Steffen Wiese
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 5%
- Mechanics of Materials top 5%
- Aerospace Engineering top 10%
- Biomedical Engineering
- Co-authors
- E. MeuselK.-J. WolterFrank Alexander KraemerKlaus‐Jürgen WolterSven RzepkaM. RoelligThorsten TeutenbergJ.N. Lester
- Topics
- Electronic Packaging and Soldering Technologies (107 papers)3D IC and TSV technologies (57 papers)Silicon and Solar Cell Technologies (23 papers)
- Partner nations
- GermanyUnited KingdomPoland
In The Last Decade
Steffen Wiese
143 papers receiving 1.6k citations
Peers
Comparison fields: 5 of 88
- Electrical and Electronic Engineering 1.3k
- Mechanical Engineering 698
- Mechanics of Materials 220
- Aerospace Engineering 185
- Biomedical Engineering 174
Countries citing papers authored by Steffen Wiese
This map shows the geographic impact of Steffen Wiese's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Steffen Wiese with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Steffen Wiese more than expected).
Fields of papers citing papers by Steffen Wiese
This network shows the impact of papers produced by Steffen Wiese. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Steffen Wiese. The network helps show where Steffen Wiese may publish in the future.
Co-authorship network of co-authors of Steffen Wiese
This figure shows the co-authorship network connecting the top 25 collaborators of Steffen Wiese. A scholar is included among the top collaborators of Steffen Wiese based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Steffen Wiese. Steffen Wiese is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 0 | |
| 4 | 1 | |
| 5 | 0 | |
| 6 | 1 | |
| 7 | 2 | |
| 8 | 6 | |
| 9 | Electrical, thermal and mechanical characterization of low temperature, pressure-less sintered silver bond interfaces | 3 |
| 10 | A crack propagation analysis of multilayer ceramic capacitors | 3 |
| 11 | 5 | |
| 12 | 1 | |
| 13 | Mechanical problems of manufacturing processes for photovoltaic modules | 3 |
| 14 | Solidification processes of SnCu, SnAg and SnAgCu solder alloys and interface reactions to charactize solar cell interconnections processes | 2 |
| 15 | 10 | |
| 16 | 13 | |
| 17 | 37 | |
| 18 | 25 | |
| 19 | 9 | |
| 20 | 2 |
About Steffen Wiese
Steffen Wiese is a scholar working on General Materials Science, Electrical and Electronic Engineering and Ceramics and Composites, having authored 152 papers that have together received 1.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (107 papers), 3D IC and TSV technologies (57 papers) and Silicon and Solar Cell Technologies (23 papers). The work is most often cited by research in General Materials Science (71 citations), Electrical and Electronic Engineering (1.3k citations) and Mechanical Engineering (698 citations). Steffen Wiese has collaborated with scholars based in Germany, United Kingdom and Poland. Frequent co-authors include E. Meusel, K.-J. Wolter, Frank Alexander Kraemer, Klaus‐Jürgen Wolter, Sven Rzepka, M. Roellig, Thorsten Teutenberg, J.N. Lester, C. L. MacLeod and B. Michel. Their work appears in journals such as Analytical Chemistry, Journal of Chromatography A and Marine Pollution Bulletin.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.