F. Wulff

698 total citations
29 papers, 566 citations indexed

About

F. Wulff is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, F. Wulff has authored 29 papers receiving a total of 566 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 7 papers in Materials Chemistry. Recurrent topics in F. Wulff's work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (11 papers) and Aluminum Alloys Composites Properties (8 papers). F. Wulff is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (11 papers) and Aluminum Alloys Composites Properties (8 papers). F. Wulff collaborates with scholars based in Singapore, Germany and South Korea. F. Wulff's co-authors include C.D. Breach, Saraswati Saraswati, Subodh G. Mhaisalkar, Thirumany Sritharan, Christian Wong, Chen Xu, Suresh Kumar, Max Poech, Sheng Chew and Tingting Lin and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Journal of Alloys and Compounds.

In The Last Decade

F. Wulff

27 papers receiving 509 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
F. Wulff Singapore	14	410	312	133	98	71	29	566
C. Liu United Kingdom	8	282 0.7×	285 0.9×	57 0.4×	118 1.2×	66 0.9×	20	478
G.T. Galyon United States	9	424 1.0×	243 0.8×	54 0.4×	77 0.8×	101 1.4×	15	488
Minghui Lin United States	9	322 0.8×	166 0.5×	145 1.1×	96 1.0×	139 2.0×	18	471
Han-wen Lin Taiwan	6	533 1.3×	240 0.8×	102 0.8×	190 1.9×	260 3.7×	9	652
Chia-Ling Lu Taiwan	7	482 1.2×	232 0.7×	90 0.7×	188 1.9×	228 3.2×	8	587
Valery Konchits Belarus	7	167 0.4×	350 1.1×	248 1.9×	69 0.7×	29 0.4×	16	496
Ruyu Tian China	14	374 0.9×	374 1.2×	63 0.5×	73 0.7×	33 0.5×	30	563
Hsiang‐Yao Hsiao Taiwan	9	736 1.8×	379 1.2×	123 0.9×	234 2.4×	298 4.2×	10	888
Richard C. Blish United States	14	335 0.8×	120 0.4×	68 0.5×	95 1.0×	64 0.9×	33	441

Countries citing papers authored by F. Wulff

Since Specialization

Citations

This map shows the geographic impact of F. Wulff's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by F. Wulff with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites F. Wulff more than expected).

Fields of papers citing papers by F. Wulff

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by F. Wulff. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by F. Wulff. The network helps show where F. Wulff may publish in the future.

Co-authorship network of co-authors of F. Wulff

This figure shows the co-authorship network connecting the top 25 collaborators of F. Wulff. A scholar is included among the top collaborators of F. Wulff based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with F. Wulff. F. Wulff is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Wulff, F., et al.. (2010). Reliability of palladium coated copper wire. 32. 343–348. 24 indexed citations

Breach, C.D. & F. Wulff. (2009). Intermetallic growth in gold ball bonds aged at 175°C: comparison between two 4N wires of different chemistry. Gold bulletin. 42(2). 92–105. 18 indexed citations

Breach, C.D. & F. Wulff. (2008). The Materials Science of Ballbonding: A Brief Overview. 52. 778–788. 4 indexed citations

Wong, Christian, et al.. (2007). Strain rate sensitivity and Hall–Petch behavior of ultrafine-grained gold wires. Thin Solid Films. 516(16). 5376–5380. 23 indexed citations

Saraswati, Saraswati, et al.. (2006). High Temperature Storage (HTS) Performance of Copper Ball Bonding Wires. 2. 602–607. 28 indexed citations

Wulff, F. & C.D. Breach. (2006). Measurement of gold ballbond intermetallic coverage. Gold bulletin. 39(4). 175–184. 10 indexed citations

Wulff, F., et al.. (2006). Oxidation of Au4Al in gold ballbonds. Materials Letters. 61(2). 452–456. 8 indexed citations

Sritharan, Thirumany, et al.. (2006). Cyclic loading as an extended nanoindentation technique. Materials Science and Engineering A. 423(1-2). 14–18. 42 indexed citations

Breach, C.D. & F. Wulff. (2006). Oxidation of Au4Al in un-moulded gold ballbonds after high temperature storage (HTS) in air at 175°C. Microelectronics Reliability. 46(12). 2112–2121. 14 indexed citations

10.

Wulff, F., et al.. (2006). Bondability, moldability, and reliability of very-long, multi-height Au bonding wires. 531–538. 4 indexed citations

11.

Wong, Christian, et al.. (2006). Doping-induced simultaneous improvement of strength and ductility in ultrafine grained gold wires. Journal of materials research/Pratt's guide to venture capital sources. 21(9). 2345–2353. 2 indexed citations

12.

Wong, Christian, et al.. (2005). Effects of calcium on the mechanical properties of ultra-fine grained gold wires. Journal of Alloys and Compounds. 415(1-2). 193–197. 7 indexed citations

13.

Wulff, F., et al.. (2005). Characterisation of intermetallic growth in copper and gold ball bonds on aluminium metallization. 348–353. 77 indexed citations

14.

Saraswati, Saraswati, et al.. (2005). Looping behaviour of gold ballbonding wire. 723–728. 14 indexed citations

15.

Xu, Chen, C.D. Breach, Thirumany Sritharan, F. Wulff, & Subodh G. Mhaisalkar. (2004). Oxidation of bulk Au–Al intermetallics. Thin Solid Films. 462-463. 357–362. 22 indexed citations

16.

Breach, C.D., et al.. (2004). Degradation of the Au4Al compound in gold ballbonds during isothermal aging in air at 175 °C. Journal of Materials Science. 39(19). 6125–6128. 14 indexed citations

17.

Breach, C.D., et al.. (2004). Mechanical properties and microstructure of Ca-doped gold bonding wire. 25. 569–573.

18.

Wulff, F., et al.. (2003). Crystallographic texture of drawn gold bonding wires using electron backscattered diffraction (EBSD). Journal of Materials Science Letters. 22(19). 1373–1376. 20 indexed citations

19.

Kumar, Suresh, et al.. (1999). Influence of Bonding Conditions on Degradation of Small Ball Bonds due to Intermetallic Phase (ip) Growth. 3830. 403–408. 8 indexed citations

20.

Poech, Max, et al.. (1995). Failure Analysis of Aluminum Wire Bonds in High Power Igbt Modules. MRS Proceedings. 390. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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