan, Jianbiao, et al.. (1999). A Study of the Aperture Filling Process in Solder Paste Stencil Printing. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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