Heinrich Wolf
Impact in
-
- Electrostatic Discharge in Electronics
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor materials and devices
- Silicon Carbide Semiconductor Technologies
- Advancements in Semiconductor Devices and Circuit Design
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
Papers in
-
- Electrostatic Discharge in Electronics 45
- Electromagnetic Compatibility and Noise Suppression 27
- Integrated Circuits and Semiconductor Failure Analysis 24
- Semiconductor materials and devices 22
- Silicon Carbide Semiconductor Technologies 9
- Advancements in Semiconductor Devices and Circuit Design 8
- 3D IC and TSV technologies 5
- Electronic Packaging and Soldering Technologies 4
- Co-authors
- Horst GieserW. WilkeningM. MergensWolf FïchtnerAndy StrickerWolfgang StadlerKai EsmarkA. Andreini
- Journals
- Microelectronics Reliability (12 papers)Microelectronic Engineering (5 papers)Journal of Electrostatics (4 papers)IEEE Transactions on Device and Materials Reliability (2 papers)Deutsche Entomologische Zeitschrift (1 paper)
- Partner nations
- GermanySwitzerlandItaly
In The Last Decade
Heinrich Wolf
60 papers receiving 543 citations
Peers
Comparison fields: 5 of 29
- Electrical and Electronic Engineering 574
- Hardware and Architecture 25
- Mechanics of Materials 16
- Electronic, Optical and Magnetic Materials 10
- Mechanical Engineering 14
Countries citing papers authored by Heinrich Wolf
This map shows the geographic impact of Heinrich Wolf's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Heinrich Wolf with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Heinrich Wolf more than expected).
Fields of papers citing papers by Heinrich Wolf
This network shows the impact of papers produced by Heinrich Wolf. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Heinrich Wolf. The network helps show where Heinrich Wolf may publish in the future.
Co-authors
The 25 scholars most cited alongside Heinrich Wolf, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 0 | |
| 2 | Impact of Alternative CDM Methods on HV ESD Protections Behavior | 2020 | 2 |
| 3 | 2019 | 1 | |
| 4 | 2018 | 9 | |
| 5 | 2009 | 1 | |
| 6 | 2007 | 15 | |
| 7 | 2006 | 10 | |
| 8 | 2006 | 15 | |
| 9 | 2006 | 3 | |
| 10 | 2004 | 4 | |
| 11 | 2004 | 6 | |
| 12 | 2004 | 29 | |
| 13 | 2002 | 5 | |
| 14 | 2002 | 4 | |
| 15 | 2002 | 3 | |
| 16 | 2002 | 11 | |
| 17 | 2000 | 15 | |
| 18 | 2000 | 107 | |
| 19 | 1999 | 5 | |
| 20 | Der Jungdeutsche Orden in seinen mittleren Jahren | 1978 | 1 |
About Heinrich Wolf
Heinrich Wolf is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Surfaces, Coatings and Films, Mechanics of Materials and Electronic, Optical and Magnetic Materials, having authored 62 papers that have together received 588 indexed citations. Recurring topics across this work include Electrostatic Discharge in Electronics (45 papers), Electromagnetic Compatibility and Noise Suppression (27 papers), Integrated Circuits and Semiconductor Failure Analysis (24 papers), Semiconductor materials and devices (22 papers), Silicon Carbide Semiconductor Technologies (9 papers), Advancements in Semiconductor Devices and Circuit Design (8 papers), 3D IC and TSV technologies (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (574 citations), Hardware and Architecture (25 citations), Mechanics of Materials (16 citations), Electronic, Optical and Magnetic Materials (10 citations) and Mechanical Engineering (14 citations). Heinrich Wolf has collaborated with scholars based in Germany, Switzerland and Italy. Frequent co-authors include Horst Gieser, W. Wilkening, M. Mergens, Wolf Fïchtner, Andy Stricker, Wolfgang Stadler, Kai Esmark, A. Andreini, P. Egger and Joost Willemen. Their work appears in journals such as Microelectronics Reliability, Microelectronic Engineering, Journal of Electrostatics, IEEE Transactions on Device and Materials Reliability and Deutsche Entomologische Zeitschrift.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.