Michael D. Glover

963 total citations
34 papers, 773 citations indexed

About

Michael D. Glover is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Michael D. Glover has authored 34 papers receiving a total of 773 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Mechanics of Materials. Recurrent topics in Michael D. Glover's work include Silicon Carbide Semiconductor Technologies (16 papers), Electromagnetic Compatibility and Noise Suppression (15 papers) and 3D IC and TSV technologies (14 papers). Michael D. Glover is often cited by papers focused on Silicon Carbide Semiconductor Technologies (16 papers), Electromagnetic Compatibility and Noise Suppression (15 papers) and 3D IC and TSV technologies (14 papers). Michael D. Glover collaborates with scholars based in United States, China and Switzerland. Michael D. Glover's co-authors include H. Alan Mantooth, Paul Shepherd, Sang Won Yoon, Koji Shiozaki, Dehong Xu, Nan Zhu, Min Chen, S.S. Frank, Bret Whitaker and Alan Mantooth and has published in prestigious journals such as IEEE Transactions on Industrial Electronics, IEEE Transactions on Power Electronics and Journal of Micromechanics and Microengineering.

In The Last Decade

Michael D. Glover

33 papers receiving 731 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Michael D. Glover United States 12 726 209 53 52 40 34 773
Damian Urciuoli United States 16 485 0.7× 133 0.6× 63 1.2× 27 0.5× 51 1.3× 43 599
Dimeji Ibitayo United States 14 326 0.4× 224 1.1× 91 1.7× 19 0.4× 37 0.9× 34 461
Pierre‐Olivier Jeannin France 17 729 1.0× 114 0.5× 107 2.0× 66 1.3× 59 1.5× 40 836
Erping Deng China 18 671 0.9× 202 1.0× 71 1.3× 23 0.4× 13 0.3× 59 746
Jose Ortiz Gonzalez United Kingdom 18 1.4k 1.9× 113 0.5× 33 0.6× 99 1.9× 30 0.8× 98 1.4k
Ljubisa Stevanovic United States 15 622 0.9× 100 0.5× 21 0.4× 18 0.3× 21 0.5× 35 680
Koji Shiozaki Japan 10 644 0.9× 162 0.8× 35 0.7× 69 1.3× 55 1.4× 22 668
Alexander B. Lostetter United States 16 949 1.3× 145 0.7× 64 1.2× 30 0.6× 26 0.7× 46 1.0k
Uwe Scheuermann Germany 18 1.6k 2.1× 184 0.9× 68 1.3× 48 0.9× 48 1.2× 29 1.6k
Huaping Jiang China 19 1.2k 1.6× 112 0.5× 29 0.5× 88 1.7× 56 1.4× 77 1.2k

Countries citing papers authored by Michael D. Glover

Since Specialization
Citations

This map shows the geographic impact of Michael D. Glover's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Michael D. Glover with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Michael D. Glover more than expected).

Fields of papers citing papers by Michael D. Glover

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Michael D. Glover. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Michael D. Glover. The network helps show where Michael D. Glover may publish in the future.

Co-authorship network of co-authors of Michael D. Glover

This figure shows the co-authorship network connecting the top 25 collaborators of Michael D. Glover. A scholar is included among the top collaborators of Michael D. Glover based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Michael D. Glover. Michael D. Glover is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Glover, Michael D., et al.. (2017). 3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices. IEEE Transactions on Power Electronics. 33(10). 8553–8564. 59 indexed citations
2.
Zhu, Nan, H. Alan Mantooth, Dehong Xu, Min Chen, & Michael D. Glover. (2017). A Solution to Press-Pack Packaging of SiC MOSFETS. IEEE Transactions on Industrial Electronics. 64(10). 8224–8234. 84 indexed citations
3.
Glover, Michael D., et al.. (2016). Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications. Journal of Microelectronics and Electronic Packaging. 13(1). 6–16. 3 indexed citations
4.
Glover, Michael D., et al.. (2016). Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power Modules. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2016(HiTEC). 159–168. 3 indexed citations
5.
Glover, Michael D., et al.. (2016). Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding. 194–199. 20 indexed citations
6.
Glover, Michael D., et al.. (2016). The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2016(CICMT). 65–72. 4 indexed citations
7.
Glover, Michael D., et al.. (2015). Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature Applications. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2015(HiTEN). 37–49. 2 indexed citations
8.
9.
Decrossas, Emmanuel, et al.. (2015). High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(3). 307–313. 20 indexed citations
10.
Ericson, M.N., S.S. Frank, C.L. Britton, et al.. (2014). An integrated gate driver in 4H-SiC for power converter applications. 66–69. 6 indexed citations
11.
Frank, S.S., C.L. Britton, Laura D. Marlino, et al.. (2014). A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications. 414–417. 45 indexed citations
12.
Mantooth, H. Alan, Michael D. Glover, & Paul Shepherd. (2014). Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems. IEEE Journal of Emerging and Selected Topics in Power Electronics. 2(3). 374–385. 204 indexed citations
13.
Whitaker, Bret, Zach Cole, Brandon Passmore, et al.. (2014). High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications. 36–40. 22 indexed citations
14.
Kuhn, W.B., et al.. (2014). Metal Layer Losses in Thin-Film Microstrip on LTCC. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(12). 1956–1962. 9 indexed citations
15.
Decrossas, Emmanuel, et al.. (2013). Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications. European Microwave Conference. 104–107. 5 indexed citations
16.
Ericson, Nance, S.S. Frank, C.L. Britton, et al.. (2013). A 4H Silicon Carbide Gate Buffer for Integrated Power Systems. IEEE Transactions on Power Electronics. 29(2). 539–542. 38 indexed citations
17.
Liu, Yang, et al.. (2011). Integration of Tantalum Pentoxide Capacitors With Through-Silicon Vias. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(10). 1508–1516. 5 indexed citations
18.
Ang, Simon S., et al.. (2002). Miniaturizing power electronics using multi-chip module technology. 329–333. 1 indexed citations
19.
Schaper, L.W., et al.. (2001). Comparison of the Interconnected Mesh Power System (IMPS) and buried stripline interconnect topologies. 58–63. 3 indexed citations
20.
Glover, Michael D., J.P. Parkerson, & L.W. Schaper. (1996). a Signal Noise Comparison of the Interconnected Mesh Power System (imps) with a Standard Four-Layer Mcm Topology. 2794. 216. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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