H.K. Kim

424 total citations
12 papers, 344 citations indexed

About

H.K. Kim is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, H.K. Kim has authored 12 papers receiving a total of 344 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Mechanical Engineering, 4 papers in Electrical and Electronic Engineering and 4 papers in Materials Chemistry. Recurrent topics in H.K. Kim's work include Intermetallics and Advanced Alloy Properties (6 papers), High Temperature Alloys and Creep (4 papers) and Electronic Packaging and Soldering Technologies (3 papers). H.K. Kim is often cited by papers focused on Intermetallics and Advanced Alloy Properties (6 papers), High Temperature Alloys and Creep (4 papers) and Electronic Packaging and Soldering Technologies (3 papers). H.K. Kim collaborates with scholars based in United States, South Korea and Japan. H.K. Kim's co-authors include F.G. Shi, Kikuo Okuyama, Frank G. Shi, James C. Earthman, J. Wolfenstine, Falko Kuester, Enrique J. Lavernia, Sung-Jin Kim, Soon Hyung Hong and Robert McClelland and has published in prestigious journals such as Materials Science and Engineering A, Journal of materials research/Pratt's guide to venture capital sources and Materials Letters.

In The Last Decade

H.K. Kim

12 papers receiving 328 citations

Peers

H.K. Kim

EEE

MC

BE

ME

MM

R. E. Acosta United States

M. Jaegle Germany

Shigeki Tsuchitani Japan

R. Strümpler Switzerland

Qinzhi Xu China

Langquan Shui China

Honggang Zhang China

Taehyun Sung South Korea

Aicha Elshabini United States

Steven J. Gross United States

R. E. Acosta United States

H.K. Kim

339 ×2.3

EEE

86 ×0.6

MC

150 ×1.2

BE

69 ×0.8

ME

58 ×1.0

MM

Citations per year, relative to H.K. Kim H.K. Kim (= 1×) peers R. E. Acosta

Countries citing papers authored by H.K. Kim

Since Specialization

Citations

This map shows the geographic impact of H.K. Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H.K. Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H.K. Kim more than expected).

Fields of papers citing papers by H.K. Kim

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H.K. Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H.K. Kim. The network helps show where H.K. Kim may publish in the future.

Co-authorship network of co-authors of H.K. Kim

This figure shows the co-authorship network connecting the top 25 collaborators of H.K. Kim. A scholar is included among the top collaborators of H.K. Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H.K. Kim. H.K. Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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12 of 12 papers shown

1.

Kim, H.K., et al.. (2007). Dynamic Deformation and High Velocity Impact Behaviors of Ti-6Al-4V Alloys. Materials science forum. 539-543. 2269–2274. 6 indexed citations

2.

Kim, Sung-Jin, Falko Kuester, & H.K. Kim. (2003). A global timestamp-based scalable framework for Multi-player Online Games. 4297. 2–10. 7 indexed citations

3.

Kim, H.K. & F.G. Shi. (2001). Thickness dependent dielectric strength of a low-permittivity dielectric film. IEEE Transactions on Dielectrics and Electrical Insulation. 8(2). 248–252. 119 indexed citations

4.

Kim, H.K. & F.G. Shi. (2001). Thickness-dependent thermal reliability of low-dielectric constant polycrystalline PTFE submicron dielectric thin films. Microelectronics Journal. 32(3). 215–219. 12 indexed citations

5.

Kim, H.K. & F.G. Shi. (2001). Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density. Microelectronics Journal. 32(4). 315–321. 70 indexed citations

6.

Shi, Frank G., et al.. (1999). Size-dependent electrical constriction resistance for contacts of arbitrary size: from Sharvin to Holm limits. Materials Science in Semiconductor Processing. 2(4). 321–327. 94 indexed citations

7.

Wolfenstine, J., H.K. Kim, & James C. Earthman. (1995). Elevated-temperature deformation mechanisms in Ni3Al. Materials Science and Engineering A. 192-193. 811–816. 4 indexed citations

8.

Kim, H.K. & James C. Earthman. (1994). High temperature deformation and fracture mechanisms in a dendritic Ni3Al alloy. Acta Metallurgica et Materialia. 42(3). 679–687. 6 indexed citations

9.

Wolfenstine, J., H.K. Kim, & James C. Earthman. (1993). High temperature creep transitions in single crystalline Ni₃Al(Ta, B). Journal of materials research/Pratt's guide to venture capital sources. 8(10). 2510–2514. 3 indexed citations

10.

Kim, H.K., Enrique J. Lavernia, & James C. Earthman. (1992). Mechanisms of intergranular cavity growth in Ni3Al (Zr, B). Acta Metallurgica et Materialia. 40(8). 1933–1943. 7 indexed citations

11.

Wolfenstine, J., H.K. Kim, & Robert McClelland. (1992). Dislocation substructure developed during creep of ceramic solid solution alloys. Materials Letters. 14(4). 237–239. 1 indexed citations

12.

Wolfenstine, J., H.K. Kim, & James C. Earthman. (1992). High temperature creep behavior of polycrystalline Ni3Al(Zr,B). Scripta Metallurgica et Materialia. 26(12). 1823–1828. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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