Dimeji Ibitayo

547 total citations
34 papers, 461 citations indexed

About

Dimeji Ibitayo is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Dimeji Ibitayo has authored 34 papers receiving a total of 461 indexed citations (citations by other indexed papers that have themselves been cited), including 28 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 6 papers in Materials Chemistry. Recurrent topics in Dimeji Ibitayo's work include Silicon Carbide Semiconductor Technologies (15 papers), Electronic Packaging and Soldering Technologies (12 papers) and Heat Transfer and Optimization (7 papers). Dimeji Ibitayo is often cited by papers focused on Silicon Carbide Semiconductor Technologies (15 papers), Electronic Packaging and Soldering Technologies (12 papers) and Heat Transfer and Optimization (7 papers). Dimeji Ibitayo collaborates with scholars based in United States, Puerto Rico and China. Dimeji Ibitayo's co-authors include Guo‐Quan Lu, Xu Chen, Damian Urciuoli, Yunhui Mei, Shufang Luo, Bruce Geil, Lauren Boteler, Nicholas R. Jankowski, Thomas Salem and R.I. Rodriguez and has published in prestigious journals such as IEEE Transactions on Power Electronics, International Journal of Heat and Mass Transfer and IEEE Transactions on Instrumentation and Measurement.

In The Last Decade

Dimeji Ibitayo

34 papers receiving 447 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Dimeji Ibitayo United States 14 326 224 91 37 32 34 461
Michael D. Glover United States 12 726 2.2× 209 0.9× 53 0.6× 40 1.1× 21 0.7× 34 773
Pierre‐Olivier Jeannin France 17 729 2.2× 114 0.5× 107 1.2× 59 1.6× 11 0.3× 40 836
Stéphane Azzopardi France 14 605 1.9× 234 1.0× 44 0.5× 140 3.8× 36 1.1× 64 754
Boon Long Lau Singapore 12 262 0.8× 290 1.3× 75 0.8× 16 0.4× 8 0.3× 60 508
Jeremy Hall United Kingdom 13 168 0.5× 301 1.3× 109 1.2× 174 4.7× 26 0.8× 38 485
Damian Urciuoli United States 16 485 1.5× 133 0.6× 63 0.7× 51 1.4× 16 0.5× 43 599
Kenny C. Otiaba United Kingdom 9 253 0.8× 189 0.8× 141 1.5× 8 0.2× 15 0.5× 16 405
Jiwei Fan United States 12 176 0.5× 181 0.8× 156 1.7× 45 1.2× 6 0.2× 21 407
Alexander B. Lostetter United States 16 949 2.9× 145 0.6× 64 0.7× 26 0.7× 22 0.7× 46 1.0k
Gerd Schlottig Switzerland 13 378 1.2× 356 1.6× 113 1.2× 30 0.8× 8 0.3× 58 684

Countries citing papers authored by Dimeji Ibitayo

Since Specialization
Citations

This map shows the geographic impact of Dimeji Ibitayo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dimeji Ibitayo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dimeji Ibitayo more than expected).

Fields of papers citing papers by Dimeji Ibitayo

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dimeji Ibitayo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dimeji Ibitayo. The network helps show where Dimeji Ibitayo may publish in the future.

Co-authorship network of co-authors of Dimeji Ibitayo

This figure shows the co-authorship network connecting the top 25 collaborators of Dimeji Ibitayo. A scholar is included among the top collaborators of Dimeji Ibitayo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dimeji Ibitayo. Dimeji Ibitayo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
2.
Boteler, Lauren, et al.. (2017). Experimental evaluation of metallic phase change materials for thermal transient mitigation. International Journal of Heat and Mass Transfer. 116. 512–519. 56 indexed citations
3.
Pahinkar, Darshan G., et al.. (2017). Efficient single-phase cooling techniques for durable power electronics module. 84. 346–351. 1 indexed citations
4.
Urciuoli, Damian, et al.. (2016). A compact 100-A, 850-V, silicon carbide solid-state DC circuit breaker. Zenodo (CERN European Organization for Nuclear Research). 1–5. 25 indexed citations
5.
Urciuoli, Damian, et al.. (2015). Performance of a 1-kV, Silicon Carbide Avalanche Breakdown Diode. IEEE Transactions on Power Electronics. 30(9). 4643–4645. 10 indexed citations
6.
7.
Mei, Yunhui, et al.. (2011). Migration of sintered nanosilver die-attach material on alumina substrate at high temperatures. 57. 1–6. 14 indexed citations
8.
Rodriguez, R.I., et al.. (2011). High Temperature Die Attach by Low Temperature Solid-Liquid Interdiffusion. 9–17. 1 indexed citations
9.
Mei, Yunhui, Guo‐Quan Lu, Xu Chen, et al.. (2011). Investigation of Post-Etch Copper Residue on Direct Bonded Copper (DBC) Substrates. Journal of Electronic Materials. 40(10). 2119–2125. 30 indexed citations
10.
Boteler, Lauren, et al.. (2010). Thermal performance of a dual 1.2 kV, 400 a silicon-carbide MOSFET power module. 170–175. 13 indexed citations
11.
Mei, Yunhui, et al.. (2010). “Migration of Sintered Nanosilver Die-attach Material on Alumina Substrate at High Temperatures”. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(HITEC). 26–31. 6 indexed citations
12.
Urciuoli, Damian, Ronald Green, Aivars J. Lelis, & Dimeji Ibitayo. (2010). Performance of a dual, 1200 V, 400 A, silicon-carbide power MOSFET module. 3303–3310. 18 indexed citations
13.
Green, Ronald, et al.. (2008). Evaluation of 4H–SiC DMOSFETs for High–Power Electronics Applications. Materials science forum. 600-603. 1135–1138. 2 indexed citations
14.
Ibitayo, Dimeji, et al.. (2008). Reliability Assessment of Lead-Free Universal Solder for Direct Bonding in Power Electronics Packaging. 319. 1364–1368. 1 indexed citations
15.
Jankowski, Nicholas R., et al.. (2007). Manifold Microchannel Cooler for Direct Backside Liquid Cooling of SiC Power Devices. 285–292. 22 indexed citations
16.
Salem, Thomas, Dimeji Ibitayo, & Bruce Geil. (2006). A Technique for Die Surface Temperature Measurement of High-Voltage Power Electronic Components using Coated Thermocouple Probes. Conference proceedings - IEEE Instrumentation/Measurement Technology Conference. 651–654. 2 indexed citations
17.
Salem, Thomas, Dimeji Ibitayo, & Bruce Geil. (2006). Calibration of an Infrared Camera for Thermal Characterization of High Voltage Power Electronic Components. 2005 IEEE Instrumentationand Measurement Technology Conference Proceedings. 2. 829–833. 13 indexed citations
18.
Geil, Bruce, et al.. (2005). Thermal and electrical evaluation of SiC GTOs for pulsed power applications. IEEE Transactions on Plasma Science. 33(4). 1226–1234. 8 indexed citations
19.
Ibitayo, Dimeji. (2005). Infrared Imaging of Power Electronic Components. 1 indexed citations
20.
Bayne, Stephen & Dimeji Ibitayo. (2004). Evaluation of SiC GTOs for pulse power switching. 1. 135–138. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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