IEEE Transactions on Electronics Packaging Manufacturing · 1×
×0.86k/7kEEE
×1.44k/3kME
×1.72k/1kMM
×2.71k/439AMPO
×0.61k/2kBE
Citations per year
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
Countries where authors publish in IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Since Specialization
Citations
This map shows the geographic impact of research published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites IEEE Transactions on Components Packaging and Manufacturing Technology Part A more than expected).
Fields of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A
This network shows the impact of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A.
About IEEE Transactions on Components Packaging and Manufacturing Technology Part A
The 399 papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A in the last decades have received a total of 9.6k indexed citations . Papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part A usually cover Electrical and Electronic Engineering (270 papers), Mechanical Engineering (170 papers) and Mechanics of Materials (84 papers) specifically the topics of Electronic Packaging and Soldering Technologies (142 papers), 3D IC and TSV technologies (75 papers) and Electrical Contact Performance and Analysis (66 papers). The most active scholars publishing in IEEE Transactions on Components Packaging and Manufacturing Technology Part A are Paul G. Slade, E. Suhir, Clemens Lasance, Andrew Kusiak, H.I. Rosten, M. Lindmayer, J.W. McBride, Jesse Galloway, Gábor Harsányi and Avram Bar‐Cohen.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive
bibliographic database. While OpenAlex provides broad and valuable coverage of the global
research landscape, it—like all bibliographic datasets—has inherent limitations. These include
incomplete records, variations in author disambiguation, differences in journal indexing, and
delays in data updates. As a result, some metrics and network relationships displayed in
Rankless may not fully capture the entirety of a scholar's output or impact.