Lauren Boteler

582 total citations
41 papers, 468 citations indexed

About

Lauren Boteler is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Lauren Boteler has authored 41 papers receiving a total of 468 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Mechanical Engineering, 23 papers in Electrical and Electronic Engineering and 16 papers in Materials Chemistry. Recurrent topics in Lauren Boteler's work include Heat Transfer and Optimization (15 papers), Silicon Carbide Semiconductor Technologies (14 papers) and Thermal properties of materials (12 papers). Lauren Boteler is often cited by papers focused on Heat Transfer and Optimization (15 papers), Silicon Carbide Semiconductor Technologies (14 papers) and Thermal properties of materials (12 papers). Lauren Boteler collaborates with scholars based in United States and Puerto Rico. Lauren Boteler's co-authors include Nicholas R. Jankowski, Dimeji Ibitayo, Damian Urciuoli, Patrick McCluskey, Brian Morgan, Andrew N. Smith, Morris Berman, S. M. Miner, David Huitink and Iain Kierzewski and has published in prestigious journals such as International Journal of Heat and Mass Transfer, Journal of Heat Transfer and Advanced Engineering Materials.

In The Last Decade

Lauren Boteler

41 papers receiving 455 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Lauren Boteler United States 14 310 193 168 43 41 41 468
Douglas DeVoto United States 14 148 0.5× 405 2.1× 98 0.6× 45 1.0× 33 0.8× 38 533
Andrew B. Geltmacher United States 9 173 0.6× 88 0.5× 204 1.2× 46 1.1× 30 0.7× 19 400
Kenny C. Otiaba United Kingdom 9 189 0.6× 253 1.3× 141 0.8× 18 0.4× 34 0.8× 16 405
G. Zhang Singapore 7 260 0.8× 110 0.6× 262 1.6× 171 4.0× 16 0.4× 8 503
Lei Yuan China 10 79 0.3× 170 0.9× 69 0.4× 37 0.9× 39 1.0× 20 348
Min-Soo Kang South Korea 11 241 0.8× 165 0.9× 56 0.3× 20 0.5× 9 0.2× 39 418
Yufen Gu China 16 406 1.3× 104 0.5× 168 1.0× 31 0.7× 23 0.6× 36 600
Hu Zhang China 6 240 0.8× 50 0.3× 168 1.0× 18 0.4× 21 0.5× 22 373
Yiyi Yang China 12 363 1.2× 76 0.4× 122 0.7× 83 1.9× 47 1.1× 24 510
Doosan Back United States 6 504 1.6× 133 0.7× 92 0.5× 12 0.3× 24 0.6× 7 642

Countries citing papers authored by Lauren Boteler

Since Specialization
Citations

This map shows the geographic impact of Lauren Boteler's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Lauren Boteler with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Lauren Boteler more than expected).

Fields of papers citing papers by Lauren Boteler

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Lauren Boteler. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Lauren Boteler. The network helps show where Lauren Boteler may publish in the future.

Co-authorship network of co-authors of Lauren Boteler

This figure shows the co-authorship network connecting the top 25 collaborators of Lauren Boteler. A scholar is included among the top collaborators of Lauren Boteler based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Lauren Boteler. Lauren Boteler is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Huitink, David, et al.. (2020). A System to Package Perspective on Transient Thermal Management of Electronics. Journal of Electronic Packaging. 142(4). 36 indexed citations
2.
3.
González, L., et al.. (2020). Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles. Journal of Electronic Packaging. 142(3). 3 indexed citations
4.
Boteler, Lauren, et al.. (2019). Integrating Heat Sinks into a 3D Co-Design Network Model for Quick Parametric Analysis. 518–524. 8 indexed citations
5.
Boteler, Lauren, et al.. (2019). Step-by-Step Guide to Determining Experimental Uncertainty in Thin-Film Resistance. 511–517. 1 indexed citations
6.
Boteler, Lauren, et al.. (2019). Understanding Trade-Offs of Phase Change Materials for Transient Thermal Mitigation. 870–877. 15 indexed citations
7.
Boteler, Lauren, et al.. (2019). Thermal Conductivity of Power Semiconductors—When Does It Matter?. 265–271. 13 indexed citations
8.
9.
Shamberger, Patrick J., et al.. (2019). Convergence and Validation in ParaPower: A Design Tool for Phase Change Materials in Electronics Packaging. 878–885. 18 indexed citations
10.
11.
12.
Boteler, Lauren, et al.. (2017). Stacked power module with integrated thermal management. 1–5. 28 indexed citations
13.
Boteler, Lauren, et al.. (2017). Experimental evaluation of metallic phase change materials for thermal transient mitigation. International Journal of Heat and Mass Transfer. 116. 512–519. 56 indexed citations
14.
Boteler, Lauren, et al.. (2017). High voltage stacked diode package with integrated thermal management. 913–920. 10 indexed citations
15.
Warzoha, Ronald J., et al.. (2017). Design considerations for a miniaturized TIM tester with extremely high measurement resolution. 1. 227–236. 1 indexed citations
16.
Lazarus, Nathan, Christopher Meyer, Sarah S. Bedair, et al.. (2013). Thick film oxidation of copper in an electroplated MEMS process. Journal of Micromechanics and Microengineering. 23(6). 65017–65017. 5 indexed citations
17.
Smith, Andrew N., Nicholas R. Jankowski, Lauren Boteler, & Christopher Meyer. (2013). Interfacial Resistance Measurement of High Performance Thermal Interface Materials. 3 indexed citations
18.
Boteler, Lauren & Andrew N. Smith. (2013). 3D Thermal Resistance Network Method for the Design of Highly Integrated Packages. 9 indexed citations
19.
Boteler, Lauren, Nicholas R. Jankowski, Patrick McCluskey, & Brian Morgan. (2012). Numerical investigation and sensitivity analysis of manifold microchannel coolers. International Journal of Heat and Mass Transfer. 55(25-26). 7698–7708. 59 indexed citations
20.
Boteler, Lauren, et al.. (2010). Thermal performance of a dual 1.2 kV, 400 a silicon-carbide MOSFET power module. 170–175. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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