Steffen Wiese

2.1k total citations
152 papers, 1.7k citations indexed

About

Steffen Wiese is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Steffen Wiese has authored 152 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 119 papers in Electrical and Electronic Engineering, 61 papers in Mechanical Engineering and 23 papers in Mechanics of Materials. Recurrent topics in Steffen Wiese's work include Electronic Packaging and Soldering Technologies (107 papers), 3D IC and TSV technologies (57 papers) and Silicon and Solar Cell Technologies (23 papers). Steffen Wiese is often cited by papers focused on Electronic Packaging and Soldering Technologies (107 papers), 3D IC and TSV technologies (57 papers) and Silicon and Solar Cell Technologies (23 papers). Steffen Wiese collaborates with scholars based in Germany, United Kingdom and Poland. Steffen Wiese's co-authors include E. Meusel, K.-J. Wolter, Frank Alexander Kraemer, Klaus‐Jürgen Wolter, Sven Rzepka, M. Roellig, Thorsten Teutenberg, J.N. Lester, C. L. MacLeod and B. Michel and has published in prestigious journals such as Analytical Chemistry, Journal of Chromatography A and Marine Pollution Bulletin.

In The Last Decade

Steffen Wiese

143 papers receiving 1.6k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Steffen Wiese Germany 22 1.3k 698 220 185 174 152 1.7k
Limin He China 25 424 0.3× 588 0.8× 170 0.8× 932 5.0× 301 1.7× 100 2.0k
Ziyu Wang United States 24 198 0.2× 354 0.5× 105 0.5× 380 2.1× 255 1.5× 110 1.8k
Shinji Kobayashi Japan 21 274 0.2× 153 0.2× 74 0.3× 66 0.4× 288 1.7× 108 1.3k
Xiao Xiao 12 162 0.1× 254 0.4× 98 0.4× 63 0.3× 132 0.8× 201 842
Julien Blondeau Belgium 18 141 0.1× 199 0.3× 69 0.3× 90 0.5× 287 1.6× 75 870
Chuan Lu China 19 190 0.1× 270 0.4× 167 0.8× 141 0.8× 135 0.8× 86 1.1k
Svend Tollak Munkejord Norway 25 220 0.2× 654 0.9× 131 0.6× 236 1.3× 437 2.5× 75 1.8k
Ho Teng Japan 29 330 0.3× 751 1.1× 150 0.7× 187 1.0× 441 2.5× 80 2.2k
Patrizio Massoli Italy 24 331 0.3× 210 0.3× 76 0.3× 268 1.4× 820 4.7× 78 1.7k
Yuanqing Wang China 14 707 0.6× 121 0.2× 333 1.5× 430 2.3× 183 1.1× 53 1.4k

Countries citing papers authored by Steffen Wiese

Since Specialization
Citations

This map shows the geographic impact of Steffen Wiese's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Steffen Wiese with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Steffen Wiese more than expected).

Fields of papers citing papers by Steffen Wiese

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Steffen Wiese. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Steffen Wiese. The network helps show where Steffen Wiese may publish in the future.

Co-authorship network of co-authors of Steffen Wiese

This figure shows the co-authorship network connecting the top 25 collaborators of Steffen Wiese. A scholar is included among the top collaborators of Steffen Wiese based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Steffen Wiese. Steffen Wiese is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Jaziri, Nesrine, et al.. (2025). Impact of Bonding Pressure on the Reactive Bonding of LTCC Substrates. Micromachines. 16(3). 321–321.
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Wiese, Steffen, et al.. (2024). LTCC With Temperature Sensor Array for Monitoring of Reactive Die Bond Processes–Design Optimization Using CFD. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(1). 122–129.
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Wiese, Steffen, et al.. (2024). Bending Experiments on QFN Components. 1 indexed citations
7.
Wiese, Steffen, et al.. (2023). FE-Analysis of Deformation State during a Four-Point Bending Experiment on Soldered MLCCs. 1–5. 2 indexed citations
8.
Wiese, Steffen, et al.. (2017). The onset of plastic flow in copper materials used for rigid and flexible PCB. 1–5. 6 indexed citations
9.
Müller, Jens, et al.. (2015). Electrical, thermal and mechanical characterization of low temperature, pressure-less sintered silver bond interfaces. European Microelectronics and Packaging Conference. 3 indexed citations
10.
Wiese, Steffen, et al.. (2015). A crack propagation analysis of multilayer ceramic capacitors. European Microelectronics and Packaging Conference. 1–4. 3 indexed citations
11.
Kraemer, Frank Alexander & Steffen Wiese. (2014). FEM stress analysis of various solar module concepts under temperature cycling load. 1–8. 5 indexed citations
12.
Kraemer, Frank Alexander, et al.. (2012). Analysis of Mechanical Problems of String-Ribbon Interconnections in Photovoltaic Modules. EU PVSEC. 1162–1164. 1 indexed citations
13.
Wiese, Steffen, et al.. (2011). Mechanical problems of manufacturing processes for photovoltaic modules. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–6. 3 indexed citations
14.
Wiese, Steffen, et al.. (2011). Solidification processes of SnCu, SnAg and SnAgCu solder alloys and interface reactions to charactize solar cell interconnections processes. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–4. 2 indexed citations
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Wiese, Steffen, Thorsten Teutenberg, & Torsten C. Schmidt. (2011). A general strategy for performing temperature-programming in high performance liquid chromatography—Prediction of segmented temperature gradients. Journal of Chromatography A. 1218(39). 6898–6906. 13 indexed citations
17.
Teutenberg, Thorsten, Steffen Wiese, Peter Wagner, & Jürgen Gmehling. (2009). High-temperature liquid chromatography. Part III: Determination of the static permittivities of pure solvents and binary solvent mixtures—Implications for liquid chromatographic separations. Journal of Chromatography A. 1216(48). 8480–8487. 37 indexed citations
18.
Teutenberg, Thorsten, Steffen Wiese, Peter Wagner, & Jürgen Gmehling. (2009). High-temperature liquid chromatography. Part II: Determination of the viscosities of binary solvent mixtures—Implications for liquid chromatographic separations. Journal of Chromatography A. 1216(48). 8470–8479. 25 indexed citations
19.
Wiese, Steffen, et al.. (2007). The Size Effect on the Creep Properties of SnAgCu-Solder Alloys. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 548–557. 9 indexed citations
20.
Wiese, Steffen, et al.. (2007). The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties. 1–8. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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