A. Andreini
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- Electrostatic Discharge in Electronics 31
- Integrated Circuits and Semiconductor Failure Analysis 19
- Semiconductor materials and devices 17
- Advancements in Semiconductor Devices and Circuit Design 12
- Silicon Carbide Semiconductor Technologies 11
- Electromagnetic Compatibility and Noise Suppression 9
- Electronic Packaging and Soldering Technologies 3
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- Copper Interconnects and Reliability 1
- Co-authors
- C. ContieroP. GalbiatiHeinrich WolfHorst GieserW. WilkeningJoost WillemenGaudenzio MeneghessoE. Gornik
- Journals
- Microelectronics Reliability (4 papers)IEEE Transactions on Device and Materials Reliability (2 papers)Journal of Electrostatics (1 paper)
- Partner nations
- ItalySwitzerlandGermany
In The Last Decade
A. Andreini
33 papers receiving 249 citations
Peers
Comparison fields: 5 of 24
- Electrical and Electronic Engineering 270
- Hardware and Architecture 10
- Biomedical Engineering 21
- Condensed Matter Physics 5
- Electronic, Optical and Magnetic Materials 7
Countries citing papers authored by A. Andreini
This map shows the geographic impact of A. Andreini's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Andreini with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Andreini more than expected).
Fields of papers citing papers by A. Andreini
This network shows the impact of papers produced by A. Andreini. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Andreini. The network helps show where A. Andreini may publish in the future.
Co-authorship network
The 25 scholars most cited alongside A. Andreini, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 0 | |
| 2 | Impact of Alternative CDM Methods on HV ESD Protections Behavior | 2020 | 2 |
| 3 | 2018 | 3 | |
| 4 | 2018 | 1 | |
| 5 | 2017 | 3 | |
| 6 | 2016 | 4 | |
| 7 | 2015 | 4 | |
| 8 | 2015 | 2 | |
| 9 | Thin copper metal interconnections thermomigration analysis in ESD regime | 2014 | 2 |
| 10 | Novel 190V LIGBT-based ESD protection for 0.35μm Smart Power technology realized on SOI substrate | 2008 | 2 |
| 11 | Analysis of the triggering behavior of low voltage BCD single and multi-finger gc-NMOS ESD protection devices | 2006 | 8 |
| 12 | Novel technique to reduce latch-up risk due to ESD protection devices in Smart Power technologies | 2006 | 5 |
| 13 | 2004 | 6 | |
| 14 | 2004 | 4 | |
| 15 | 2004 | 8 | |
| 16 | A traceable method for the arc-free characterization and modeling of CDM testers and pulse metrology chains | 2003 | 12 |
| 17 | 2002 | 35 | |
| 18 | Experimental analysis and electro-thermal simulation of low- and high-voltage ESD protection bipolar devices in a Silicon-On-Insulator Bipolar-CMOS-DMOS technology | 2001 | 2 |
| 19 | 1987 | 5 | |
| 20 | 1986 | 71 |
About A. Andreini
A. Andreini is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Biomaterials, having authored 38 papers that have together received 276 indexed citations. Recurring topics across this work include Electrostatic Discharge in Electronics (31 papers), Integrated Circuits and Semiconductor Failure Analysis (19 papers), Semiconductor materials and devices (17 papers), Advancements in Semiconductor Devices and Circuit Design (12 papers), Silicon Carbide Semiconductor Technologies (11 papers), Electromagnetic Compatibility and Noise Suppression (9 papers), Electronic Packaging and Soldering Technologies (3 papers) and Copper Interconnects and Reliability (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (270 citations), Hardware and Architecture (10 citations) and Biomedical Engineering (21 citations). A. Andreini has collaborated with scholars based in Italy, Switzerland and Germany. Frequent co-authors include C. Contiero, P. Galbiati, Heinrich Wolf, Horst Gieser, W. Wilkening, Joost Willemen, Gaudenzio Meneghesso, E. Gornik, H. Reichl and Wolfgang Stadler. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Device and Materials Reliability, Journal of Electrostatics, Journal of Micromechanics and Microengineering and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.