F. Wulff
Impact in
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in ⓘ
-
- Electronic Packaging and Soldering Technologies 20
- 3D IC and TSV technologies 11
-
- Aluminum Alloys Composites Properties 8
- Metal Forming Simulation Techniques 3
- Co-authors
- C.D. Breach (23 shared papers)Saraswati Saraswati (5 shared papers)Subodh G. Mhaisalkar (6 shared papers)Thirumany Sritharan (3 shared papers)Christian Wong (6 shared papers)Chen Xu (1 shared paper)Suresh Kumar (1 shared paper)Max Poech (1 shared paper)
- Journals
- Thin Solid Films (5 papers)Microelectronics Reliability (4 papers)Journal of Alloys and Compounds (1 paper)Journal of Materials Science (1 paper)Journal of materials research/Pratt's guide to venture capital sources (1 paper)
- Partner nations
- SingaporeGermanySouth Korea
In The Last Decade
F. Wulff
27 papers receiving 509 citations
Peers
Comparison fields: 5 of 36
- Mechanical Engineering 312
- Electrical and Electronic Engineering 410
- Mechanics of Materials 133
- Electronic, Optical and Magnetic Materials 71
- General Materials Science 11
Countries citing papers authored by F. Wulff
This map shows the geographic impact of F. Wulff's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by F. Wulff with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites F. Wulff more than expected).
Fields of papers citing papers by F. Wulff
This network shows the impact of papers produced by F. Wulff. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by F. Wulff. The network helps show where F. Wulff may publish in the future.
Co-authors
The 12 scholars most cited alongside F. Wulff, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 90 | |
| 2 | 2009 | 81 | |
| 3 | 2005 | 77 | |
| 4 | 2006 | 42 | |
| 5 | 2006 | 28 | |
| 6 | 2010 | 24 | |
| 7 | 2007 | 23 | |
| 8 | 2004 | 22 | |
| 9 | 2003 | 20 | |
| 10 | 2009 | 18 | |
| 11 | 2005 | 15 | |
| 12 | 2006 | 14 | |
| 13 | 2004 | 14 | |
| 14 | 2005 | 14 | |
| 15 | 2006 | 10 | |
| 16 | 2006 | 8 | |
| 17 | 1995 | 8 | |
| 18 | Influence of Bonding Conditions on Degradation of Small Ball Bonds due to Intermetallic Phase (ip) Growth | 1999 | 8 |
| 19 | 2004 | 8 | |
| 20 | 2005 | 8 |
About F. Wulff
F. Wulff is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Mechanics of Materials and Atomic and Molecular Physics, and Optics, having authored 29 papers that have together received 566 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (11 papers), Aluminum Alloys Composites Properties (8 papers), Microstructure and mechanical properties (5 papers), Aluminum Alloy Microstructure Properties (4 papers), Metal Forming Simulation Techniques (3 papers), Metal and Thin Film Mechanics (3 papers) and Copper Interconnects and Reliability (3 papers). The work is most often cited by research in Mechanical Engineering (312 citations), Electrical and Electronic Engineering (410 citations), Mechanics of Materials (133 citations), Electronic, Optical and Magnetic Materials (71 citations) and General Materials Science (11 citations). F. Wulff has collaborated with scholars based in Singapore, Germany and South Korea. Frequent co-authors include C.D. Breach, Saraswati Saraswati, Subodh G. Mhaisalkar, Thirumany Sritharan, Christian Wong, Chen Xu, Suresh Kumar, Max Poech, Sheng Chew and Chaobin He. Their work appears in journals such as Thin Solid Films, Microelectronics Reliability, Journal of Alloys and Compounds, Journal of Materials Science and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.